Mark C Wojtaszek

7063800, Jun 20, 2006

Nov 10, 2003

10/705026

Ying Ding - Southbury CT, US
Ronald N. Redline - Prospect CT, US
Richard C. Retallick - West Hartford CT, US
Mark Wojtaszek - Canton CT, US

C03C 15/00

216 90, 216103, 216105, 216106

The present invention sets forth an improved method of microetching a metal substrate by contacting the substrate with an aqueous composition comprising a sodium persulfate or hydrogen peroxide oxidizing agent, acid, and one or more additives. When the oxidizing agent is sodium persulfate, the one or more additives generally comprise an aliphatic saturated dicarboxylic acid. When the oxidizing agent is hydrogen peroxide, the one or more additives generally comprise a stabilizer and amino tris(methylene phosphonic acid).

7666471, Feb 23, 2010

Mar 22, 2006

11/386631

Mark Wojtaszek - Canton CT, US
James Watkowski - Middlebury CT, US
Gary B. Larson - Cheshire CT, US
Peter Kukanskis - Woodbury CT, US

B05D 3/02
B05D 3/04
C23C 14/02
H05H 1/00

427229, 427534, 427536, 427307, 427304, 4274431, 216 58, 216 83

The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, and plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.

20020062760, May 30, 2002

Jan 22, 2002

10/053784

Ronald Redline - Prospect CT, US
Mark Wojtaszek - Burlington CT, US

C23C018/18
B05D003/10
B05D001/36

106/001110, 427/304000, 427/404000, 106/001130, 106/001220

An improved colloidal activator is disclosed which is useful in preparing substrates for plating. The activator comprises a source of gold, a source of tin and an organic sulfonic acid. Relatively low levels of palladium have been found to be synergistically advantageous. In addition, sulfonated surfactants have also proven to be useful. The colloidal activator may also include colloid stabilizers. A method for preparing and a process for using the activator are also disclosed.

20030150526, Aug 14, 2003

Feb 14, 2002

10/076897

Jon Bengston - West Hartford CT, US
Mark Wojtaszek - Burlington CT, US
Gerald Wojcik - Thomaston CT, US
Massimo Dimarco - Middlebury CT, US

C23C022/60

148/254000, 148/261000

A conversion coating composition and a method of applying the conversion coating composition to magnesium and magnesium alloy articles prior to painting to prevent corrosion. The conversion coating composition comprises a source of vanadate ions, a material comprising phosphorus, and nitric acid or a source of nitrate ions. In addition, the composition may also contain boric acid or a source of borate ions and a source of fluoride ions or a source of fluoroborate ions.

20090239079, Sep 24, 2009

Mar 18, 2008

12/050709

Mark Wojtaszek - Canton CT, US
Robert Hamilton - Torrington CT, US

B32B 9/00
B05D 1/18

4284111, 4274301

The present invention relates to a method of incorporating a catalytic poison into a non-plating grade resin portion of a double shot molded plastic part, to retard the tendency of any electroless plating chemistry to be deposited on that portion that contains the catalytic poison. After surface treatment, only one portion of the molded part becomes receptive to electroless plating while the other portion does not.

20100323109, Dec 23, 2010

Jun 19, 2009

12/488158

Robert Hamilton - Torrington CT, US
Mark Wojtaszek - Canton CT, US

B05D 5/00

427256

The present invention relates to a method of selectively plating a plastic article comprising a first polymer resin portion and a second polymer resin portion, wherein said first polymer resin portion is not rendered plateable by sulfonation and said second polymer resin portion is rendered plateable by sulfonation. The method comprises the steps of sulfonating the plastic article, activating the sulfonated plastic article to accept plating thereon, and plating the sulfonated and activated article in an electroless plating bath. The plastic article is selectively plated such that the first polymer resin portion does not have plating thereon and the second polymer resin portion is electrolessly plated.

20130209689, Aug 15, 2013

Feb 15, 2012

13/396814

Mark Wojtaszek - Canton CT, US
Robert Hamilton - Torrington CT, US
John Wallace - Bloomfield Village MI, US
Bradlee Radke - Roseville MI, US

B05D 3/10
B05D 3/04

427305, 427304

A method of preparing a plastic article to accept plating thereon is proposed. At least a portion of the plastic article is rendered plateable by sulfonation. The method includes the steps of: (a) exposing the plastic article to an atmosphere containing a sulfonating agent to sulfonate at least a portion of the plastic article; (b) conditioning the sulfonated article with an alkaline conditioner; (c) activating the plastic article with an ionic palladium activator; and (d) contacting the plastic article with an accelerator to react with adsorbed palladium increase the catalytic activity of at least the portion of the plastic article.