Search

Scott F Popelar

from Colorado Springs, CO
Age ~58
Get Report
Also known as:
Scott E Popelar
Phone and address:
8195 Old Exchange Dr, Colorado Springs, CO 80920
(719) 536-9166
Related to:
Cheryl Ann Popelar, 55Marjorie BullockRichard BullockCarl Popelar, 60
Connected to:
Diana O Popelas, 69Kelley J Popelar, 37Madison Popelas, 32Scott H Popelier, 47Angela L Popelka, 43Dennis F Popelka, 87Eleanor J Popelka, 86Gary F Popelka, 77Gregory A Popelka, 63Lawrence L Popelka, 47

Scott Popelar Phones & Addresses

  • 8195 Old Exchange Dr, Colorado Spgs, CO 80920 (719) 536-9166
  • 8337 Twinberry Pt, Colorado Spgs, CO 80920 (719) 337-4390
  • Colorado Springs, CO
  • Carmel, IN
  • Indianapolis, IN
  • Columbus, OH
  • Evansville, IN
  • 8195 Old Exchange Dr, Colorado Spgs, CO 80920 (719) 440-0886

Work

Company: Aeroflex Jan 2007 Position: Principal r&d packaging engineer

Education

Degree: Ph.D. School / High School: The Ohio State University 1990 to 1993 Specialities: Engineering Mechanics

Skills

Electronics • Failure Analysis

Industries

Defense & Space

Resumes

Resumes

Scott Popelar Photo 1

Chief Development Engineer

View page
Location:
Colorado Springs, CO
Industry:
Defense & Space
Work:
Aeroflex since Jan 2007
Principal R&D Packaging Engineer
IC Interconnect Feb 1998 - Dec 2006
Director of Engineering
Delphi Automotive Systems Jun 1993 - Jan 1998
Advanced Process Engineer
Education:
The Ohio State University 1990 - 1993
Ph.D., Engineering Mechanics The Ohio State University 1988 - 1990
M.S., Engineering Mechanics The Ohio State University 1984 - 1988
B.S., Mechanical Engineering
Skills:
Electronics
Failure Analysis

Business Records

Name / Title
Company / Classification
Phones & Addresses
Scott Popelar
Director - Engineering
I C Interconnect LLC
Semiconductor Wafer Bumping Service Engineering Services · Telephone Communications Engineering Services · Electric Equip & Wiring Merchant Whols
1025 Elkton Dr, Colorado Springs, CO 80907
(719) 533-1030

Publications

Us Patents

Tungsten Stiffener For Flexible Substrate Assembly

View page
US Patent:
20110309491, Dec 22, 2011
Filed:
Jun 21, 2010
Appl. No.:
12/819965
Inventors:
Sean Thorne - Colorado Springs CO, US
Scott Popelar - Colorado Springs CO, US
Assignee:
Aeroflex Colorado Springs Inc. - Colorado Springs CO
International Classification:
H01L 23/488
H01L 23/498
H01L 21/60
US Classification:
257737, 438121, 257784, 257777, 257E21509, 257E23023, 257E23065
Abstract:
A flexible semiconductor package is formed by interposing a flexible substrate between a tungsten stiffener and a die. A tungsten stiffener is bonded to a first surface of the flexible substrate prior to flip chip bonding or die attach of a die to a second surface of the flexible substrate. The tungsten stiffener is dimensioned so as to substantially overlap the die and provide a rigid and flat surface on which the die/flexible substrate bonding occurs. The flat and rigid characteristic of a tungsten stiffener optimizes the electrical and mechanical bond between the die and the flexible substrate as well as minimizing CTE mismatch.
Control profile
Scott F Popelar from Colorado Springs, CO, age ~58 Get Report