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Linda L Jiang

from Monaca, PA
Age ~67
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Also known as:
Li L Jiang, Jiang L Li, Jian G Li
Related to:
Yanfeng F Jiang, 58
Connected to:
Anna Jiang, 31Austin Y Jiang, 33Bingrong Jiang, 61Celeste A Jiang, 54Celine L Jiang, 70Chao Jiang, 59Chengcheng Jiang, 38Chengmin Jiang, 52Chung Jiang, 64Denise Jiang, 33

Linda Jiang Phones & Addresses

  • Monaca, PA
  • Seven Fields, PA
  • Old Bridge, NJ
  • East Brunswick, NJ
  • San Mateo, CA
  • Miracle, KY
  • Sunnyvale, CA

Resumes

Resumes

Linda Jiang Photo 1

At Shenzhen Lucky Solid State Lighting Co.,Ltd

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Position:
LED lights at Sales Director
Location:
United States
Industry:
Electrical/Electronic Manufacturing
Work:
Sales Director since Mar 2010
LED lights
Education:
Hainan University 2007 - 2010
Linda Jiang Photo 2

Linda Jiang

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Linda Jiang Photo 3

Linda Jiang

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Work:
Sangfor Technologies Feb 2008 - Mar 2011
Director of the Overseas Sales Dep
Tplink 2002 - Jul 2007
Regional Manager of Middle East
Education:
South East University, China 1998 - 2002
Bachelors, Robotics, Engineering, Mechatronics
Linda Jiang Photo 4

Linda Jiang

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Linda Jiang Photo 5

Linda Jiang

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Location:
United States
Linda Jiang Photo 6

Linda Jiang

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Location:
United States
Linda Jiang Photo 7

Linda Jiang

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Location:
United States

Publications

Us Patents

Method And Apparatus For Heating Polishing Pad

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US Patent:
6896586, May 24, 2005
Filed:
Mar 29, 2002
Appl. No.:
10/112628
Inventors:
Xuyen Pham - Fremont CA, US
Tuan Nguyen - San Jose CA, US
Ren Zhou - Fremont CA, US
David Wei - Fremont CA, US
Linda Jiang - Milpitas CA, US
Joseph P. Simon - Newark CA, US
Tony Luong - San Jose CA, US
Sridharan Srivatsan - Sunnyvale CA, US
Anjun Jerry Jin - Milpitas CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B049/00
US Classification:
451 7, 451 8, 451 53
Abstract:
A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.

Megasonic Precision Cleaning Of Semiconductor Process Equipment Components And Parts

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US Patent:
20140053884, Feb 27, 2014
Filed:
Nov 1, 2013
Appl. No.:
14/069994
Inventors:
Linda (Tong) Jiang - Fremont CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
H01L 21/67
US Classification:
134172
Abstract:
Apparatuses are provided for cleaning a processing component using megasonic energy including megasonic jets in combination with selective chemistries to remove sub-micron particulate contaminants from the surfaces of the processing component that is used in cleaning semiconductor, medical, or any other processing substrates. The apparatus includes a processing chamber having a carrier element that is configured to support the processing component. The carrier element includes a mechanism to flip the processing component within the processing chamber during cleaning. A jet assembly equipped with a megasonic transducer is used to provide high frequency megasonic acoustically energized fluid to a surface of the processing component, during cleaning.

Method And Apparatus For Cleaning Low K Dielectric And Metal Wafer Surfaces

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US Patent:
62772031, Aug 21, 2001
Filed:
Nov 20, 1998
Appl. No.:
9/197348
Inventors:
Linda Jiang - Fremont CA
Diane J. Hymes - San Jose CA
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
C23G 102
US Classification:
134 2
Abstract:
Provided is a method for cleaning hydrophobic surfaces, such as low K dielectric organic or inorganic surfaces as well as metallization surfaces of a semiconductor wafer. The method includes: (a) applying a surfactant solution to the surface; (c) scrubbing the surface; and (c) spin-rinsing the surface of the substrate using de-ionized water to complete a removal of any contaminants from the surface. If needed, the surfactant solution can be mixed with a chemical enhancer, and the scrubbing can be performed in a brush system. The brush system may be configured to apply DI water using a through the brush (TTB) technique. The surfactant solution can be applied either using a drip technique or using the TTB technique.

Method And Apparatus For Cleaning Low K Dielectric And Metal Wafer Surfaces

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US Patent:
63193302, Nov 20, 2001
Filed:
Jul 18, 2000
Appl. No.:
9/618198
Inventors:
Linda (Tong) Jiang - Fremont CA
Diane J. Hymes - San Jose CA
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B08B 704
US Classification:
134 2
Abstract:
Provided is a method for cleaning hydrophobic surfaces, such as low K dielectric organic or inorganic surfaces as well as metallization surfaces of a semiconductor wafer. The method includes: (a) applying a surfactant solution to the surface; (b) scrubbing the surface; and (c) spin-rinsing the surface of the substrate using de-ionized water to complete a removal of any contaminants from the surface. If needed, the surfactant solution can be mixed with a chemical enhancer, and the scrubbing can be performed in a brush system. The brush system may be configured to apply DI water using a through the brush (TTB) technique. The surfactant solution can be applied either using a drip technique or using the TTB technique.
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Linda L Jiang from Monaca, PA, age ~67 Get Report