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Teresita Magtoto Phones & Addresses

  • Kingston, NY

Publications

Us Patents

Method And System For Line-Dimension Control Of An Etch Process

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US Patent:
7291285, Nov 6, 2007
Filed:
May 10, 2005
Appl. No.:
11/125696
Inventors:
Gary Walter Behm - Hopewell Junction NY, US
Teresita Quitua Magtoto - Poughkeepsie NY, US
Rajiv M. Ranade - Brewster NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01L 21/30
US Classification:
216 41, 216 67, 700 14, 700121, 702 24, 702 31
Abstract:
A method and system for controlling a dimension of an etched feature. The method includes: measuring a mask feature formed on a top surface of a layer on a substrate to obtain a mask feature dimension value; and calculating a mask trim plasma etch time based on the mask feature dimension value, a mask feature dimension target value, a total of selected radio frequency power-on times of a plasma etch tool since an event occurring to a chamber or chambers of a plasma etch tool for plasma etching the layer, and an etch bias target for a layer feature to be formed from the layer where the layer is not protected by the mask feature during a plasma etch of the layer.

Method And System Of Providing A Dynamic Sampling Plan For Integrated Metrology

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US Patent:
7398172, Jul 8, 2008
Filed:
May 31, 2006
Appl. No.:
11/421082
Inventors:
Gary W. Behm - Hopewell Junction NY, US
Emily M. Hwang - Hopewell Junction NY, US
Yue J. Li - Hopewell Junction NY, US
Teresita Q. Magtoto - Poughkeepsie NY, US
Derek C. Stoll - Hopewell Junction NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G06F 15/00
US Classification:
702 83, 382149
Abstract:
A method and system of providing a dynamic sampling plan for integrated metrology is disclosed. The method may include modeling a sampling plan for use with a factory level advanced processing control (FL-APC) system and sending a recommended sampling plan, in response to receiving a request for a sampling plan, wherein the recommended sampling plan is based upon the modeling and the request. The recommended sampling plan may be sent to an equipment interface (EI) and on to a tool for implementation in a manufacturing environment.

Factory Level And Tool Level Advanced Process Control Systems Integration Implementation

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US Patent:
7489980, Feb 10, 2009
Filed:
Jul 27, 2006
Appl. No.:
11/460450
Inventors:
Gary W Behm - Hopewell Junction NY, US
Emily M Hwang - Hopewell Junction NY, US
Yue Li - Hopewell Junction NY, US
Teresita Q Magtoto - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G06F 19/00
US Classification:
700 96, 700121
Abstract:
Integration of factory level advanced process control (FL-APC) system and tool level advanced process control (TL-APC) system using selectable APC operation modes indicating different operational settings for the FL-APC system and at least one TL-APC system is disclosed. During operation, the FL-APC system controls operation of the TL-APC system. The invention allows a manufacturing execution system (MES) to have additional capability to run the process control functions at FL-APC system and/or TL-APC system, and allows integration of a variety of different tools with a TL-APC system. An implementation method, system and program product are also disclosed.

Providing A Dynamic Sampling Plan For Integrated Metrology

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US Patent:
7577537, Aug 18, 2009
Filed:
Mar 18, 2008
Appl. No.:
12/050425
Inventors:
Gary W. Behm - Hopewell Junction NY, US
Emily M. Hwang - Hopewell Junction NY, US
Yue J. Li - Hopewell Junction NY, US
Teresita Q. Magtoto - Poughkeepsie NY, US
Derek C. Stoll - Hopewell Junction NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G06F 15/00
US Classification:
702 83, 382149
Abstract:
A computer program product and system of providing a dynamic sampling plan for integrated metrology is disclosed. The computer program product may include a computer readable medium that includes a computer readable program, wherein the computer readable program when executed on a computer causes the computer to: model a sampling plan for use with a factory level advanced processing control (FL-APC) system; receive a request for a sampling plan; and send a recommended sampling plan, based upon the request and the modeling. The recommended sampling plan may be sent to an equipment interface (EI) and on to a tool for implementation in a manufacturing environment.

Method And System For Line-Dimension Control Of An Etch Process

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US Patent:
7700378, Apr 20, 2010
Filed:
Oct 15, 2007
Appl. No.:
11/872098
Inventors:
Gary Walter Behm - Hopewell Junction NY, US
Teresita Quitua Magtoto - Poughkeepsie NY, US
Rajiv M. Ranade - Brewster NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 21/66
US Classification:
438 9, 257E21528
Abstract:
A method and system for controlling a dimension of an etched feature. The method includes: measuring a mask feature formed on a top surface of a layer on a substrate to obtain a mask feature dimension value; and calculating a mask trim plasma etch time based on the mask feature dimension value, a mask feature dimension target value, a total of selected radio frequency power-on times of a plasma etch tool since an event occurring to a chamber or chambers of a plasma etch tool for plasma etching the layer, and an etch bias target for a layer feature to be formed from the layer where the layer is not protected by the mask feature during a plasma etch of the layer.

Factory Level And Tool Level Advanced Process Control Systems Integration Implementation

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US Patent:
7899566, Mar 1, 2011
Filed:
Jan 2, 2009
Appl. No.:
12/348026
Inventors:
Gary W. Behm - Hopewell Junction NY, US
Emily M. Hwang - Hopewell Junction NY, US
Yue Li - Hopewell Junction NY, US
Teresita Q. Magtoto - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G06F 19/00
US Classification:
700 96, 700121
Abstract:
Integration of factory level advanced process control (FL-APC) system and tool level advanced process control (TL-APC) system using selectable APC operation modes indicating different operational settings for the FL-APC system and at least one TL-APC system is disclosed. During operation, the FL-APC system controls operation of the TL-APC system. The invention allows a manufacturing execution system (MES) to have additional capability to run the process control functions at FL-APC system and/or TL-APC system, and allows integration of a variety of different tools with a TL-APC system. An implementation method, system and program product are also disclosed.

Integration Of Factory Level And Tool Level Advanced Process Control Systems

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US Patent:
7113845, Sep 26, 2006
Filed:
Aug 9, 2005
Appl. No.:
11/161603
Inventors:
Gary W. Behm - Hopewell Junction NY, US
Yue Li - Hopewell Junction NY, US
Emily M. Hwang - Wappingers Falls NY, US
Teresita Q. Magtoto - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G06F 19/00
US Classification:
700169, 700121
Abstract:
Integration of factory level advanced process control (FL-APC) system and tool level advanced process control (TL-APC) system using selectable APC operation modes indicating different operational settings for the FL-APC system and at least one TL-APC system is disclosed. During operation, the FL-APC system controls operation of the TL-APC system. The invention allows a manufacturing execution system (MES) to have additional capability to run the process control functions at FL-APC system and/or TL-APC system, and allows integration of a variety of different tools with a TL-APC system.
Teresita H Magtoto from Kingston, NY, age ~95 Get Report