Peter M Dedobbelaere

20130044978, Feb 21, 2013

Jun 27, 2012

13/535320

Peter DeDobbelaere - San Diego CA, US
Mark Peterson - San Diego CA, US
Steffen Gloeckner - San Diego CA, US

G02B 6/32

385 33

Methods and systems for a multi-core fiber connector are disclosed and may include communicating optical signals in a fiber comprising a multi-core. The connectors may comprise dimensions to fit one or more of: SC, LC, FC, or MU connectors. The optical signals may be collimated utilizing a lens in the connectors, and may comprise a graded-index (GRIN) lens or a ball lens. The connectors may comprise a ferrule assembly that encompasses an end of the optical fiber and is at least partially within a stem assembly. The ferrule assembly may comprise zirconia and the stem assembly may comprise stainless steel. The lens may be fixed adjacent to the ferrule assembly utilizing a stainless steel tube. The collimated optical signals may be communicated to a receiving lens that may focus the collimated optical signals onto a plurality of optical cores in a receiving optical fiber.

20120301149, Nov 29, 2012

Aug 7, 2012

13/568406

Thierry Pinguet - Vashon WA, US
Sherif Abdalla - Carlsbad CA, US
Mark Peterson - San Diego CA, US
Gianlorenzo Masini - Carlsbad CA, US
Peter DeDobbelaere - San Diego CA, US

H04B 10/02

398115

Methods and systems for hybrid integration of optical communication systems are disclosed and may include receiving continuous wave (CW) optical signals in a silicon photonics die (SPD) from an optical source external to the SPD. The received CW optical signals may be processed based on electrical signals received from an electronics die bonded to the SPD via metal interconnects. Modulated optical signals may be received in the SPD from optical fibers coupled to the SPD. Electrical signals may be generated in the SPD based on the received modulated optical signals and communicated to the electronics die via the metal interconnects. The CW optical signals may be received from an optical source assembly coupled to the SPD and/or from one or more optical fibers coupled to the SPD. The received CW optical signals may be processed utilizing one or more optical modulators, which may comprise Mach-Zehnder interferometer modulators.

20200183109, Jun 11, 2020

Feb 18, 2020

16/793408

- Carlsbad CA, US
Brian Welch - San Diego CA, US
Steffen Gloeckner - San Diego CA, US
Peter DeDobbelaere - San Diego CA, US
Michael Mack - San Diego CA, US

G02B 6/43
G02B 6/42

Methods and systems for an optical coupler for photonics devices are disclosed and may include a photonics transceiver comprising a silicon photonics die and a fiber connector for receiving optical fibers and including a die coupler and an optical coupling element. The die coupler may be bonded to a top surface of the photonics die and aligned above an array of grating couplers. The optical coupling element may be attached to the die coupler and the electronics die and the source module may be bonded to the top surface of the photonics die. Modulated optical signals may be received in the photonics die from optical fibers coupled to the fiber connector.

20200186252, Jun 11, 2020

Feb 13, 2020

16/789792

- Carslbad CA, US
Peter DeDobbelaere - San Diego CA, US

H04B 10/54
H04B 10/50
H04B 10/032

Methods and systems for redundant light sources by utilizing two inputs of an integrated modulator are disclosed and may include: an optoelectronic transmitter with first and second laser sources for providing optical signals to the transmitter, the transmitter comprising an optical modulator with a first input waveguide coupled to the first laser source and second input waveguide coupled to the second laser source, the optoelectronic receiver being operable to: configure the first laser source to provide an optical signal to the first input of the optical modulator; and if the first laser source does not provide an optical signal, configure the second laser source to provide an optical signal to the second input of the optical modulator. The first laser source may be optically coupled to the first input waveguide and the second laser source optically coupled to the second input waveguide using grating couplers.

