Manish Deopura

7704125, Apr 27, 2010

Oct 14, 2005

11/251547

Pradip K. Roy - Orlando FL, US
Manish Deopura - Sunnyvale CA, US
Sudhanshu Misra - San Jose CA, US

NexPlanar Corporation - Hillsboro OR

B24B 1/00

451 41, 451529

The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.

7377840, May 27, 2008

Jul 21, 2004

10/897192

Manish Deopura - Cambridge MA, US
Hem M. Vaidya - Sunnyvale CA, US
Pradip K. Roy - Orlando FL, US

Neopad Technologies Corporation - Sunnyvale CA

B24D 11/00

451527, 451530

Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous groves, double spiral grooves, and multiply overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.

8287793, Oct 16, 2012

Nov 28, 2007

11/998212

Manish Deopura - Sunnyvale CA, US
Hem M. Vaidya - Sunnyvale CA, US
Pradip K. Roy - Orlando FL, US

NexPlanar Corporation - Hillsboro OR

B29C 39/00

264299, 264316, 2643281

Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous grooves, double spiral grooves, and multiple overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.

20060189269, Aug 24, 2006

Feb 18, 2005

11/060898

Pradip Roy - Orlando FL, US
Manish Deopura - Sunnyvale CA, US
Sudhanshu Misra - San Jose CA, US

B24D 11/00

451526000

Various examples of customized polishing pads are given, along with methods of making and using such customized polishing pads. The subject customized pads are designed and fabricated so that there is spatial distribution of chemical and physical properties of the pads that are customized for performance suited to a specific type of substrate, as well as fabrication control in implementing such customized design. Such customized design and fabrication control produce a monolithic pad thereby specifically suited to provide uniform performance of CMP of the targeted substrate.

20080207100, Aug 28, 2008

Nov 28, 2007

11/998319

Pradip K. Roy - Orlando FL, US
Manish Deopura - Sunnyvale CA, US
Sudhanshu Misra - San Jose CA, US

B24D 11/00

451529

The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.

20090053976, Feb 26, 2009

Feb 21, 2006

11/884829

Pradip K. Roy - Orlando FL, US
Manish Deopura - Sunnyvale CA, US
Sudhanshu Misra - San Jose CA, US

B24D 18/00
B24D 3/00
B24D 11/00
B24B 7/22

451 36, 451527, 451 41, 51298, 51293

The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.

20110014482, Jan 20, 2011

Jun 4, 2007

12/303330

Bizhong Zhu - Midland MI, US
Dimitris E. Katsoulis - Midland MI, US
Manish Deopura - North Bethesda MD, US
Andrew Satorius - Baltimore MD, US
Raymond L. Tabler - Midland MI, US
Richard Rabe - LaCrosse WI, US
Gifford N. Shearer - Wadsworth OH, US

DOW CORNING CORPORATION - Midland MI

B32B 25/20
B29C 47/06
B29C 47/14

428447, 2641711, 425114

The present invention provides a method of forming ductile multilayer silicone resin films. The method may include forming a silicone resin film comprising at least two polymer layers, at least one of them being a silicone resin layer. The thickness of the silicone resin layer(s) is less than a corresponding ductile transition thickness.

20130059509, Mar 7, 2013

Sep 12, 2012

13/612135

Manish Deopura - Cambridge MA, US
Hem M. Vaidya - Sunnyvale CA, US
Pradip K. Roy - Orlando FL, US

B24B 37/26

451527

Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous groves, double spiral grooves, and multiply overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.