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Rainer Blomberg Phones & Addresses

  • St Petersburg, FL
  • 3175 Enisgrove Dr E, Palm Harbor, FL 34683 (727) 787-0079
  • Dunedin, FL
  • Orlando, FL
  • Seminole, FL

Business Records

Name / Title
Company / Classification
Phones & Addresses
Rainer Blomberg
Staff Production Engineer
Honeywell International Inc
Mfg Aircraft Engines/Parts · Mfg Guidance and Navigational Systems · Mfg Search/Navigation Equipment · Mfg Electrical Equipment/Supplies · Search
13350 Us Hwy 19 N, Clearwater, FL 33764
(727) 539-2997, (727) 539-5080, (727) 539-4526, (727) 539-2557
Rainer Blomberg
Vice President, Director
ENISWOOD HOMEOWNERS' ASSOCIATION, INC
3175 Enisgrove Dr E, Palm Harbor, FL 34683
PO Box 1754, Palm Harbor, FL 34682

Publications

Us Patents

Electrical Component Thermal Management

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US Patent:
20110228484, Sep 22, 2011
Filed:
Mar 22, 2010
Appl. No.:
12/728947
Inventors:
Lance L. Sundstrom - Pinellas Park FL, US
Rainer Blomberg - Palm Harbor FL, US
Michael J. Gillespie - Seminole FL, US
Assignee:
Honeywell Intenational Inc. - Morristown NJ
International Classification:
H05K 7/20
H05K 1/00
H05K 3/30
US Classification:
361718, 174252, 29832
Abstract:
Thermal management features are described for use with electrical components. In some examples, an assembly includes a printed board that includes a thermally conductive thermal attach pad thermally connected to a heat sink, an electrically conductive attach pad that is separate from the thermally conductive attach pad, and an electrically conductive trace electrically connected to the electrically conductive attach pad. An electrical component can be electrically connected to the electrically conductive attach pad and the electrically conductive trace of the printed board. A thermal interface material is disposed adjacent at least a portion of a side surface of the electrical component and in contact with the thermally conductive attach pad. In this manner, the assembly may provide a thermally conductive pathway from an electrical component to the heat sink.

Printed Board Assembly Interface Structures

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US Patent:
20130010432, Jan 10, 2013
Filed:
Jul 8, 2011
Appl. No.:
13/179091
Inventors:
Lance LeRoy Sundstrom - Pinellas Park FL, US
Michael Gillespie - Seminole FL, US
Rainer Blomberg - Palm Harbor FL, US
Assignee:
HONEYWELL INTERNATIONAL INC. - Morristown NJ
International Classification:
H05K 1/16
H05K 1/00
H05K 1/09
B32B 37/02
H05K 3/00
US Classification:
361748, 156305, 29829, 174260, 174257, 174252
Abstract:
Example printed board assembly (PBA) interfaces are described. In some examples, the disclosure relates to a printed board (PB) including a conductive layer, where the PB defines a first surface and a recess in the first surface, where a surface defining the recess is at least one of electrically or thermally connected to the conductive layer, and an electrical component body mounted on the PB. The electrical component body may be mounted on the PB such that a surface of the electrical component body extends over at least a portion of the recess, where the recess extends beyond the electrical component body such that the recess defines an aperture for introducing an interface material between the surface of the electrical component body and the surface of the recess.
Rainer G Blomberg from St Petersburg, FLDeceased Get Report