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William A Ciarfella

from Round Rock, TX
Age ~65

William Ciarfella Phones & Addresses

  • 2918 Cedar Crest Cir, Round Rock, TX 78664 (512) 310-2114
  • Des Moines, IA
  • 11900 Arabian Trl, Austin, TX 78759
  • Southlake, TX
  • South Burlington, VT
  • Fishkill, NY
  • Hurst, TX
  • Norwalk, CT
  • 2918 Cedar Crest Cir, Round Rock, TX 78665

Work

Position: Precision Production Occupations

Education

Degree: Associate degree or higher

Publications

Us Patents

Systems And Arrangements To Assess Thermal Performance

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US Patent:
7734444, Jun 8, 2010
Filed:
Nov 9, 2007
Appl. No.:
11/937710
Inventors:
Ronald Xavier Arroyo - Austin TX, US
Kenneth A. Bird - New Paltz NY, US
William A. Ciarfella - Round Rock TX, US
Bret Peter Elison - Rochester MN, US
Gary Franklin Goth - Pleasant Valley NY, US
Terrance Wayne Kueper - Rochester MN, US
Thoi Nguyen - Austin TX, US
Roger Donell Weekly - Austin TX, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01K 17/00
US Classification:
702136, 3241581, 438 14, 702132
Abstract:
Systems and arrangements to assess the thermal performance of a thermal solution based upon the ability of a device under test (DUT) to operate in accordance with electrical performance criteria are contemplated. Embodiments may include a tester to couple with the DUT to determine an operating junction temperature. In some embodiments, the measured junction temperature may be the operating junction temperature anticipated for the DUT in a customer installation. In other embodiments, the tester may comprise logic to calculate a projected, operating junction temperature based upon the measured junction temperature and known differences between the tester and a customer installation. Upon determining the operating junction temperature for the DUT at the customer installation, the operating junction temperature is compared against a maximum junction temperature for proper operation of the DUT. Advantageously, the maximum junction temperature may be varied based upon the project objective for a line of DUTs.

Systems And Arrangements To Assess Thermal Performance

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US Patent:
20060263912, Nov 23, 2006
Filed:
May 19, 2005
Appl. No.:
11/133427
Inventors:
Ronald Arroyo - Austin TX, US
Kenneth Bird - New Paltz NW, US
William Ciarfella - Round Rock TX, US
Bret Elison - Rochester MN, US
Gary Goth - Pleasant Valley NY, US
Terrance Kueper - Rochester MN, US
Thoi Nguyen - Austin TX, US
Roger Weekly - Austin TX, US
International Classification:
H01L 21/66
G01N 25/68
G01N 25/00
G01K 15/00
US Classification:
438014000, 374015000, 374010000, 374001000
Abstract:
Systems and arrangements to assess the thermal performance of a thermal solution based upon the ability of a device under test (DUT) to operate in accordance with electrical performance criteria are contemplated. Embodiments may include a tester to couple with the DUT to determine an operating junction temperature. In some embodiments, the measured junction temperature may be the operating junction temperature anticipated for the DUT in a customer installation. In other embodiments, the tester may comprise logic to calculate a projected, operating junction temperature based upon the measured junction temperature and known differences between the tester and a customer installation. Upon determining the operating junction temperature for the DUT at the customer installation, the operating junction temperature is compared against a maximum junction temperature for proper operation of the DUT. Advantageously, the maximum junction temperature may be varied based upon the project objective for a line of DUTs.
William A Ciarfella from Round Rock, TX, age ~65 Get Report