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Neeraj A Pendse

from Palo Alto, CA
Age ~47
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Related to:
Rajani PendseAvani PendseAnil M Pendse
Connected to:
Bhargav M Pendse, 48Gaurav R Pendse, 33Janhavi V Pendse, 43Sneha R Pendse, 39Kalpana R Pendurty, 52John M Pendy, 32William J Pendy, 94Anusha Pendyala, 36Madhavi Pendyala, 44Mahesh Pendyala, 39

Neeraj Pendse Phones & Addresses

  • 352 Middlefield Rd, Palo Alto, CA 94301
  • 444 Webster St, Palo Alto, CA 94301
  • Fremont, CA
  • 2350 Eunice St, Berkeley, CA 94708
  • 426 Escuela Ave, Mountain View, CA 94040
  • 426 Escuela Ave #18, Mountain View, CA 94040
  • 126 Ahwanee Ave, Sunnyvale, CA 94085
  • Hyattsville, MD
  • Santa Clara, CA

Professional Records

License Records

Neeraj Pendse

Address:
352 Middlefield Rd, Palo Alto, CA 94301
License #:
A4305107
Category:
Airmen

Resumes

Resumes

Neeraj Pendse Photo 1

Vp, Head Of Products

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Location:
Palo Alto, CA
Industry:
Computer Hardware
Work:
Elo Touch Solutions since Aug 2011
Senior Manager, Product Management
Elo TouchSystems Mar 2010 - Jul 2011
Business Development Manager
A.T. Kearney, San Francisco Jul 2007 - Mar 2010
Management Consultant
National Semiconductor Corp Mar 2000 - Aug 2005
Senior Engineer
Education:
University of California, Berkeley - Walter A. Haas School of Business 2005 - 2007
MBA, Business Administration and Management, General University of Maryland College Park 1998 - 1999
M.S., Engineering Visvesvaraya National Institute of Technology 1994 - 1998
BE, Electrical Engineering Somawar High
Skills:
Product Management
Competitive Analysis
Product Marketing
Business Development
Go To Market Strategy
Strategy
Cross Functional Team Leadership
Product Development
Strategic Partnerships
Strategic Planning
Management Consulting
Product Launch
Business Strategy
Leadership
Market Analysis
Manufacturing
Management
Program Management
Pricing
Semiconductors
Software As A Service
Saas
Pricing Strategy
Languages:
English
Hindi
Marathi
Certifications:
Private Pilot, Airplane Single Engine Land
Private Pilot, Instrument Airplane
Federal Aviation Administration - Faa, License Xxxx789
Federal Aviation Administration, License Xxxx789
License Xxxx789
Neeraj Pendse Photo 2

Neeraj Pendse

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Publications

Us Patents

Ceramic Optical Sub-Assembly For Opto-Electronic Module Utilizing Ltcc (Low-Temperature Co-Fired Ceramic) Technology

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US Patent:
6767140, Jul 27, 2004
Filed:
Mar 3, 2003
Appl. No.:
10/379474
Inventors:
Neeraj Anil Pendse - Mountain View CA
Bruce Carlton Roberts - San Jose CA
Jia Liu - San Jose CA
Lionel Auzereau - Le Cannet, FR
Christopher Barratt - Villeneuve-Loubet, FR
Assignee:
National Semiconductor Corporation - Santa Clara CA
International Classification:
G02B 636
US Classification:
385 89, 385 88
Abstract:
A high performance ceramic block for use with small-scale circuitry is described. The block can be used in an optical sub-assembly (OSA) suitable for optical interconnection with optical fibers and electrical interconnection with a chip sub-assembly (CSA) is formed. The block includes a first surface and a second surface and is formed using one of low temperature co-fired ceramic (LTCC) and high temperature co-fired ceramic (HTCC) techniques. Photonic devices are formed on the first surface of the ceramic block and electrical contacts are formed on a second surface of the block. The electrical contacts being suitable for electrical communication with a chip sub-assembly. Electrical connections are formed so that they pass internally through the ceramic block to electrically interconnect the photonic devices on the first face of the block with the electrical contacts on the second face of the block. Such a block can be advantageously used to form an optoelectronic module.

