Paul A. Cole - Portland OR Bozidar Janko - Portland OR Richard G. Chambers - Portland OR Wolfgang H. Herr - Beaverton OR Douglas W. Trobough - Beaverton OR Peter M. Compton - Beaverton OR
Assignee:
Tektronix, Inc. - Wilsonville OR
International Classification:
G01R 3102 H01R 909
US Classification:
324158F
Abstract:
A test fixture for a high pin count surface mounted IC device has a test head assembly connected to an adapter having electrically conductive elements that couple the output of the IC device to test points on the test head assembly. The test points are coupled to conductive pads on the test head assembly via conductive runs. The test head assembly conductive pads mate with conductive pad formed in the electrically conductive elements of the adapter. The conductive elements engage leads on the IC device providing conductive paths between the IC leads an the test points on the test head assembly. The test fixture is secured to the IC device by friction forces between the periphery of the IC device and the inner surface of the adapter. The test fixture or the adapter is usable as a low profile chip carrier by inverting the fixture or adapter and as a circuit board interconnect.
Adapter And Test Fixture For An Integrated Circuit Device Package
Paul A. Cole - Aloha OR Bozidar Janko - Portland OR Richard G. Chambers - Portland OR Wolfgang H. Herr - Beaverton OR Douglas W. Trobough - Beaverton OR Peter M. Compton - Beaverton OR
Assignee:
Tektronix, Inc. - Wilsonville OR
International Classification:
G01R 3102 G01R 1073
US Classification:
324158F
Abstract:
A test fixture for a high pin count surface mounted IC device has a test head assembly connected to an adapter having electrically conductive elements that couple the output of the IC device to test points on the test head assembly. The test points are coupled to conductive pads on the test head assembly via conductive runs. The test head assembly conductive pads mate with conductive pad formed in the electrically conductive elements of the adapter. The conductive elements engage leads on the IC device providing conductive paths between the IC leads an the test points on the test head assembly. The test fixture is secured to the IC device by friction forces between the periphery of the IC device and the inner surface of the adapter. The test fixture or the adapter is usable as a low profile chip carrier by inverting the fixture or adapter and as a circuit board interconnect.