Resumes
Resumes
Robert Rosler Phones & Addresses
-
East Longmeadow, MA
-
Granville, MA
-
50579 Hedgewood Ct, Granger, IN 46530 (574) 271-3514
-
4751 Santa Maria Dr, Toledo, OH 43614 (419) 381-1225
-
356 Hunters Run Dr, Bel Air, MD 21015 (410) 515-1226 (410) 515-3667
-
Marrero, LA
-
Dundalk, MD
-
E Longmeadow, MA
-
Englewood, FL
-
Chatham, NJ
-
Dallas, TX
-
E Longmeadow, MA
-
25 Winding Brook Ln, East Longmeadow, MA 01028 (504) 347-9600
Work
Position:
Production Occupations
Education
Degree:
High school graduate or higher
Publications
Us Patents
Flash Resistant Epoxy Encapsulating Composition And Process For Preparing Same
View pageUS Patent:
42871050, Sep 1, 1981
Filed:
Jan 14, 1980
Appl. No.:
6/112067
Inventors:
Robert K. Rosler - Toledo OH
Donald B. Gore - Swanton OH
Malcolm N. Riddell - Perrysburg OH
Earl R. Hunt - Toledo OH
Donald B. Gore - Swanton OH
Malcolm N. Riddell - Perrysburg OH
Earl R. Hunt - Toledo OH
Assignee:
Plaskon Products, Inc. - Toledo OH
International Classification:
C08L 9100
US Classification:
260 18EP
Abstract:
A flash resistant epoxy encapsulating composition and its process of manufacture. The composition comprises a blend of from about 15 to about 80 weight percent epoxy resin, from about 9 to about 82 weight percent filler, from about 0. 01 to about 2 percent catalyst by weight of resin, from about 10 to about 50 percent hardener by weight of resin, from about 3 to about 12 percent flash retardant by combined weight of resin and hardener and up to about 1. 5 weight percent lubricant. The cured blend physically consists essentially of particles intimately and entirely embedded in a matrix. The process comprises blending the components of the above blend followed by milling the resulting blend between the rolls of a differential roll mill equipped with plows where the rolls have different surface temperatures, the hotter of the rolls being near the melting temperature of the resin.
Flame Retardant Epoxy Molding Compound Method And Encapsulated Device
View pageUS Patent:
42821363, Aug 4, 1981
Filed:
Apr 9, 1979
Appl. No.:
6/028155
Inventors:
Earl R. Hunt - Toledo OH
Robert K. Rosler - Toledo OH
James O. Peterson - Sylvania OH
Robert K. Rosler - Toledo OH
James O. Peterson - Sylvania OH
International Classification:
C08L 6300
US Classification:
260 38
Abstract:
The high temperature stability of devices encapsulated with a flame retardant epoxy molding compound is improved by including in the encapsulant as synergistic flame retardant a halogen-containing organic compound (preferably of the reactive type) and antimony pentoxide. The encapsulant may be prepared from an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, the halogen-containing organic compound (which may be part of the resin or the hardener) and antimony pentoxide. Such encapsulants, when used to encapsulate semiconductor devices, have improved high temperature compatability compared to similar molding compounds with antimony trioxide or antimony tetraoxide.