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Philip R Lacourt

from Baraga, MI
Age ~71
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Also known as:
Phillip Roland Lacourt, Phil R Lacourt, Phillip R Lacourt, Philip La Court, Phillip Roland Acourt
Phone and address:
13003 Tervo Rd, Baraga, MI 49908
(906) 353-6241
Related to:
Giselher Grosskopf, 87Michael Phillips, 61Joshua K Smith, 48Julianna Waddle, 55Ronald Jackson, 56Beverly Fairchild, 77
Connected to:
Charles G Lacourt, 97Ingrid Lacourt, 54Jose Lacourt, 59Peter Lacourt, 35Tari L Lacourt, 70Carle B Lacouture, 87Jason L Lacouture, 51Jon R Lacouture, 36Leo P Lacouture, 97Ricardo M Lacouture, 55

Philip Lacourt Phones & Addresses

  • 13003 Tervo Rd, Baraga, MI 49908 (906) 353-6241
  • Keweenaw Bay, MI
  • 878 Blackwater Rd, Chillicothe, OH 45601 (740) 642-3965
  • Jackson, OH
  • 13003 Tervo Rd, Baraga, MI 49908 (740) 642-3965

Work

Position: Retired senior technical consultant

Education

Degree: Graduate or professional degree

Industries

Design

Resumes

Resumes

Philip Lacourt Photo 1

Retired Senior Technical Consultant

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Location:
13003 Tervo Rd, Baraga, MI 49908
Industry:
Design
Work:

Retired Senior Technical Consultant

Publications

Us Patents

Dielectric Substrates Comprising A Polymide Core Layer And A High Temperature Fluoropolymer Bonding Layer, And Methods Relating Thereto

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US Patent:
7022402, Apr 4, 2006
Filed:
Jul 14, 2003
Appl. No.:
10/620089
Inventors:
Philip Roland Lacourt - Chillicothe OH, US
Assignee:
E. I. du Pont de Nemours and Company - Wilmington DE
International Classification:
B32B 1/00
B32B 7/12
B32B 15/02
B32B 27/08
US Classification:
428215, 428336, 428337, 428380, 428422, 4284735
Abstract:
An asymmetric multi-layer insulative film of improved internal adhesive strength is made by combining a layer of polyimide and a high-temperature bonding layer, the high-temperature bonding layer being derived from a high temperature base polymer made of poly(tetrafluoroethylene-co-perfluoro[alkyl vinyl ether]) (PFA) and optionally blended with from 0–60 weight percent poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP). The polyimide and high-temperature bonding layer laminate optionally also contains a layer of unsintered, partially sintered, or totally sintered polytetrafluoroethylene (PTFE) bonded directly to the high-temperature bonding layer. In addition, the polyimide high-temperature bonding layer laminate may be adhered to a poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) adhesive primer layer to more effectively bond the polyimide core layer to the high-temperature bonding layer. This type of primer layer may also be used as a polyimide-to-metal bonding layer to assist bonding of the polyimide to a metal wire or metal layer.

Device Capable Of Thermally Cooling While Electrically Insulating

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US Patent:
20090229809, Sep 17, 2009
Filed:
Feb 12, 2009
Appl. No.:
12/369771
Inventors:
Brian C. AUMAN - Pickerington OH, US
Carl HAEGER - Reynoldsburg OH, US
Philip Roland LACOURT - Chillicothe OH, US
Mark Elliott MCALEES - Circleville OH, US
Stanley Duane MERRITT - Bear DE, US
George Wyatt PREJEAN - ORANGE TX, US
Harland Lee TATE - Golden CO, US
Assignee:
E. I. DU PONT DE NEMOURS AND COMPANY - Wilmington DE
International Classification:
F28F 7/00
US Classification:
165185
Abstract:
The present disclosure relates to a device for thermally cooling while electrically insulating. The device contains a first adhesive layer, polyimide substrate, a second adhesive layer and a heat sink. The first adhesive layer and the second adhesive layer are a vinyl or acrylic polymer. The polyimide substrate has at least two polyimide layers. The polyimide layers are derived from at least one aromatic dianhydride and at least one aromatic diamine. The adhesive layers and the polyimide layers may contain thermally conductive fillers, light absorbing pigments or mixtures of both.

Multilayer Insulation For Wire, Cable Or Other Conductive Materials

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US Patent:
20090297858, Dec 3, 2009
Filed:
May 29, 2008
Appl. No.:
12/128689
Inventors:
DANNY E. GLENN - Circleville OH, US
BRIAN C. AUMAN - Pickerington OH, US
KUPPUSAMY KANAKARAJAN - Dublin OH, US
PHILIP ROLAND LACOURT - Chillicothe OH, US
Assignee:
E. I. DU PONT DE NEMOURS AND COMPANY - Wilmington DE
International Classification:
B32B 27/00
US Classification:
428421
Abstract:
The present disclosure relates to a multilayer insulation structure having superior abrasion resistance. The multilayer insulation structure has a first polyimide outer layer, a polyimide core layer and an optional second polyimide outer layer. The first and second polyimide outer layers contain a fluoropolymer micropowder. The first and second polyimide outer layers have a combined weight of from 10 to 80 weight % of the total weight of the multilayer insulation structure. The abrasion resistance of the multilayer insulation structure is from 1500 to 18300 scrape cycles. The multilayer insulation structure is useful as wire or cable insulation wrap.

Device Capable Of Thermally Cooling While Electrically Insulating

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US Patent:
20100108140, May 6, 2010
Filed:
Oct 30, 2009
Appl. No.:
12/609271
Inventors:
Brian C. Auman - Pickerington OH, US
Carl Haeger - Reynoldsburg OH, US
Philip Roland Lacourt - Chillicothe OH, US
Mark Elliott McAlees - Circleville OH, US
Stanley Duane Merritt - Bear DE, US
George Wyatt Prejean - Orange TX, US
Harland Lee Tate - Golden CO, US
Assignee:
E. I. DU PONT DE NEMOURS AND COMPANY - Wilmington DE
International Classification:
H01L 31/042
US Classification:
136256
Abstract:
The present disclosure relates to a device for thermally cooling while electrically insulating. The device contains a first adhesive layer, substrate, a second adhesive layer and a heat sink. The first adhesive layer and the second adhesive layer are a vinyl or acrylic based polymer. The adhesive layers and the substrate may contain thermally conductive fillers, light absorbing pigments or mixtures of both.

High Temperature Polyimide-Fluoropolymer Laminar Structure

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US Patent:
53994345, Mar 21, 1995
Filed:
Dec 21, 1993
Appl. No.:
8/170842
Inventors:
Morton Katz - Columbus OH
Philip R. LaCourt - Chillicothe OH
Assignee:
E. I. Du Pont de Nemours and Company - Wilmington DE
International Classification:
B32B 2708
H01B 344
US Classification:
428421
Abstract:
Laminar structures having a polyimide core layer, inner fluorinated ethylenepropylene copolymer (FEP) layers, intermediate polytetrafluoroethylene homopolymer (PTFE) and fluorinated ethylenepropylene copolymer (FEP) blend layers and outer fluorinated ethylenepropylene copolymer (FEP) layers for use in the form of narrow tapes as an insulating wire or cable wrap.
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Philip R Lacourt from Baraga, MI, age ~71 Get Report