Tayfun Z Ilercil

8646282, Feb 11, 2014

Jan 28, 2010

13/146635

Alp Ilercil - Scottsdale AZ, US
Tayfun Ilercil - Dana Point CA, US

F25B 21/04

62 33, 62 31, 62 32, 62 36, 62 362, 62371

The invention is directed to an energy efficient thermoelectric heat pump assembly. The thermoelectric heat pump assembly preferably comprises two to nine thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and providing a delayed thermal reaction time of the assembly. The capacitance spacer block is thermally connected between the thermoelectric unit layers. The present invention further relates to a thermoelectric transport and storage devices for transporting or storing temperature sensitive goods, for example, vaccines, chemicals, biologicals, and other temperature sensitive goods. Preferably the transport or storage devices are configured and provide on-board energy storage for sustaining, for multiple days, at a constant-temperature, with an acceptable temperature variation band.

20100146991, Jun 17, 2010

Jan 28, 2009

12/361484

Tayfun Ilercil - Mesa AZ, US
Alp Ilercil - Mesa AZ, US

F25B 21/02
F25B 21/00
B23P 19/04

62 33, 62 36, 29700

This invention relates to providing energy efficient thermoelectric heat pump systems for iso-thermal transport and storage, of perishable goods, such as vaccines, chemicals, biologicals, and other temperature sensitive goods. Also this invention relates to providing energy efficient iso-thermal transport and storage systems, of perishable goods, which are compact, light weight. This invention further relates to providing on-board energy storage for sustaining, for multiple days, the ability of such iso-thermal transport and storage systems to maintain temperature sensitive goods at a constant-temperature.

58610766, Jan 19, 1999

Sep 6, 1995

8/524182

Edwin J. Adlam - Singapore, SG
Sukianto Rusli - Chandler AZ
Jordan L. Wahl - Mesa AZ
Tayfun Ilercil - Phoenix AZ
Robert A. Forcier - Mesa AZ
Jerome S. Sallo - Scottsdale AZ

Park Electrochemical Corporation - Lake Success NY

B32B 3100

156281

The present invention relates to a bond enhancement process for promoting strong, stable adhesive bonds between surfaces of copper foil and adjacent resin impregnated substrates or superimposed metallic sublayers. According to the process of the invention, a black oxide-coated copper surface is treated with an aqueous reducing solution containing sodium metabisulfite and sodium sulfide to convert the black oxide coating to a roughened metallic copper coating. The roughened metallic copper-coated surface is then passivated and laminated to a resin impregnated substrate. The bond enhancement process is especially useful in multilayer printed circuit fabrication and in the treatment of copper circuit lines and areas which are disconnected from each other, that is, which do not have electrically conductive continuity. Inner-layer laminates prepared according to the process of the invention are not susceptible to pink-ring formation, exhibit excellent resistance to chemical attack at drilled holes and sheared edges and are stable under thermal and mechanical stresses.