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Peter Ebbing Phones & Addresses

  • 847 Riverside Dr, Los Altos Hills, CA 94024 (650) 941-3018
  • Los Altos, CA
  • Sunnyvale, CA
  • 847 Riverside Dr, Los Altos, CA 94024

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Company: Retired Position: Retired

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Peter Ebbing

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Location:
Los Altos, CA
Industry:
Arts And Crafts
Work:
Retired
Retired

Publications

Us Patents

Method And Apparatus To Inhibit Obstruction Of Optical Transmission Through Semiconductor Etch Process Chamber Viewport

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US Patent:
51299941, Jul 14, 1992
Filed:
Apr 23, 1991
Appl. No.:
7/690137
Inventors:
Peter F. Ebbing - Los Altos CA
Kien N. Chuc - San Jose CA
Jack Ford - San Jose CA
Fred H. Hariz - Fremont CA
Michael N. Sugarman - San Francisco CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
H01L 21306
B44C 122
US Classification:
156643
Abstract:
A method and apparatus are described for inhibiting visual obstruction of the window of a semiconductor etch process chamber by deposition of each byproducts thereon by selectively heating the window surfaces adjacent one edge of the window to thereby form a cool region on the window surfaces adjacent the opposite edge of the window whereby the center of the window will remain substantially clear of such depositions. The apparatus for carrying out the method of the invention comprises a first heat transmitting structure disposed on one surface of an optically transparent window adjacent one edge, and a second heat transmitting structure disposed on the opposite surface of the optically transparent window adjacent the same edge to thereby provide even heating of both surfaces of the window adjacent the one edge, thereby creating a cooler zone on the window surfaces adjacent the opposite edge of the window.

Etch Rate Monitor Using Collimated Light And Method Of Using Same

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US Patent:
53371445, Aug 9, 1994
Filed:
May 5, 1992
Appl. No.:
7/880464
Inventors:
Bruno Strul - Palo Alto CA
Richard de Geus - Cupertino CA
Peter Ebbing - Los Altos CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
G01B 902
US Classification:
356357
Abstract:
An etch rate monitor for use with semiconductor wafer etching processes includes a source of light of normal incidence to the wafer surface through a window in the etching chamber. In a first embodiment, a Fresnel or positive lens is used to collect some of the diffraction orders caused by the repetitive patterns on the wafer surface which merge from the window. In alternate embodiments, a concave spherical mirror and/or a photodetector system are used to collect the diffraction orders. A collimating lens applies these diffraction orders of normal incidence to interference filters which reject plasma and ambient light and pass the diffraction orders to a photodetector to monitor etch rate as a function of the cycle period between interference minima or maxima caused by the difference in path length between the etched and not etched surfaces of the wafer.

On The Fly Center-Finding During Substrate Handling In A Processing System

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US Patent:
61989762, Mar 6, 2001
Filed:
Mar 4, 1998
Appl. No.:
9/034808
Inventors:
Satish Sundar - Mountain View CA
Peter F. Ebbing - Los Altos CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
G05B 1918
US Classification:
700 59
Abstract:
A substrate center-finding method and apparatus, for determining the center of a substrate being passed through a substrate handling chamber of a substrate processing system, includes any number of sensors arranged in any configuration and permits the substrate to pass through any trajectory that triggers the sensors. The locations of the sensors are calibrated by homing in on the sensors using a point, the reference point, near the tip of an arm assembly on a substrate handler. The substrate handler has an encoder for sensing the pivot angles of links in the arm assembly, whereby the coordinates of the reference point can be calculated from the angles and lengths of the links. When the substrate triggers a sensor, the location of the reference point is again calculated, and the coordinates of the trigger point on the edge of the substrate is determined relative to the reference point. A suitable number of trigger points on the edge of a circular substrate will define a circle, so the center of the circle can be calculated, and the location of the substrate can be adjusted to account for any offset from the reference point.

Substrate Clamping Apparatus

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US Patent:
61557730, Dec 5, 2000
Filed:
Sep 22, 1997
Appl. No.:
8/935293
Inventors:
Peter F. Ebbing - Los Altos CA
Satish Sundar - Mountain View CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
B66C 2300
B25J 1500
US Classification:
4147445
Abstract:
The present invention generally provides a robot that can transfer two workpieces, such as silicon wafers, simultaneously and at increased speeds and accelerations and decelerations. More particularly, the present invention provides a robot wrist associated with the robot arm for mechanically clamping a workpiece to a workpiece handling member attached to the arm. The wafer clamp selectively applies sufficient force to hold the workpiece and prevent slippage and damage to the workpiece during rapid rotation and linear movement of the handling member. In one embodiment, a clamp for securing silicon wafers uses two clamp fingers connected to a single flexure member to position and hold the wafer with minimal particle generation and wafer damage. The clamp is designed so that wafers are normally clamped except near fall extension of the workpiece handling member to deliver or pick up a wafer.

