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Ross Stutterheim Phones & Addresses

  • 10801 W 106Th St, Overland Park, KS 66214 (816) 997-4734
  • 6300 150Th St, Grandview, MO 64030
  • Manhattan, KS
  • Shawnee Msn, KS
  • Shawnee Msn, KS
  • Jackson, MO

Work

Company: Garmin international Jan 2010 to May 2007 Position: Software engineer

Education

School / High School: Kansas State University 2000 to 2005 Specialities: Computer Engineering, Engineering

Skills

Embedded Linux • Embedded Software • Software Engineering • C • Python • Assembly • Arm • Xscale • Omap • Low Level • Linux Kernel • Mercurial • Starteam • Jedit • Java • C++ • Device Drivers • Software Development • Software Design • Embedded Systems • Linux • Usb • Git • Debugging • Logic Analyzer • Jtag • Debuggers • I2C • Spi • Multithreading • Kernel • Embedded C • Uart • Microcontrollers • Processors • Programming • Android • Rtos • Operating Systems • Low Level Programming

Industries

Consumer Electronics

Resumes

Resumes

Ross Stutterheim Photo 1

Ross Stutterheim

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Location:
1445 Spruce St, Oxford, MI 48370
Industry:
Consumer Electronics
Work:
Garmin International Jan 2010 - May 2007
Software Engineer
Education:
Kansas State University 2000 - 2005
Skills:
Embedded Linux
Embedded Software
Software Engineering
C
Python
Assembly
Arm
Xscale
Omap
Low Level
Linux Kernel
Mercurial
Starteam
Jedit
Java
C++
Device Drivers
Software Development
Software Design
Embedded Systems
Linux
Usb
Git
Debugging
Logic Analyzer
Jtag
Debuggers
I2C
Spi
Multithreading
Kernel
Embedded C
Uart
Microcontrollers
Processors
Programming
Android
Rtos
Operating Systems
Low Level Programming

Publications

Us Patents

Methods For Memory Programming During Product Assembly

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US Patent:
20110208895, Aug 25, 2011
Filed:
Feb 22, 2010
Appl. No.:
12/710152
Inventors:
Michael R. Wiegers - Baldwin City KS, US
Travis J. Hebner - Gardner KS, US
Jay D. Schroeder - Olathe KS, US
Ross R. Stutterheim - Overland Park KS, US
Assignee:
GARMIN LTD. - Camana Bay
International Classification:
G06F 12/00
G06F 15/177
G06F 12/02
G11C 5/02
G11C 16/04
US Classification:
711103, 713 2, 365 51, 36518503, 711E12001, 711E12008
Abstract:
A method of writing data to an electronic device during assembly comprises attaching a resident memory element to one or more contact pads of a circuit board using a solder paste; reflowing the solder paste to affix the resident memory element to the contact pads; copying data from an external memory element to the resident memory element; and thereafter combining a device component with the circuit board to at least partially complete assembly of the electronic device.
Ross R Stutterheim from Overland Park, KS, age ~43 Get Report