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Timothy M Wrona

from Crystal Lake, IL
Age ~56
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Also known as:
Timothy Alicia Wrona, Timothy L Wrona, Tim M Wrona, Tim L Wrona, Bobby Cantrell
Phone and address:
1770 Moorland Ln, Bull Valley, IL 60014
(815) 444-7640
Related to:
Rachel PiperMaryann A Wrona, 70James Wrona, 51
Connected to:
Annette E Wrona, 52Carianne M Wrona, 48Christopher D Wrona, 43Iwona E Wrona, 44Joann A Wrona, 68Katie Wrona, 58Margaret A Wrona, 82Marty L Wrona, 41Rivki Wrona, 57Sebastian Wrona, 38

Timothy Wrona Phones & Addresses

  • 1770 Moorland Ln, Crystal Lake, IL 60014 (815) 444-7640 (815) 444-7620
  • Collinsville, IL
  • 367 Glen Byrn Ct, Schaumburg, IL 60194 (847) 798-1160
  • 371 Glen Byrn Ct, Schaumburg, IL 60194 (847) 798-1160
  • Streamwood, IL
  • Pana, IL
  • Bartlett, IL
  • Minersville, PA
  • Carbondale, IL
  • 1770 Moorland Ln, Crystal Lake, IL 60014 (217) 891-8363

Work

Position: Sales Occupations

Education

Degree: High school graduate or higher

Emails

t***[email protected]

Business Records

Name / Title
Company / Classification
Phones & Addresses
Timothy M. Wrona
President
T. Wrona Automation
Automation Systems Design
1770 Moorland Ln, Bull Valley, IL 60014

Publications

Us Patents

Snap Install Emi Shields With Protrusions And Electrically-Conductive Members For Attachment To Substrates

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US Patent:
20080106884, May 8, 2008
Filed:
Apr 16, 2007
Appl. No.:
11/735811
Inventors:
Gerald Robert English - Glen Ellyn IL, US
Timothy M. Wrona - Crystal Lake IL, US
International Classification:
H05K 9/00
US Classification:
361818
Abstract:
Various embodiments provide EMI shields for substrates having at least one electrical component disposed thereon. In one embodiment, an EMI shield generally includes a cover having first and second protrusions and at least one electrically-conductive member disposed along an inner side of the cover. The electrically-conductive member may be compressed generally between the substrate and the cover when the substrate is captured generally between the electrically-conductive member and the first protrusion. In addition, a compressive clamping force may be generated by the engagement of the first protrusion with the substrate and the compression of the electrically-conductive member. This compressive clamping force may mechanically retain the cover to the substrate, and also compress the electrically-conductive member against at least one electrically-conductive surface disposed on the substrate, to establish electrical conductivity therebetween that is sufficient for EMI shielding performance.

Frames For Shielding Assemblies And Shielding Assemblies Including The Same

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US Patent:
20200113091, Apr 9, 2020
Filed:
Oct 2, 2019
Appl. No.:
16/591029
Inventors:
- Chesterfield MO, US
Gerald R. ENGLISH - Glen Ellyn IL, US
Timothy M. WRONA - Schaumburg IL, US
Assignee:
Laird Technologies, Inc. - Chesterfield MO
International Classification:
H05K 9/00
H05K 5/00
Abstract:
According to various aspects, exemplary embodiments are disclosed of frames for shielding assemblies. Exemplary embodiments are also disclosed of shielding assemblies including such frames. In exemplary embodiments, a frame for a board level shield (BLS) may include portions alignable with and solderable to solder ball pads along a printed circuit board. A cover may be releasably attachable to, detachable from, and reattachable to the frame.
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Timothy M Wrona from Crystal Lake, IL, age ~56 Get Report