Inventors:
Siamak Fazel Pour - Irvine CA
Assignee:
Conexant Systems, Inc. - Newport Beach CA
International Classification:
H01L 2334
US Classification:
257724, 257667, 257669, 257676, 257709, 257725, 257788, 257796
Abstract:
A package is provided for surface mounting a semiconductor device to a board such that a first pad of the semiconductor device is operatively connected to a second pad on the board. The package includes a paddle having a front side and a back side with the front side being mated to the semiconductor device and at least partially enclosed in an encapsulant material and the backside being substantially exposed. In addition, the package has a region of the paddle that is at least partially isolated by the encapsulant material and aligned with the second pad an interconnect connected to the first pad of the semiconductor device and bonded to the region such that a conductive path is formed with the first pad, the region and the second pad when the backside is mated with the board.
