Paul H Kydd

6379745, Apr 30, 2002

Aug 20, 1999

09/367783

Paul H. Kydd - Lawrenceville NJ
Gregory A. Jablonski - Yardley PA
David L. Richard - Fanwood NJ

Parelec, Inc. - Rocky Hill NJ

B05D 512

427 96, 427229, 427261, 427287, 106 118, 106 121, 430119, 430126

A composition of matter having a metal powder or powders of specified characteristics in a Reactive Organic Medium (TOM). These compositions can be applied by any convenient printing process to produce patterns of electrical conductors on temperature-sensitive electronic substrates. The patterns can be thermally cured in seconds to form pure metal conductors at a temperature low enough to avoid damaging the substrate.

6743319, Jun 1, 2004

Oct 4, 2002

10/265513

Paul H. Kydd - Lawrenceville NJ

Paralec Inc. - Rocky Hill NJ

B65C 1165

156230, 156233, 156240, 156247, 156277, 156289, 1562733, 427 96, 427148, 428201, 428202, 428208, 428914, 174257

An electronic circuit is made by printing a Parmod composition on a temporary substrate and curing it to produce a pattern of metal conductors. The conductors are laminated to a substrate under heat and pressure to produce a laminate with the metal prepatterned into the desired circuit configuration. The conductor can also be coated with a polymer and cured to form a prepatterned substrate. Single and double-sided circuits or multilayers can be made this way.

7014727, Mar 21, 2006

Jul 7, 2003

10/612904

Christopher Wargo - Highland Park NJ, US
Paul Kydd - Lawrenceville NJ, US
Scott Mathews - Germantown MD, US
Susan Gordon, legal representative - Washington DC, US
Chengping Zhang - Rockville MD, US
Todd A. Kegresse - Catonsville MD, US

Potomac Photonics, Inc. - Lanham MD
Parelec, Inc. - Rocky Hill NJ

B29C 65/02
B29C 65/50
B32B 37/12
B32B 38/04
B05D 5/12

156247, 156248, 156257, 29 2501, 427 63, 427 961, 427290

A method of forming high resolution electronic circuits () on a substrate () is provided. The method includes the steps of laminating a dielectric layer () on a substrate (), laser drilling channels ( and ) in the dielectric film () and the substrate (), and filling channels ( and ) with a filler material (). Further, a release layer () is applied to dielectric film layer () and filler material (), the release layer () having an adhesive thereon. Release layer () is peeled or otherwise removed from substrate (), leaving filler material () formed and shaped on substrate (), thus producing a high resolution electronic circuit on substrate ().

7014885, Mar 21, 2006

Jul 19, 2000

09/619442

Alberto Piqué - Bowie MD, US
Raymond Auyeung - Alexandria VA, US
James Fitzgerald - Laurel MD, US
Douglas B. Chrisey - Bowie MD, US
Paul Kydd - Lawrenceville NJ, US
David L. Richard - Fanwood NJ, US

The United States of America as represented by the Secretary of the Navy - Washington DC

C23C 14/28
C23C 14/30
B05D 3/00

427294, 427553, 427595, 427596

A device and method for depositing a material of interest onto a receiving substrate includes a first laser and a second laser, a receiving substrate, and a target substrate. The target substrate comprises a laser transparent support having a back surface and a front surface. The front surface has a coating that comprises the source material, which is a material that can be transformed into the material of interest. The first laser can be positioned in relation to the target substrate so that a laser beam is directed through the back surface of the target substrate and through the laser-transparent support to strike the coating at a defined location with sufficient energy to remove and lift the source material from the surface of the support. The receiving substrate can be positioned in a spaced relation to the target substrate so that the source material is deposited at a defined location on the receiving substrate. The second laser is then positioned to strike the deposited source material to transform the source material into the material of interest.

7115218, Oct 3, 2006

Jun 28, 2001

10/481994

Paul H. Kydd - Lawrenceville NJ, US
Gregory A. Jablonski - Yardley PA, US
David L. Richard - Fanwood NJ, US

Parelec, Inc. - Rocky Hill NJ

H01B 1/22
B05D 5/12

252512, 252514, 427 96, 427123, 427125, 427384

A composition of matter having a metal powder or powders of specified characteristics in a Reactive Organic Medium (ROM). These compositions can be applied by any convenient printing process to produce patterns of electrical conductors on temperature-sensitive electronic substrates. The pattern can be thermally cured in seconds to form pure metal conductors at a temperature low enough to avoid damaging the substrate.

7141185, Nov 28, 2006

Jan 29, 2003

10/354154

Brian F. Conaghan - Princeton NJ, US
Paul H. Kydd - Lawrenceville NJ, US
David L. Richard - Fanwood NJ, US

Parelec, Inc. - Rocky Hill NJ

H01B 1/02
H01B 1/06
B22F 5/00
B22F 7/00

252514, 252500, 252511, 252512, 106 113, 106 115, 106 119, 427216, 427220, 427596, 4301083, 430119, 156230, 156233, 75255, 524439

Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a substrate coated with a cure temperature reducing agent to reduce the curing temperatures.

7211205, May 1, 2007

Jan 29, 2003

10/353837

Brian F. Conaghan - Princeton NJ, US
Gregory A. Jablonski - Yardley PA, US
Paul H. Kydd - Lawrenceville NJ, US
Isabel Mendoza - Middletown NJ, US
David L. Richard - Fanwood NJ, US

Parelec, Inc. - Rocky Hill NJ

H01B 1/02
H01B 1/06
B22F 5/00
B22F 7/00

252514, 250500, 250512, 250511, 2505193, 106 113, 106 115, 106 119, 427 96, 427294, 427553, 430115, 4302701

Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates.

7681676, Mar 23, 2010

Jan 17, 2007

11/654179

Paul Harriman Kydd - Lawrenceville NJ, US

B60K 6/20

180 6521, 180 6522

An assembly is described for converting an Internal Combustion (IC) vehicle to an IC-electric hybrid vehicle comprising a battery, a battery charger, a controller, an electric motor and a power transmission means involving a flexible rotational speed reduction to connect the motor to a drive shaft of the vehicle. The system can be made available in the form of a kit allowing those skilled in automobile mechanics to perform the conversion. Regenerative braking and provision of AC power from the vehicle can be made available as options.