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Luke N Dzwonczyk

from San Pedro, CA
Age ~91
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Also known as:
Luke L Dzwonczyk, Luke K
Phone and address:
2275 25Th St, San Pedro, CA 90732
(310) 832-0540
Related to:
Kim H Thompson, 73
Connected to:
Jennifer L Dzwonczyk, 72Alison B Dzwonkowski, 69Joseph H Dzwonkowski, 62Kristen E Dzwonkowski, 44Todd A Dzyak, 52Jonathan M Dzydzora, 42Oleh J Dzydzora, 44Sergei V Dzyuba, 48Abigale A E, 47Adeleke W E, 61

Luke Dzwonczyk Phones & Addresses

  • 2275 25Th St, San Pedro, CA 90732 (310) 832-0540
  • 2275 W 25Th St SPC 49, San Pedro, CA 90732 (310) 832-0540
  • Clinton, MA
  • 1412 Michael Ct, Lompoc, CA 93436 (805) 736-2655
  • Marlborough, MA

Education

School / High School: Marymount California University 2013 to 2013

Public records

Vehicle Records

Luke Dzwonczyk

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Address:
2275 W 25 St SPC 49, San Pedro, CA 90732
Phone:
(310) 832-0540
VIN:
2T1BU4EE4BC632954
Make:
TOYOTA
Model:
COROLLA
Year:
2011

Resumes

Resumes

Luke Dzwonczyk Photo 1

Luke Dzwonczyk

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Location:
San Pedro, CA
Education:
Marymount California University 2013 - 2013

Publications

Us Patents

Removable Pin Stabilizer And Assembly

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US Patent:
61684546, Jan 2, 2001
Filed:
Nov 10, 1999
Appl. No.:
9/439463
Inventors:
Luke Dzwonczyk - Lompoc CA
Assignee:
The United States of America as represented by the Secretary of the Navy - Washington DC
International Classification:
H01R 1364
US Classification:
439381
Abstract:
A removable pin stabilizer for stabilizing carrier pins of an integrated circuit chip carrier before and during placement of the pins into sockets of a circuit board. The removable pin stabilizer includes a non-dissolvable plate, the non-dissolvable plate having parallel dissolvable sections traversing the plate, the parallel dissolvable sections being through the plate and having holes through the plate for receiving the carrier pins, the holes encompassing the parallel dissolvable sections, wherein the parallel dissolvable sections can be dissolved by a solvent after the chip carrier is mounted and positioned correctly to the circuit board. The resultant additional space created by such removal will allow an increased flow of air between the integrated circuit chip carrier and the circuit board.

Hold Down Interconnection Stick

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US Patent:
50918249, Feb 25, 1992
Filed:
Apr 2, 1990
Appl. No.:
7/502969
Inventors:
Luke Dzwonczyk - Marlborough MA
Assignee:
The United States of America as represented by the Secretary of the Navy - Washington DC
International Classification:
H05K 720
US Classification:
361385
Abstract:
A hold down interconnection stick is provided which is fastened to the ou walls of a container of an electronic system and to the electronic printed circuit boards which form a part of the electronic system. The stick is also provided with heat dissipating means to carry away the heat generated during the operation of the electronic system so as to enable the electronic components function within their tolerances of temperature. The fastening means provide a vibration-free system and thus reduces any vibration-induced noise.

Printed Circuit Injection Molded Connector With Removable Bifurcated Contacts Capable Of High Temperature Exposure

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US Patent:
50449923, Sep 3, 1991
Filed:
Oct 20, 1989
Appl. No.:
7/424522
Inventors:
Luke Dzwonczyk - Marlborough MA
Richard Sullivan - Marshfield MA
William E. Wesolowski - Holden MA
James W. Malloy - Valbonne, FR
Assignee:
The Charles Stark Draper Laboratory - Cambridge MA
Raytheon Company - Lexington MA
International Classification:
H01R 13658
US Classification:
439608
Abstract:
A connector protected against current pulses resulting from secondary emission from connector pins by a conductive layer surrounding each pin set. The conductive layer is intimately bonded to the connector insulation and is connected to the connector pin set. The connector is formed in a housing block of a liquid crystal thermoplastic that retains the crystal structure at elevated temperatures preventing deformation during high temperature soldering. The connector back and sides are patterned with plated conductors that provide interconnection between selected pins directly on the connector outer surfaces. The back surface of the connector is sealed by a heat setting acrylic that prevents contaminants from the environment at the back of the connector getting into the pin recesses.
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Luke N Dzwonczyk from San Pedro, CA, age ~91 Get Report