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Todd Hubing Phones & Addresses

  • Stoughton, WI
  • 413 Village Walk Ln, Clemson, SC 29631 (864) 654-3322
  • Central, SC
  • 718 Oak Knoll Rd, Rolla, MO 65401 (573) 364-9295 (573) 368-5569
  • 911 Oak Knoll Rd, Rolla, MO 65401 (573) 364-9295
  • 911 12Th St, Rolla, MO 65401 (573) 364-9295
  • Raleigh, NC
  • 413 Village Walk Ln, Clemson, SC 29631

Work

Position: Personal Care and Service Occupations

Education

Degree: Graduate or professional degree

Resumes

Resumes

Todd Hubing Photo 1

Instructor, Consultant

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Location:
P/O Box 729, Stoughton, WI
Industry:
E-Learning
Work:
Clemson University
Michelin Professor of Vehicular Electronics

University of Missouri-Rolla 1989 - 2006
Professor

IBM May 1982 - Aug 1989
Engineer
Education:
North Carolina State University 1983 - 1988
Ph.D., Electrical Engineering
Purdue University 1980 - 1982
MS, Electrical Engineering
Massachusetts Institute of Technology 1976 - 1980
BS, Electrical Engineering
Skills:
Electronics
Electromagnetics
Electromagnetic Compatibility
Simulations
Matlab
Testing
Pcb Design
Electrical Engineering
Simulink
Signal Processing
Rf
Systems Engineering
Signal Integrity
Analog Circuit Design
Labview
Digital Signal Processors
Modeling
Microwave
Circuit Design
Engineering
Antennas
Automotive Electronics
Pspice
Power Electronics
Sensors
R&D
Hardware Architecture
Semiconductors
Product Development
Simulation
Embedded Systems
Microcontrollers
Physics
Algorithms
Spice
Vhdl
System Design
Latex
Ansys
Cmos
Mathematical Modeling
Fpga
Characterization
Numerical Analysis
Fortran
Ic
Image Processing
Verilog
Certifications:
Inarte Certified Emc Engineer
Inarte
Todd Hubing Photo 2

Todd Hubing

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Publications

Us Patents

Electromagnetic Emissions Stimulation And Detection System

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US Patent:
7853437, Dec 14, 2010
Filed:
Dec 1, 2008
Appl. No.:
12/325856
Inventors:
Sarah A. Seguin - Rolla MO, US
Daryl G. Beetner - Rolla MO, US
Todd H. Hubing - Clemson SC, US
Assignee:
The Curators of the University of Missouri - Rolla MO
International Classification:
G06F 15/00
G01S 3/00
US Classification:
702189, 342463
Abstract:
A system and method for detecting and identifying electronic devices based on their unintended electromagnetic emissions (“UEE”) signals is presented. During device classification, UEE signals are measured from a plurality of test devices and characteristic data is obtained from the UEE signal emitted from each test device. Using the characteristic data, a threshold value and ideal pulse template can be determined for each test device and stored in a memory. An ideal stimulation signal is also determined for each test device and stored in the memory. During device detection, the ideal stimulation signal is applied to the environment in which a target device is suspected of being located. Stimulated UEE signals are measured from the target device and processed. The processed measurement data is compared to stored power threshold values and ideal pulse templates to determine if the target device is present.

Semiconductor Integrated Circuit Chip, Multilayer Chip Capacitor And Semiconductor Integrated Circuit Chip Package

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US Patent:
8304854, Nov 6, 2012
Filed:
Nov 13, 2008
Appl. No.:
12/270457
Inventors:
Byoung Hwa Lee - Gyunggi-do, KR
Min Cheol Park - Gyunggi-do, KR
Ho Cheol Kwak - Clemson SC, US
Haixin Ke - Clemson SC, US
Todd Harvey Hubing - Clemson SC, US
Assignee:
Samsung Electro-Mechanics Co., Ltd. - Gyunggi-Do
Clemson University - Clemson SC
International Classification:
H01L 29/92
US Classification:
257532, 3613011, 3613061, 3613062, 3613063, 361307, 3613081, 361310, 361734, 361738, 257535, 257E23057, 257E29343
Abstract:
Disclosed are a semiconductor integrated circuit chip, a multilayer chip capacitor, and a semiconductor integrated circuit chip package. The semiconductor integrated circuit chip includes a semiconductor integrated circuit chip body, an input/output terminal disposed on the outside of the semiconductor integrated circuit chip body, and a decoupling capacitor disposed at a side face of the semiconductor integrated circuit chip body and electrically connected to the input/output terminal. The semiconductor integrated circuit chip cab be obtained, which can maintain an impedance of a power distribution network below a target impedance in a wide frequency range, particularly at a high frequency, by minimizing an inductance between a decoupling capacitor and a semiconductor integrated circuit chip.

Electromagnetic Emissions Stimulation And Detection System

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US Patent:
20090006024, Jan 1, 2009
Filed:
Jun 29, 2007
Appl. No.:
11/771192
Inventors:
Sarah A. Seguin - Rolla MO, US
Daryl G. Beetner - Rolla MO, US
Todd H. Hubing - Clemson SC, US
Assignee:
THE CURATORS OF THE UNIVERSITY OF MISSOURI - Rolla MO
International Classification:
G06F 19/00
US Classification:
702124
Abstract:
A system and method for detecting and identifying electronic devices based on their unintended electromagnetic emissions (“UEE”) signals is presented. During device classification, UEE signals are measured from a plurality of test devices and characteristic data is obtained from the UEE signal emitted from each test device. Using the characteristic data, a threshold value and ideal pulse template can be determined for each test device and stored in a memory. An ideal stimulation signal is also determined for each test device and stored in the memory. During device detection, the ideal stimulation signal is applied to the environment in which a target device is suspected of being located. Stimulated UEE signals are measured from the target device and processed. The processed measurement data is compared to stored power threshold values and ideal pulse templates to determine if the target device is present.

Capacitive-Stemmed Capacitor

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US Patent:
20110304949, Dec 15, 2011
Filed:
Jan 6, 2010
Appl. No.:
13/143637
Inventors:
Todd Hubing - Clemson SC, US
International Classification:
H01G 4/228
US Classification:
3613062
Abstract:
A capacitor having a stem that is designed to be inserted into a single, large-diameter via hole drilled in a printed circuit board is provided, wherein the stem may have conductive rings for making the positive and negative connections to the printed circuit board power distribution planes. Inside the capacitive stem, current, or at least a portion thereof, may be carried to the main body of the capacitor through low-inductance plates that are interleaved to maximize their own mutual inductance and, therefore, minimize the connection inductance. Alternatively, the capacitor may include a coaxial stem that forms a coaxial transmission line with the anode and cathode terminals forming the inner and outer conductors.
Todd Harvey Hubing from Stoughton, WI, age ~65 Get Report