Walter Albert Kunzel - Middlesex NJ
A test fixture for integrated circuits, particularly those having large numbers of contacts. The fixture has a socket for receiving the integrated circuit, with conductive wad pins of the socket contacting lands or solderballs of the integrated circuit. Four clamping and alignment studs having peripheral grooves near their upper ends extend upward from the four corners of the socket. A lid is pivoted about a hinge pin which goes through bearing holes in the two studs and the lid. A pressure pad is resiliently suspended from the lid for applying pressure to the upper surface of an integrated circuit disposed in the socket. A slide-lock plate is mounted on the upper surface of the lid. A pressure pad screw extends from a position above the slide-lock plate, through a hole in the slide-lock plate, to engage threads of the central hole of the lid to apply pressure to the pressure pad when the pressure pad screw is rotated. The slide-lock plate is slidable between an open position in which the upper portions of the studs extend through the slide-lock plate, which can then be opened by rotating the slide-lock plate and lid about the hinge, and a locked position in which the slide-lock plate is moved so that narrowed portions of its slots engage the peripheral grooves of the studs.