Inventors:
Vista A. Brusic - Geneva IL
Vijay S. Darekar - Temple TX
Michael A. Gaynes - Vestal NY
Ravi F. Saraf - Briarcliff Manor NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B22F 100
B05D 136
B05D 300
B05D 714
Abstract:
Copper-containing surfaces of substrates such as laminated electronic circuit boards are protected by organometallic coatings comprising organic compounds selected from the group consisting of benzimidazoles, alkylimidazoles, benzotriazozles and alkyltriazoles, substituted or unsubstituted, and metal particles of solder-wettable metals or metal solders. The metal particles can be thermally formed in situ from metallic compounds such as noble metal acetates, acetylacetonates and carbonates.