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Stuart D Hellring

from Pittsburgh, PA
Age ~72

Stuart Hellring Phones & Addresses

  • 130 Oak Park Pl, Pittsburgh, PA 15243 (412) 563-7776 (412) 563-7773
  • 130 Oak Park Rd, Pgh, PA 15243 (412) 563-7773 (412) 563-7776
  • Allegheny, PA
  • Yardley, PA
  • Monroeville, PA
  • Ewing, NJ
  • Houston, TX

Work

Company: Ppg industries Nov 2018 Position: Associate fellow

Education

Degree: Doctorates, Doctor of Philosophy School / High School: Colorado State University Specialities: Chemistry

Skills

Chemistry • Materials Science • Product Development • Characterization • Polymers • Process Engineering • R&D • Coatings • Design of Experiments • Organic Chemistry • Research and Development • Catalytic Generative Thinking • Cross Functional Team Leadership

Industries

Chemicals

Resumes

Resumes

Stuart Hellring Photo 1

Associate Fellow

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Location:
Pittsburgh, PA
Industry:
Chemicals
Work:
Ppg Industries
Associate Fellow

Ppg Industries
Associate Research Fellow

Mobil Oil 1900 - 1901
Associate
Education:
Colorado State University
Doctorates, Doctor of Philosophy, Chemistry
Skills:
Chemistry
Materials Science
Product Development
Characterization
Polymers
Process Engineering
R&D
Coatings
Design of Experiments
Organic Chemistry
Research and Development
Catalytic Generative Thinking
Cross Functional Team Leadership

Publications

Us Patents

Silica-Based Slurry

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US Patent:
6656241, Dec 2, 2003
Filed:
Jun 14, 2001
Appl. No.:
09/882548
Inventors:
Stuart D. Hellring - Pittsburgh PA
Colin P. McCann - Pittsburgh PA
Charles F. Kahle - Pittsburgh PA
Yuzhuo Li - Potsdam NY
Jason Keleher - Schenectady NY
Assignee:
PPG Industries Ohio, Inc. - Cleveland OH
International Classification:
G09G 102
US Classification:
51308, 106 3, 438692, 438693, 216 99, 216105, 216 96
Abstract:
This invention relates to a slurry composition and a method of its preparation. In particular, the slurry composition of the present invention includes a silica wherein the silica comprises a surface modification. The silica-based slurry of the present invention is suitable for polishing articles and especially useful for chemical-mechanical planarization (âCMPâ) of semiconductor and other microelectronic substrates.

Process For Producing Hydrophobic Particulate Inorganic Oxides

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US Patent:
6736891, May 18, 2004
Filed:
Aug 11, 2000
Appl. No.:
09/636311
Inventors:
Jo-Ann E. Bice - Murrysville PA
Stuart D. Hellring - Pittsburgh PA
Timothy A. Okel - Trafford PA
James R. Hahn - Midland MI
Assignee:
PPG Industries Ohio, Inc. - Cleveland OH
Dow Corning Corporation - Midland MI
International Classification:
C09C 128
US Classification:
106490, 10628711, 10628713, 10628714, 10628719, 1062871
Abstract:
Described is an improved process for producing hydrophobic particulate inorganic oxides useful for reinforcing polymeric compositions, e. g. , rubber, by using a certain amount of hydrophobizing agents in an aqueous suspension of inorganic oxide having a pH of 2. 5 or less and increasing the pH of the suspension after hydrophobizing the filler.

Hydrophobic Particulate Inorganic Oxides And Polymeric Compositions Containing Same

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US Patent:
7015271, Mar 21, 2006
Filed:
Dec 20, 2002
Appl. No.:
10/328376
Inventors:
Jo-Ann E. Bice - Murrysville PA, US
Stuart D. Hellring - Pittsburgh PA, US
Timothy A. Okel - Trafford PA, US
Assignee:
PPG Industries Ohio, Inc. - Cleveland OH
International Classification:
C08K 3/22
C08K 3/36
US Classification:
524493, 523216, 423339, 428405, 428407, 1522091
Abstract:
Described are hydrophobic particulate inorganic oxides useful for reinforcing polymeric composition, e. g. , rubber. The materials are characterized by: (a) the substantial absence of functional groups capable of chemical reaction with rubber; (b) a BET surface area of in the range of from 40 to 350 m/g; (c) a hydroxyl content in the range of 2 to 15 OH/nm; (d) a carbon content in the range of from 0. 1 to 6 percent by weight that is substantially non-extractable; (e) a pH in the range of from 3 to 10; (f) an M1 Standard White Area less than 0. 4 percent and (g) a methanol wettability of from 15 to 45 percent. Compositions such as polymers, cured organic rubber articles, master batches and slurries containing the hydrophobic fillers are also described.