20190288778, Sep 19, 2019

Jun 4, 2019

16/430679

Greg Young - Irvine CA, US
Peter DeDobbelaere - San Diego CA, US

H04B 10/54
H04B 10/50
H04B 10/032

Methods and systems for redundant light sources by utilizing two inputs of an integrated modulator are disclosed and may include: an optoelectronic transmitter in a semiconductor die with first and second laser sources for providing optical signals to the semiconductor die, the transmitter comprising an optical modulator with a first input waveguide coupled to the first laser source and second input waveguide coupled to the second laser source, the optoelectronic receiver being operable to: configure the first laser source to provide an optical signal to the first input of the optical modulator; and if the first laser source does not provide an optical signal, configure the second laser source to provide an optical signal to the second input of the optical modulator. The first laser source may be optically coupled to the first input waveguide and the second laser source optically coupled to the second input waveguide using grating couplers.

20190238228, Aug 1, 2019

Apr 8, 2019

16/378119

- Carlsbad CA, US
Peter DeDobbelaere - San Diego CA, US
Kosei Yokoyama - San Diego CA, US
Sherif Abdalla - Carlsbad CA, US
Steffen Gloeckner - San Diego CA, US
John Guckenberger - San Diego CA, US
Thierry Pinguet - Arlington WA, US
Gianlorenzo Masini - Carlsbad CA, US
Daniel Kucharski - Carlsbad CA, US

H04B 10/2575
H01L 27/12
H04B 10/40
H01L 21/84

Methods and systems for monolithic integration of photonics and electronics in CMOS processes are disclosed and may include fabricating photonic and electronic devices on two CMOS wafers with different silicon layer thicknesses. The devices may be fabricated on semiconductor-on-insulator (SOI) wafers utilizing a bulk CMOS process and/or on a SOI wafer utilizing a SOI CMOS process. The different thicknesses may be fabricated utilizing a double SOI process and/or a selective area growth process. Cladding layers may be fabricated utilizing one or more oxygen implants and/or utilizing CMOS trench oxide on the CMOS wafer. Silicon may be deposited on the CMOS trench oxide utilizing epitaxial lateral overgrowth. Cladding layers may be fabricated utilizing selective backside etching. Reflective surfaces may be fabricated by depositing metal on the selectively etched regions. Silicon dioxide or silicon germanium integrated in the CMOS wafer may be utilized as an etch stop layer.

20190212511, Jul 11, 2019

Mar 14, 2019

16/353601

Michael Mack - San Diego CA, US
Mark Peterson - San Diego CA, US
Steffen Gloeckner - San Diego CA, US
Adithyaram Narasimha - Carlsbad CA, US
Roger Koumans - Irvine CA, US
Peter DeDobbelaere - San Diego CA, US

G02B 6/43
H04B 10/50
G02B 26/10
G02B 6/42
G02B 6/34

Methods and systems for a light source arrangement supporting direct coupling to a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed. The arrangement may include a laser, a microlens, a turning mirror, reciprocal and/or non-reciprocal polarization rotators, and an optical bench. The laser may generate an optical signal that may be focused utilizing the microlens. The optical signal may be reflected at an angle defined by the turning mirror, and may be transmitted out of the light source arrangement to one or more grating couplers in the chip. The laser may include a feedback insensitive laser. The light source arrangement may include two electro-thermal interfaces between the optical bench, the laser, and a lid affixed to the optical bench. The turning mirror may be integrated in a lid affixed to the optical bench or may be integrated in the optical bench.

20180013494, Jan 11, 2018

Jul 6, 2017

15/642763

- Carlsbad CA, US
Peter DeDobbelaere - San Diego CA, US

H04B 10/40
H04J 14/04
H04J 14/02
H04B 10/80
H04B 10/2581
H04L 29/06
G02B 6/30

Methods and systems for selectable parallel optical fiber and WDM operation may include an optoelectronic transceiver integrated in a silicon photonics die. The optoelectronic transceiver may, in a first communication mode, communicate continuous wave (CW) optical signals from an optical source module to a first subset of optical couplers on the die for processing signals in optical modulators in accordance with a first communications protocol, and in a second communication mode, communicate the CW optical signals to a second subset of optical couplers for processing signals in the optical modulators in accordance with a second communications protocol. Processed signals may be transmitted out of the die utilizing a third subset of the optical couplers. First or second protocol optical signals may be received from the fiber interface coupled to a fourth subset or a fifth subset, respectively, of the optical couplers.