Shahram Nikoukary Phones & Addresses
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Encinitas, CA
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West Monroe, LA
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1535 Lilac Ln, Mountain View, CA 94043 (408) 712-1073
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San Jose, CA
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Los Angeles, CA
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Santa Clara, CA
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Phoenix, AZ
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Rancho Santa Margarita, CA
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1535 Lilac Ln, Mountain View, CA 94043
Emails
n***y@hotmail.com
Publications
Us Patents
Grounded Shield For Blocking Electromagnetic Interference In An Integrated Circuit Package
View pageUS Patent:
20080272468, Nov 6, 2008
Filed:
May 2, 2007
Appl. No.:
11/743162
Inventors:
Farshad Ghaghahi - Saratoga CA, US
Shahram Nikoukary - Santa Clara CA, US
Halford Kokichi Tome - Milpitas CA, US
Shahram Nikoukary - Santa Clara CA, US
Halford Kokichi Tome - Milpitas CA, US
International Classification:
H05K 9/00
H01L 21/00
H01L 23/552
H01L 21/00
H01L 23/552
US Classification:
257659, 438122, 257E23114, 257E21001
Abstract:
An integrated circuit package for blocking electromagnetic interference includes a top layer formed in a package substrate. A first plurality of via groups is formed in the top layer surrounding an area on the top layer for an integrated circuit die. At least one lower layer is formed in the package substrate. A lower via group is formed in the lower layer below each of the first plurality of via groups, respectively. An electrical connection is formed in the lower layer between each lower via group and the first plurality of via groups, respectively. A ground connection is formed in the integrated circuit package for each lower via group to connect each lower via group to an electrical ground to block electromagnetic interference.
Offset Via On Pad
View pageUS Patent:
20060284310, Dec 21, 2006
Filed:
Jun 15, 2005
Appl. No.:
11/153915
Inventors:
Jeffrey Hall - San Jose CA, US
Shahram Nikoukary - San Jose CA, US
Shahram Nikoukary - San Jose CA, US
International Classification:
H01L 23/48
US Classification:
257734000
Abstract:
A printed circuit board with an electrically conductive bonding pad disposed on an outer surface of the printed circuit board. The bonding pad has a bonding pad perimeter at immediately bounding edges of the bonding pad. An electrically conductive via directly electrically contacts the bonding pad, and is disposed within the printed circuit board relative to the bonding pad. The via has a via perimeter at immediately bounding edges of the via. The via perimeter overlaps the pad perimeter such that a portion of the via perimeter is within the pad perimeter and a portion of the via perimeter is outside the pad perimeter. In various embodiments, the bonding pad is a ball bonding pad.