Inventors:
Takayasu Ishikawa - Harrison City PA
Seijiro Kobayashi - Irvine CA
Roger Gordon Corn - Monroeville PA
Jeffrey Warren Higgs - Bethel Park PA
Assignee:
Sony Corporation - Tokyo
Sony Electronics, Inc. - Park Ridge NJ
International Classification:
H04N 564
Abstract:
An apparatus and method of forming a part by injection molding. The method includes the step of providing injection molding equipment having a sprue for supplying melted plastic. In addition, the method includes the step of providing a mold for forming the part, wherein the mold is adapted for forming a runner integrally with the part and wherein the mold is connected to the sprue. Further, the method includes the step of injecting the melted plastic into the mold so as to form the part and the runner such that the runner is integrally formed with the part.