Markus K Liebhard

6486537, Nov 26, 2002

Mar 19, 2001

09/812426

Markus K. Liebhard - Gilbert AZ

Amkor Technology, Inc. - Chandler AZ

H01L 23495

257667, 257666, 257669, 257787, 257737, 257780, 257738, 257701, 257713

A semiconductor package and a method for fabricating a semiconductor package are disclosed. The semiconductor package includes semiconductor chip attached to a circuit board that includes at least one lateral slot formed through the circuit board. Provision of the slot reduces stresses in the circuit board that are manifested by warpage. The semiconductor chip may be positioned in a central aperture of the circuit board and held therein by hardened encapsulant material.

6509560, Jan 21, 2003

Nov 13, 2000

09/711993

Thomas P. Glenn - Gilbert AZ
Steven Webster - Chandler AZ
Markus K. Liebhard - Chandler AZ

Amkor Technology, Inc. - Chandler AZ

H01J 4014

250239, 2502141, 361783, 257688

An image sensor package includes an image sensor having an upper surface. The image sensor further includes an active area and bond pads on the upper surface. A window is supported above the active area by a window support. A step up ring is mounted above a noncritical region of the upper surface of the image sensor between the active area and the bond pads. Electrically conductive traces on the step up ring are electrically connected to the bond pads by bond wires. An inner package body is formed between the step up ring and the window support and mechanically locks the window in place. An outer package body is formed to enclose the bond wires, the bond pads, and outer sides of the step up ring. The outer package body has outer sides coplanar with sides of the image sensor such that the image sensor assembly is chip size.

6509637, Jan 21, 2003

Mar 8, 2002

10/094731

Markus Karl Liebhard - Chandler AZ

Amkor Technology, Inc. - Chandler AZ

H01L 2302

257678, 257704, 257666

An assembly and method for mounting thick integrated circuit packages within a low-profile circuit module provides a low cost alternative to special integrated circuit packaging requirements. Pre-packaged thin-small-outline-packages (TSOP), thin-plastic-quad-flatpack (TQFP) and other similar surface mount packages may be used within a low-profile circuit module, using the techniques and structures of the present invention. A straight lead package is mounted within a cavity in the circuit module substrate, so that the effective height of the integrated circuit package is reduced. Curved lead packages are used by straightening or sawing the leads before mounting.

6528857, Mar 4, 2003

Nov 13, 2000

09/712313

Thomas P. Glenn - Gilbert AZ
Steven Webster - Chandler AZ
Markus K. Liebhard - Chandler AZ

Amkor Technology, Inc. - Chandler AZ

H01L 31203

257433, 257432, 257434, 257789, 361783, 438116

An image sensor package includes an image sensor having an upper surface. The image sensor further includes an active area and bond pads on the upper surface. A window is supported above the active area by a window support. Interior traces are formed on a lower surface of a step up ring. Electrically conductive bumps are formed between the interior traces on the lower surface of the step up ring and the bond pads on the upper surface of the image sensor thus flip chip mounting the step up ring to the image sensor. Electrically conductive vias extend through the step up ring to electrically connect the interior traces to exterior traces formed on an upper surface of the step up ring.

6589801, Jul 8, 2003

Aug 30, 1999

09/385694

Ju-Hoon Yoon - Seoul, KR
Dae-Byung Kang - Seoul, KR
In-Bae Park - Seoul, KR
Vincent DiCaprio - Mesa AZ
Markus K. Liebhard - Gilbert AZ

Amkor Technology, Inc. - Chandler AZ

H01L 2166

438 15, 438 14, 438107, 438112, 438127, 438460, 716 4, 716 5

A method is disclosed for manufacturing chip-scale semiconductor packages at a wafer-scale level using wafer mapping techniques. In the method, a semiconductor wafer and/or a circuit substrate, each respectively comprising a plurality of individual chips and circuit pattern units, is/are pre-tested and discriminated in terms of the quality and/or grade of each individual chip unit and/or circuit pattern unit contained therein. The test results are marked on the lower surface of each chip unit and/or on each pattern unit. The substrate is laminated to the wafer to form a laminated assembly prior to performing the packaging process, which typically includes a wire bonding step, an encapsulation step and a solder ball welding step. A plurality of connected package units are thereby formed in the laminated substrate-wafer assembly. The package units are then singulated from each other and the laminated assembly by a cutting process.

6620646, Sep 16, 2003

Nov 13, 2000

09/712314

Thomas P. Glenn - Gilbert AZ
Steven Webster - Chandler AZ
Markus K. Liebhard - Chandler AZ

Amkor Technology, Inc. - Chandler AZ

H01L 2148

438107, 438110, 438112, 438113, 438126, 438456, 438458, 438460

To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. A noncritical region of the upper surface of the image sensor is between the active area and bond pads of the image sensor. A lower surface of a step up ring is mounted above the noncritical region of the upper surface of the image sensor. An upper surface of the step up ring includes a plurality of electrically conductive traces. Bond wires are formed between the bond pads of the image sensor and the electrically conductive traces on the upper surface of the step up ring. The step up ring is mounted so that the window is located in or adjacent a central aperture of the step up ring.

6629633, Oct 7, 2003

Nov 13, 2000

09/711994

Thomas P. Glenn - Gilbert AZ
Steven Webster - Chandler AZ
Markus K. Liebhard - Chandler AZ

Amkor Technology, Inc. - Chandler AZ

B22K 3102

22818022, 228175, 2282481

To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. The image sensor further includes a plurality of bond pads on the upper surface. Interior traces on a lower surface of a step up ring are aligned with the bond pads on the upper surface of the image sensor. Bumps are formed between the interior traces and the bond pads thus flip chip mounting the step up ring to the image sensor. The step up ring is mounted such that the window is located in or adjacent a central aperture of the step up ring. An underfill material is applied into the central aperture. The underfill material flows from the central aperture between the lower surface of the step up ring and the upper surface of the image sensor. The underfill material encloses the bumps. The underfill material is cured, if necessary, to form a package body.

6717822, Apr 6, 2004

Sep 20, 2002

10/251410

Jeffrey Alan Miks - Chandler AZ
Markus Karl Liebhard - Oakland CA

Amkor Technology, Inc. - Chandler AZ

H05K 118

361764, 361773, 361718, 361776, 361774, 257666, 257670, 257713

An edge stiffener added to a lead-frame based circuit module provides protection of the peripheral flange of the circuit module during handling and manufacturing processes. The edge stiffener may be coupled to leads of the lead-frame for providing electrical contacts at the periphery of the circuit module or may be form widened portions of a tie bar that is connected to the lead frame by leads extending through gaps between the ends of the edge stiffener portions. Singulation of the circuit module will result in edge stiffener portions that are not coupled to the lead frame, but are secured within the encapsulant.