Integrated Circuit Packages With Interconnects On Top And Bottom Surfaces

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US Patent:
6803648, Oct 12, 2004
Filed:
Jan 10, 2003
Appl. No.:
10/341328
Inventors:
Nikhil Kelkar - San Jose CA
Neeraj Anil Pendse - Mountain View CA
Assignee:
National Semiconductor Corporation - Santa Clara CA
International Classification:
H01L 23495
US Classification:
257676, 257666
Abstract:
Semiconductor device packages having top and bottom interconnecting surfaces that can be connected to external electrical systems are described. These packages include internal contact leads that are bent such that they extend from a top surface to a bottom surface of the package and thereby form the corresponding interconnecting surfaces. In some embodiments, a solder ball is formed on either the top or bottom portion of the contact leads so that the solder balls form one of the contact surfaces of the package.

Ceramic Optical Sub-Assembly For Opto-Electronic Module Utilizing Ltcc (Low-Temperature Co-Fired Ceramic) Technology

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US Patent:
7086786, Aug 8, 2006
Filed:
May 18, 2004
Appl. No.:
10/849338
Inventors:
Neeraj Anil Pendse - Mountain View CA, US
Bruce Carlton Roberts - San Jose CA, US
Jia Liu - San Jose CA, US
Lionel Auzereau - Le Cannet, FR
Christopher Barratt - Villeneuve-Loubet, FR
Assignee:
National Semiconductor Corporation - Santa Clara CA
International Classification:
G02B 6/36
US Classification:
385 89, 385 53, 385 88
Abstract:
A high performance ceramic block for use with small-scale circuitry is described. The block can be used in an optical sub-assembly (OSA) suitable for optical interconnection with optical fibers and electrical interconnection with a chip sub-assembly (CSA) is formed. The block includes a first surface and a second surface and is formed using one of low temperature co-fired ceramic (LTCC) and high temperature co-fired ceramic (HTCC) techniques. Photonic devices are formed on the first surface of the ceramic block and electrical contacts are formed on a second surface of the block. The electrical contacts being suitable for electrical communication with a chip sub-assembly. Electrical connections are formed so that they pass internally through the ceramic block to electrically interconnect the photonic devices on the first face of the block with the electrical contacts on the second face of the block. Such a block can be advantageously used to form an optoelectronic module.

Two-Layer Electrical Substrate For Optical Devices

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US Patent:
7432575, Oct 7, 2008
Filed:
Jun 8, 2004
Appl. No.:
10/864099
Inventors:
Neeraj Anil Pendse - Mountain View CA, US
Jia Liu - San Jose CA, US
Jitendra Mohan - Santa Clara CA, US
Bruce Carlton Roberts - San Jose CA, US
Luu Thanh Nguyen - Sunnyvale CA, US
William Paul Mazotti - San Martin CA, US
Assignee:
National Semiconductor Corporation - Santa Clara CA
International Classification:
H01L 31/0203
US Classification:
257433, 257 81, 257 98, 257 99, 257691, 385 89, 385 14, 385131
Abstract:
A high performance and small-scale circuitry substrate is described. The circuitry substrate includes a dielectric layer, a return plane attached to a bottom surface of the dielectric layer, and a plurality of return paths (ground) and signal lines that are attached to a top surface of the dielectric layer. The return paths on the top surface are connected to the return plane on the bottom surface by wrapping around at least one edge of the dielectric material. Return paths on the top layer can also separate each pair or adjacent signal lines. The circuitry substrate can be advantageously used to form an optoelectronic module.