Silica And Silica-Based Slurry

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US Patent:
7279119, Oct 9, 2007
Filed:
Jul 28, 2003
Appl. No.:
10/627776
Inventors:
Stuart D. Hellring - Pittsburgh PA, US
Colin P. McCann - Pittsburgh PA, US
Suryadevara V. Babu - Pottsdam NY, US
Yuzhuo Li - Norwood NY, US
Satish Narayanan - Hillsboro OR, US
Robert L. Auger - Pittsburgh PA, US
Assignee:
PPG Industries Ohio, Inc. - Cleveland OH
International Classification:
H01I 21/302
C09K 5/00
US Classification:
252 791, 252 792, 252 793, 252 794
Abstract:
This invention relates to a silica, a slurry composition, and a method of their preparation. In particular, the silica of the present invention includes aggregated primary particles. The slurry composition which incorporates the silica, is suitable for polishing articles and especially useful for chemical-mechanical planarization of semiconductor substrates and other microelectronic substrates.

Transparent Composite Articles

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US Patent:
7632563, Dec 15, 2009
Filed:
Dec 14, 2006
Appl. No.:
11/610755
Inventors:
Stuart D. Hellring - Pittsburgh PA, US
Kaliappa G. Ragunathan - Gibsonia PA, US
Thomas G. Rakavina - New Kensington PA, US
Victoria A. Trette - Freeport PA, US
Assignee:
PPG Industries Ohio, Inc. - Cleveland OH
International Classification:
B32B 27/04
C08K 7/02
C08L 75/00
US Classification:
4282974, 524261, 525123
Abstract:
A transparent composite article comprising a polyurethane matrix and incorporated within the matrix nanofibers having a diameter up to 5000 nanometers.

Process Of Electrospinning Organic-Inorganic Fibers

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US Patent:
8088323, Jan 3, 2012
Filed:
Feb 27, 2007
Appl. No.:
11/679345
Inventors:
Stuart D. Hellring - Pittsburgh PA, US
Kaliappa G. Ragunathan - Gibsonia PA, US
Kenneth J. Balog - Tarentum PA, US
Hong Li - Sewickley PA, US
Robert A. Montague - Shelby NC, US
Assignee:
PPG Industries Ohio, Inc. - Cleveland OH
International Classification:
D06M 10/00
H05B 7/00
US Classification:
264465
Abstract:
Organic-inorganic hybrid fibers and methods for the preparation of such fibers are disclosed.

Hydrophobic Particulate Inorganic Oxides And Polymeric Compositions Containing Same

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US Patent:
20020107316, Aug 8, 2002
Filed:
Jan 8, 2002
Appl. No.:
10/041114
Inventors:
Jo-Ann Bice - Murrysville PA, US
Stuart Hellring - Pittsburgh PA, US
Timothy Okel - Trafford PA, US
International Classification:
C01B033/12
C01F007/02
C08K003/18
C08K003/34
US Classification:
524/493000, 423/625000, 423/335000, 524/430000
Abstract:
Described are hydrophobic particulate inorganic oxides useful for reinforcing polymeric composition, e.g., rubber. The materials are characterized by: (a) the substantial absence of functional groups capable of chemical reaction with rubber; (b) a BET surface area of in the range of from 40 to 350 m/g; (c) a hydroxyl content in the range of 2 to 15 OH/nm; (d) a carbon content in the range of from 0.1 to 6 percent by weight that is substantially non-extractable; (e) a pH in the range of from 3 to 10; (f) an M1 Standard White Area less than 0.4 percent and (g) a methanol wettability of from 15 to 45 percent. Compositions such as polymers, cured organic rubber articles, master batches and slurries containing the hydrophobic fillers are also described.

Silica And A Silica-Based Slurry

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US Patent:
20030094593, May 22, 2003
Filed:
Jun 14, 2001
Appl. No.:
09/882549
Inventors:
Stuart Hellring - Pittsburgh PA, US
Colin McCann - Pittsburgh PA, US
Suryadevara Babu - Potsdam NY, US
Yuzhuo Li - Potsdam NY, US
Satish Narayanan - Hillsboro OR, US
International Classification:
B44C001/22
H01L021/302
US Classification:
252/079100, 216/038000
Abstract:
This invention relates to a silica, a slurry composition, and a method of their preparation. In particular, the silica of the present invention includes aggregated primary particles. The slurry composition which incorporates the silica, is suitable for polishing articles and especially useful for chemical-mechanical planarization of semiconductor substrates and other microelectronic substrates.
Stuart D Hellring from Pittsburgh, PA, age ~72 Get Report