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Oleh B Dutkewych

from Chatham, MA
Age ~84
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Related to:
Adrien Lexander Dutkewych
Connected to:
Francis A Dutkewycz, 39Katie A Dutkiewicz, 34Kyle A Dutkiewicz, 46Norman J Dutkiewicz, 64Timothy J Dutkiewicz, 47Raymond T Dutkin, 59Brian L Dutko, 56Peter J Dutko, 69Vladimir Dutko, 96Jeffrey S Dutky, 57

Oleh Dutkewych Phones & Addresses

  • 16 Lakeview Ave, Chatham, MA 02633 (508) 945-6499
  • Westfield, MA
  • 198 Stow Rd, Harvard, MA 01451 (978) 456-8561
  • 16 Lakeview Ave, Chatham, MA 02633 (508) 930-8782

Work

Position: Administrative Support Occupations, Including Clerical Occupations

Public records

Vehicle Records

Oleh Dutkewych

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Address:
79 Prospect Hl Rd, Harvard, MA 01451
Phone:
(978) 456-8605
VIN:
1GKFK16357R429527
Make:
GMC
Model:
YUKON XL
Year:
2007

Business Records

Name / Title
Company / Classification
Phones & Addresses
Oleh Dutkewych
Assistant Vice President-financial Advisor
Morgan Stanley & Co Inc
6 Park Ave STE 1, Worcester, MA 01605
(508) 849-5500

Publications

Us Patents

Seed Layer Deposition

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US Patent:
6824665, Nov 30, 2004
Filed:
Oct 17, 2001
Appl. No.:
09/978797
Inventors:
James G. Shelnut - Northboro MA
David Merricks - Coventry, GB
Oleh B. Dutkewych - Chatham MA
Charles R. Shipley - Auburndale MA
Assignee:
Shipley Company, L.L.C. - Marlborough MA
International Classification:
C23C 2802
US Classification:
205102, 205123, 205191, 205291, 205916, 427 96, 427305, 427437, 4274431, 438622, 438627, 438678, 438687
Abstract:
Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.

Catalytic Metal Of Reduced Particle Size

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US Patent:
47253142, Feb 16, 1988
Filed:
Sep 17, 1986
Appl. No.:
6/908277
Inventors:
Michael Gulla - Sherborn MA
Oleh B. Dutkewych - Harvard MA
John J. Bladon - Wayland MA
Assignee:
Shipley Company Inc. - Newton MA
International Classification:
B22F 700
C09D 500
C23C 1600
B05B 118
US Classification:
106 111
Abstract:
A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.

Electroless Alloy Plating

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US Patent:
44825960, Nov 13, 1984
Filed:
Aug 25, 1982
Appl. No.:
6/411346
Inventors:
Michael Gulla - Sherborn MA
Oleh B. Dutkewych - Harvard MA
Assignee:
Shipley Company Inc. - Newton MA
International Classification:
B32B 310
B32B 1504
US Classification:
428131
Abstract:
A structure having a catalytic surface plated with an autocatalytic electroless alloy of copper, a metal selected from nickel, cobalt, mixtures thereof and phosphorous.

Catalytic Metal Of Reduced Particle Size

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US Patent:
46523111, Mar 24, 1987
Filed:
Jan 16, 1985
Appl. No.:
6/691880
Inventors:
Michael Gulla - Sherborn MA
Oleh B. Dutkewych - Harvard MA
John J. Bladon - Wayland MA
Assignee:
Shipley Company Inc. - Newton MA
International Classification:
C23C 302
US Classification:
106 111
Abstract:
A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms and the organic suspending agent is one capable of complexing with ions of the catalytic metal. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.

Catalytic Metal Of Reduced Particle Size

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US Patent:
46344683, Jan 6, 1987
Filed:
May 7, 1984
Appl. No.:
6/607649
Inventors:
Michael Gulla - Sherborn MA
Oleh B. Dutkewych - Harvard MA
John J. Bladon - Wayland MA
Assignee:
Shipley Company Inc. - Newton MA
International Classification:
C23C 302
US Classification:
106 111
Abstract:
A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.

Ductile Electroless Copper

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US Patent:
46955054, Sep 22, 1987
Filed:
Oct 25, 1985
Appl. No.:
6/791597
Inventors:
Oleh B. Dutkewych - Harvard MA
Assignee:
Shipley Company Inc. - Newton MA
International Classification:
B05D 100
B05D 306
US Classification:
428209
Abstract:
An electroless copper deposit having an elongation capability of at least 10 percent as determined by a mechanical bulge test on a foil having a thickness of between 1. 5 and 2. 0 mils.
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Oleh B Dutkewych from Chatham, MA, age ~84 Get Report