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Songhua Shi

from Chandler, AZ
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Connected to:
Ashley H Shi, 47Chang L Shi, 63Chen S Shi, 43Chong T Shi, 69Cynthia M Shi, 30Danling Shi, 69Danni Shi, 45Di J Shi, 75Frances Shi, 53Ho S Shi, 58

Songhua Shi Phones & Addresses

  • 2428 Iris Ct, Chandler, AZ 85224 (480) 722-7721
  • Laveen, AZ
  • Phoenix, AZ
  • McKinney, TX
  • Colton, TX
  • Maricopa, AZ
  • 4321 E Glenhaven Dr, Phoenix, AZ 85048 (480) 235-0273

Work

Position: Building and Grounds Cleaning and Maintenance Occupations

Education

Degree: Graduate or professional degree

Business Records

Name / Title
Company / Classification
Phones & Addresses
Songhua Shi
DINGDONG, LLC
2428 E Iris Dr, Chandler, AZ 85286

Publications

Us Patents

Medical Device With Surface Mounted Lead Connector

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US Patent:
20160166825, Jun 16, 2016
Filed:
Dec 15, 2014
Appl. No.:
14/570531
Inventors:
- Minneapolis MN, US
Songhua Shi - Chandler AZ, US
International Classification:
A61N 1/04
Abstract:
A medical device includes a printed circuit board, a connector mounted on the printed circuit board, and a polymeric body molded over the connector and the printed circuit board. The connector is configured to receive a medical lead and electrically and mechanically couple the lead to the printed circuit board. The connector comprises a housing and feedthrough assembly that includes a polymeric housing and a conductor. The housing defines a bore configured to receive the lead and defines a feedthrough opening through which the conductor extends. The housing and feedthrough assembly is sealed except for an aperture in communication with the bore. The connector further includes a contact disposed in the bore. The conductor electrically couples the contact with the printed circuit board. When a lead is properly received by the bore, the contact couples the lead to the printed circuit board via the conductor.

Systems For Encapsulating A Hybrid Assembly Of Electronic Components And Associated Methods

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US Patent:
20150342060, Nov 26, 2015
Filed:
Dec 5, 2014
Appl. No.:
14/561248
Inventors:
- Minneapolis MN, US
Songhua SHI - Chandler AZ, US
Mark S. RICOTTA - Tempe AZ, US
Scott B. SLEEPER - Apache Junction AZ, US
Yongqian WANG - Chandler AZ, US
International Classification:
H05K 3/28
H05K 5/06
Abstract:
During a process to encapsulate electronic components and attachment interfaces thereof on a first side of a substrate of a hybrid assembly, a fluid is supplied to a trench of an encapsulation system in which the hybrid assembly is loaded, and a balancing pressure is delivered by the fluid within the trench, during the encapsulation process, to support the hybrid assembly from an opposing second side of the substrate. A regulator of a fluid supply of the system may maintain the balancing pressure, for example, being controlled by a controller of the system that is configured to estimate a pressure within a molding cavity of the system.
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Songhua Shi from Chandler, AZ Get Report