Two-Layer Electrical Substrate For Optical Devices

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US Patent:
6765275, Jul 20, 2004
Filed:
Nov 6, 2002
Appl. No.:
10/290481
Inventors:
Neeraj Anil Pendse - Mountain View CA
Jia Liu - San Jose CA
Jitendra Mohan - Santa Clara CA
Bruce Carlton Roberts - San Jose CA
Luu Thanh Nguyen - Sunnyvale CA
William Paul Mazotti - San Martin CA
Assignee:
National Semiconductor Corporation - Santa Clara CA
International Classification:
H01L 310203
US Classification:
257433, 257 81, 257 98, 257 99, 257691, 385 89, 385 14, 385131
Abstract:
A high performance and small-scale circuitry substrate is described. The circuitry substrate includes a dielectric layer, a return plane attached to a bottom surface of the dielectric layer, and a plurality of return paths (ground) and signal lines that are attached to a top surface of the dielectric layer. The return paths on the top surface are connected to the return plane on the bottom surface by wrapping around at least one edge of the dielectric material. Return paths on the top layer can also separate each pair or adjacent signal lines. The circuitry substrate can be advantageously used to form an optoelectronic module.

Device Controller And Viewer

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US Patent:
20220217223, Jul 7, 2022
Filed:
Mar 22, 2022
Appl. No.:
17/701537
Inventors:
- MILPITAS CA, US
Ragini Rajendra PRASAD - Fremont CA, US
Michael James POWER - San Jose CA, US
Haroun Ansari Mohammed ANSARI - Sunnyvale CA, US
Neeraj PENDSE - Palo Alto CA, US
International Classification:
H04L 67/00
G06Q 30/02
H04L 67/025
G06F 8/60
G06F 3/04847
G06F 3/0486
G06F 3/0488
Abstract:
Method, apparatus and computer program product embodiments are provided for distributing and installing content and settings on client devices without receiving any user input at the client devices, which limit usage of the client device a user at the client device to a first set of the usage activities. A device controller may remotely configure and control client devices by providing instructions and content for distribution to the client devices. The instructions may cause the client devices to install the content on the client devices without requiring any user input to initiate the installation or during installation of the content. The client device may be further configured to allow management of the client device by the device controller.

Device Controller And Viewer

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US Patent:
20200366757, Nov 19, 2020
Filed:
Jul 31, 2020
Appl. No.:
16/944650
Inventors:
- MILPITAS CA, US
Ragini Rajendra PRASAD - Fremont CA, US
Michael James POWER - San Jose CA, US
Haroun Ansari Mohammed ANSARI - Sunnyvale CA, US
Neeraj PENDSE - Palo Alto CA, US
International Classification:
H04L 29/08
G06F 3/0486
G06F 3/0488
G06Q 30/02
G06F 3/0484
Abstract:
Method, apparatus and computer program product embodiments are provided for distributing and installing content and settings on client devices without receiving any user input at the client devices, which limit usage of the client device a user at the client device to a first set of the usage activities. A device controller may remotely configure and control client devices by providing instructions and content for distribution to the client devices. The instructions may cause the client devices to install the content on the client devices without requiring any user input to initiate the installation or during installation of the content. The client device may be further configured to allow management of the client device by the device controller.

Device Controller And Viewer

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US Patent:
20170201599, Jul 13, 2017
Filed:
Jan 6, 2017
Appl. No.:
15/400584
Inventors:
- Milpitas CA, US
Ragini Rajendra PRASAD - Fremont CA, US
Michael James POWER - San Jose CA, US
Haroun Ansari Mohammed ANSARI - Sunnyvale CA, US
Neeraj PENDSE - Palo Alto CA, US
International Classification:
H04L 29/08
G06F 3/0488
G06F 3/0486
G06F 3/0484
Abstract:
Method, apparatus and computer program product embodiments are provided for distributing and installing content and settings on client devices without receiving any user input at the client devices, which limit usage of the client device a user at the client device to a first set of the usage activities. A device controller may remotely configure and control client devices by providing instructions and content for distribution to the client devices. The instructions may cause the client devices to install the content on the client devices without requiring any user input to initiate the installation or during installation of the content. The client device may be further configured to allow management of the client device by the device controller.
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Neeraj A Pendse from Palo Alto, CA, age ~47 Get Report