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Murali M Chitteboyina

from Southlake, TX
Age ~46
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Also known as:
Murali A
Phone and address:
724 Nettleton Dr, Grapevine, TX 76092
Related to:
Annette C Brasel, 61Matthew S Hugen, 40Randy M Hugen, 68Jonathan L Hugen, 59Margaret A HugenSam HugenSamuel B Hugen, 38Zena K Chitteboyina, 40Rita M Hugen, 66
Connected to:
Briana M Chittenden, 42Christopher J Chittenden, 49Christy L Chittenden, 71Craig M Chittenden, 47Ed Chittenden, 125Hayley M Chittenden, 30Katie M Chittenden, 35Lemira Chittenden, 47Margaret E Chittenden, 84Neil C Chittendon, 45

Murali Chitteboyina Phones & Addresses

  • 724 Nettleton Dr, Southlake, TX 76092
  • Bella Vista, AR
  • Arlington, TX
  • Burnsville, MN
  • 400 S Oak St, Arlington, TX 76010

Publications

Us Patents

Methods And Apparatuses For Integrated Packaging Of Microelectromechanical Devices

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US Patent:
20100320549, Dec 23, 2010
Filed:
Jun 17, 2010
Appl. No.:
12/818001
Inventors:
Donald P. Butler - Colleyville TX, US
Mohammad S. Rahman - South Bend IN, US
Murali M. Chitteboyina - Arlington TX, US
Assignee:
The Board of Regents of The University of Texas System - Austin TX
International Classification:
H01L 29/84
H01L 21/50
US Classification:
257418, 438 51, 257E29324, 257E21499
Abstract:
Microelectromechanical systems (MEMS) packages, packaged MEMS devices, and methods for making the same are disclosed. The method may include forming a chamber sacrificial layer above an insulating layer that is coupled to a wafer. The method further may include forming a packaging layer above the chamber sacrificial layer. The method additionally may include forming one or more openings through the packaging layer. The method also may include removing the chamber sacrificial layer through the one or more openings. The method may include forming a sealing layer above the packaging layer such that the sealing layer substantially seals the one or more openings to form a hermetic cavity.

Methods And Apparatuses For Integrated Packaging Of Microelectromechanical Devices

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US Patent:
20130260503, Oct 3, 2013
Filed:
May 28, 2013
Appl. No.:
13/903363
Inventors:
Murali M. Chitteboyina - Arlington TX, US
Mohammad S. Rahman - South Bend IN, US
Assignee:
The Board of Regents of the University of Texas System - Austin TX
International Classification:
B81C 1/00
US Classification:
438 51
Abstract:
Microelectromechanical systems (MEMS) packages, packaged MEMS devices, and methods for making the same are disclosed. The method may include forming a chamber sacrificial layer above an insulating layer that is coupled to a wafer. The method further may include forming a packaging layer above the chamber sacrificial layer. The method additionally may include forming one or more openings through the packaging layer. The method also may include removing the chamber sacrificial layer through the one or more openings. The method may include forming a sealing layer above the packaging layer such that the sealing layer substantially seals the one or more openings to form a hermetic cavity.
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Murali M Chitteboyina from Southlake, TX, age ~46 Get Report