Oanh T Nguyen

20030051662, Mar 20, 2003

May 8, 2002

10/141358

Chung Lee - Fremont CA, US
Oanh Nguyen - Union City CA, US
Atul Kumar - Fremont CA, US

DIELECTRIC SYSTEMS, INC. - Fremont CA

C23C014/00

118/050000

An improved reactor to facilitate new precursor chemistries and transport polymerization processes that are useful for preparations of low ∈ (dielectric constant) films. An improved TP Reactor that consists of UV source and a fractionation device for chemicals is provided to generate useful reactive intermediates from precursors. The reactor is useful for the deposition system.

20030188683, Oct 9, 2003

Apr 4, 2002

10/115879

Chung Lee - Fremont CA, US
Oanh Nguyen - Union City CA, US
Atul Kumar - Fremont CA, US

DIELECTRIC SYSTEMS, INC. - Fremont CA

C23F001/00
C23C014/00

118/050100, 156/345500

An improved reactor to facilitate new precursor chemistries and transport polymerization processes that are useful for preparations of low (dielectric constant) films. An improved TP Reactor that consists of UV source and a fractionation device for chemicals is provided to generate useful reactive intermediates from precursors. The reactor is useful for the deposition system.

20030196680, Oct 23, 2003

Apr 19, 2002

10/126919

Chung Lee - Fremont CA, US
Oanh Nguyen - Union City CA, US
Wei Shiang Lee - Milpitas CA, US
Michael Solomensky - Fremont CA, US
Atul Kumar - Fremont CA, US
James Chang - Cupertino CA, US
Binh Nguyen - Cupertino CA, US

DIELECTRIC SYSTEMS, INC - Freemont CA

C23C016/00
C25F001/00

134/001100, 118/719000, 118/726000, 438/905000

A Process Module (“PM”) is designed to facilitate Transport Polymerization (“TP”) of precursors that are useful for preparations of low Dielectric Constant (“∈”) films. The PM consists primarily of a Material Delivery System (“MDS”) with a high temperature Vapor Phase Controller (“VFC”), a TP Reactor, a Treatment Chamber, a Deposition Chamber and a Pumping System. The PM is designed to facilitate TP for new precursors and for film deposition and stabilization processes.

20030198578, Oct 23, 2003

Apr 18, 2002

10/125626

Chung Lee - Fremont CA, US
Oanh Nguyen - Union City CA, US
Atul Kumar - Fremont CA, US
Jeff Wu - Palo Alto CA, US
Michael Solomensky - Fremont CA, US
James Chang - Cupertino CA, US
Binh Nguyen - Cupertino CA, US

DIELECTRIC SYSTEMS, INC. - Fremont CA

F28D017/00

422/138000, 422/198000, 422/134000, 422/206000

A multi-stage transport polymerization (“TP”) reactor useful for making a thin film for the fabrication of integrated circuits. One TP reactor has two distinct heating zones that facilitate the cracking of specific precursor materials. The multi-stage reactor comprises a first low temperature heating zone that heats incoming precursor materials to a temperature that is lower than the “cracking” temperature of the precursor. The second heating zone is maintained at a temperature useful for breaking the chemical bonds of a desired leaving groups in the selected precursor. Specialized heating bodies, which transfer heat to the precursor material in the low and high temperature zones, are used as elements of the invention that can simultaneously decrease the total volume and increase the inside surface area of the TP reactor. Chemistries of precursors used in the multi-stage reactor are also provided.

20040055539, Mar 25, 2004

Sep 13, 2002

10/243990

Chung Lee - Fremont CA, US
Atul Kumar - Fremont CA, US
Oanh Nguyen - Union City CA, US
Jeff Wu - Palo Alto CA, US
Chieh Chen - Palo Alto CA, US

DIELECTRIC SYSTEMS, INC. - Fremont CA

C23C016/00
H01F041/00

118/724000, 427/457000, 427/508000

A semiconductor equipment that is useful for the fabrication of integrated circuits (“IC”). More specifically, this invention relates to a “reactive-reactor” for a transport polymerization (“TP”) process module, wherein the process module is useful for the deposition of low dielectric (“ ”) thin films in IC manufacture. The reactive-reactor has reactive metal interior surfaces for effective conversion of precursors to intermediates. The resultant reaction products of the precursor and the interior surface material of the reactive-reactor are very stable, and do not cause metallic contamination of the semiconductors. The reactive-reactor of this invention is also equipped with Reactor Re-generating capacity to restore the reactive metal interior surfaces.

20050047927, Mar 3, 2005

Apr 7, 2004

10/820447

Chung Lee - Fremont CA, US
Oanh Nguyen - Union City CA, US
Wei Lee - Milpitas CA, US
Michael Solomensky - Fremont CA, US
Atul Kumar - Fremont CA, US
James Chung Chang - Cupertino CA, US
Binh Nguyen - Cupertino CA, US

F04B001/00

417152000, 417053000

A Process Module (“PM”) is designed to facilitate Transport Polymerization (“TP”) of precursors that are useful for preparations of low Dielectric Constant (“∈”) films. The PM consists primarily of a Material Delivery System (“MDS”) with a high temperature Vapor Phase Controller (“VFC”), a TP Reactor, a Treatment Chamber, a Deposition Chamber and a Pumping System. The PM is designed to facilitate TP for new precursors and for film deposition and stabilization processes.

20060274474, Dec 7, 2006

May 31, 2006

11/421389

Chung Lee - Fremont CA, US
Atul Kumar - Santa Clara CA, US
George Tzeng - Oakland CA, US
Oanh Nguyen - Union City CA, US

H01H 47/00

361143000

A substrate holder for holding and cooling a substrate during a film deposition process is disclosed, wherein the substrate holder comprises a cooled chuck, and a clamping member movably associated with the cooled chuck, wherein the clamping member is movable between an unclamped position in which a substrate is removable from the substrate holder and a clamped position in which a substrate is clamped to the substrate holder substantially adjacent the cooled chuck.

20060275547, Dec 7, 2006

May 31, 2006

11/421385

Chung Lee - Fremont CA, US
Atul Kumar - Santa Clara CA, US
George Tzeng - Oakland CA, US
Oanh Nguyen - Union City CA, US

C23C 16/00

427248100, 361143000

A system for depositing a vapor phase organic compound onto a substrate, comprising a vacuum chamber comprising a wall, a wall heater in thermal communication with the wall of the vacuum chamber, at least one of an evaporative source and a transport polymerization source configured to introduce the vapor phase organic compound into the chamber, and a substrate holder disposed within the vacuum chamber, wherein the substrate holder comprises a cooled chuck, a heat transfer gas source for introducing a heat transfer gas to a space between the cooled chuck and the substrate, and a substrate clamping mechanism comprising at least one of an electrostatic, mechanical and magnetic clamping mechanism.