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Minae Tanaka

from Gilbert, AZ
Age ~75
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Related to:
Fumiko Tanaka, 75Nae G Tanaka, 36Nami TanakaFumiko Tanaka
Connected to:
Akemi Tanaka, 49Ashley M Tanaka, 40Carl T Tanaka, 74Chihiro Tanaka, 61Cynthia S Tanaka, 74Eiji E Tanaka, 69Etsuko Tanaka, 64Fumiya M Tanaka, 40Georgia L Tanaka, 65Hidekazu Tanaka, 63

Minae Tanaka Phones & Addresses

  • Gilbert, AZ
  • Mesa, AZ
  • Amherst, MA
  • North Providence, RI
  • Sunderland, MA

Publications

Us Patents

Highly Dilutable Polishing Concentrates And Slurries

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US Patent:
8404143, Mar 26, 2013
Filed:
Feb 22, 2012
Appl. No.:
13/402365
Inventors:
Hyungjun Kim - Gilbert AZ, US
Richard Wen - Mesa AZ, US
Bin Hu - Chandler AZ, US
Minae Tanaka - Gilbert AZ, US
Deepak Mahulikar - Madison CT, US
Assignee:
Fujifilm Planar Solutions, LLC - Adrian MI
International Classification:
C09K 13/00
US Classification:
252 79, 252 791, 252 792, 252 793, 252 794, 438692, 438693
Abstract:
The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.

Highly Dilutable Polishing Concentrates And Slurries

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US Patent:
20110089143, Apr 21, 2011
Filed:
Oct 16, 2009
Appl. No.:
12/580868
Inventors:
Hyungjun Kim - Gilbert AZ, US
Richard Wen - Mesa AZ, US
Bin Hu - Chandler AZ, US
Minae Tanaka - Gilbert AZ, US
Deepak Mahulikar - Madison CT, US
International Classification:
C23F 1/18
C09K 13/00
US Classification:
216105, 252 791
Abstract:
The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.

Highly Dilutable Polishing Concentrates And Slurries

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US Patent:
20130288478, Oct 31, 2013
Filed:
Mar 21, 2013
Appl. No.:
13/848484
Inventors:
Richard Wen - Mesa AZ, US
Bin Hu - Chandler AZ, US
Minae Tanaka - Gilbert AZ, US
Deepak Mahulikar - Madison CT, US
International Classification:
H01L 21/306
US Classification:
438693, 252 791
Abstract:
The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.
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Minae Tanaka from Gilbert, AZ, age ~75 Get Report