Method And Apparatus For Endpoint Detection In A Semiconductor Wafer Etching System

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US Patent:
50774646, Dec 31, 1991
Filed:
Feb 5, 1991
Appl. No.:
7/652297
Inventors:
Peter Ebbing - Los Altos CA
Manoocher Birang - Santa Clara CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
G01J 120
US Classification:
2502014
Abstract:
A method for focussing a radiant energy beam characterized by the steps of scanning a beam of radiant energy across a test pattern including areas of differing reflectivity, detecting the variance in a reflected portion of the scanned beam and adjusting the beam to minimize the variance. Preferably, the test pattern includes areas of varying widths, e. g. relatively non-reflective areas of varying widths separated by reflective areas of uniform widths. As the beam is scanned perpendicularly across the test pattern it will be highly reflected by the reflective areas and will be partially absorbed by the non-reflective areas. If the beam is wider than a non-reflective area a portion of the beam will be absorbed and a portion of the beam will be reflected, resulting in a greater total reflection than if the beam is narrower than the non-reflective region. In consequence, the intensity of the reflected beam will vary as the energy beam is scanned across the test pattern as it encounters non-reflective areas of varying widths. The amount of variance in the reflected beam is related to the width of the beam and, therefore, the beam can be focussed by adjusting the beam to minimize this variance.

Method And Apparatus For Reducing Particulate Generation Caused By Door Or Cover Flexing On High Vacuum Equipment

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US Patent:
52635180, Nov 23, 1993
Filed:
Dec 6, 1991
Appl. No.:
7/806826
Inventors:
Peter Ebbing - Los Altos CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
B65B 3100
US Classification:
141 7
Abstract:
An inner lid is attached to a vacuum chamber, covering an inner region of the vacuum chamber. An outer lid, also attached to the vacuum chamber, covers the inner lid, leaving a region between the inner lid and the outer lid. A gas conduit allows gas to flow between the inner region of the vacuum chamber and the region between the inner lid and the outer lid. A filter is placed in or immediately outside the gas conduit to prevent particles from entering the inner region of the vacuum chamber from the region between the inner lid and the outer lid. Since the pressure is the same on the top and bottom of the inner lid, the inner lid does not flex and thus does not rub against the vacuum chamber when the vacuum chamber is pumped down or vented up.

Method And Apparatus For Reducing Particulate Generation Caused By Door Or Cover Flexing On High Vacuum Equipment

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US Patent:
52190072, Jun 15, 1993
Filed:
Dec 6, 1991
Appl. No.:
7/802936
Inventors:
Peter Ebbing - Los Altos CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
B65B 3100
US Classification:
141 7
Abstract:
An inner lid is attached to a vacuum chamber, covering an inner region of the vacuum chamber. An outer lid, also attached to the vacuum chamber, covers the inner lid, leaving a region between the inner lid and the outer lid. A gas conduit allows gas to flow between the inner region of the vacuum chamber and the region between the inner lid and the outer lid. A filter is placed in or immediately outside the gas conduit to prevent particles from entering the inner region of the vacuum chamber from the region between the inner lid and the outer lid. Since the pressure is the same on the top and bottom of the inner lid, the inner lid does not flex and thus does not rub against the vacuum chamber when the vacuum chamber is pumped down or vented up.

Pneumatic Circuit To Provide Different Opening And Closing Speeds For A Pneumatic Operator

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US Patent:
54657466, Nov 14, 1995
Filed:
Jan 13, 1994
Appl. No.:
8/181518
Inventors:
Peter F. Ebbing - Los Altos CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
F15B 1304
US Classification:
137 14
Abstract:
A pneumatic circuit prolongs a pneumatic valve opening time using an accumulator with two quick exhaust type valves in series while providing a rapid valve closing time. This structure and method is self-contained and amenable to retrofit in existing installations without any external connections. Slow opening is achieved by routing inlet gas pressure simultaneously to an accumulator and the operating cylinder of the valve to be opened. A tortuous piping path and increased volume to be pressurized due to the addition of the accumulator substantially reduces the isolation valve opening time, thereby eliminating problems associated with quick opening of a pneumatic valve. When the pneumatic valve needs to be closed quickly, slight venting toward the inlet valve immediately causes the quick exhaust valves to vent their downstream pressure. The accumulator then vents through its quick exhaust valve while separately the main quick exhaust valve quickly vents the air cylinder of the pneumatic valve. Closing times penalties of less than 50 milliseconds can be achieved using this configuration and opening times can be increased by adjusting the volume of the accumulator.
Peter F Ebbing from Los Altos, CA, age ~86 Get Report