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Lee E Lablanc

from Sunnyvale, CA
Age ~62
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Also known as:
Lee La Lablanc, Lee Edward La Blanc, Lee La Blanc, Lee Leblanc
Phone and address:
1139 Reed Ave, Sunnyvale, CA 94086
(408) 244-4805
Related to:
Kyle T Lablanc, 27Gina T Lablanc, 58Shirley A Lablanc, 87Steven T Lablanc, 60Edward A Lablanc, 88
Connected to:
Danielle A Lablanc, 54Joseph C Lablanc, 44Janette K Lablue, 59Samia Laboard, 42Anne F Laboe, 82Chris Laboi, 49Cynthia S Laboile, 74Jesse Laboiteaux, 34Terry L Labolt, 69Donna M Labombarda, 61

Lee Lablanc Phones & Addresses

  • 1139 Reed Ave, Sunnyvale, CA 94086 (408) 244-4805
  • 1139 Reed Ave APT A, Sunnyvale, CA 94086 (408) 244-4805
  • 355 Wolfe Rd, Sunnyvale, CA 94085 (408) 245-1687
  • 425 Bernardo Ave, Sunnyvale, CA 94086 (650) 962-1684
  • Maryville, TN
  • Santa Clara, CA
  • Modesto, CA

Resumes

Resumes

Lee Lablanc Photo 1

Senior Mechanical Engineer

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Location:
Sunnyvale, CA
Industry:
Electrical/Electronic Manufacturing
Work:
Tango Systems
Senior Mechanical Engineer
Applied Materials Jul 1995 - Jun 2003
Mechanical Engineer
Lockheed Martin Feb 1987 - Dec 1993
Laision Engineer
Education:
California State University, Fresno 1984 - 1986
Bachelors, Bachelor of Science, Mechanical Engineering San Jose State University 1980 - 1983
Lee Lablanc Photo 2

Lee Lablanc

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Lee Lablanc Photo 3

Lee Lablanc

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Publications

Us Patents

Method And Apparatus For Routing Harmonics In A Plasma To Ground Within A Plasma Enhanced Semiconductor Wafer Processing Chamber

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US Patent:
20030192475, Oct 16, 2003
Filed:
Apr 16, 2002
Appl. No.:
10/124191
Inventors:
Steven Shannon - San Mateo CA, US
Daniel Hoffman - Saratoga CA, US
Michael Barnes - San Ramon CA, US
Lee LaBlanc - Sunnyvale CA, US
Assignee:
Applied Materials, Inc.
International Classification:
G06F017/50
C23C016/00
US Classification:
118/715000
Abstract:
A method and apparatus for routing harmonic energy within a plasma to ground in a plasma enhanced semiconductor wafer processing reactor. A model of the chamber is used to determine the pathway for RF power and the harmonic energy of that RF power through the chamber. From this model, the placement and design of a harmonic routing circuit is determined to shunt the harmonic energy to ground.

Physical Vapor Deposition Method Using Backside Gas Cooling Of Workpieces

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US Patent:
20180202040, Jul 19, 2018
Filed:
Mar 14, 2018
Appl. No.:
15/921030
Inventors:
- San Jose CA, US
Harish Varma Penmethsa - Sunnyvale CA, US
Harshal T. Vasa - Santa Clara CA, US
Srikanth Dasaradhi - San Jose CA, US
Lee LaBlanc - Sunnyvale CA, US
International Classification:
C23C 14/35
H01J 37/34
C23C 14/50
C23C 14/54
H01J 37/32
Abstract:
A circular PVD chamber has a plurality of sputtering targets mounted on a top wall of the chamber. A pallet in the chamber is coupled to a motor for rotating the pallet about its center axis. The pallet has a diameter less than the diameter of the circular chamber. The pallet is also shiftable in an XY direction to move the center of the pallet beneath any of the targets so all areas of a workpiece supported by the pallet can be positioned directly below any one of the targets. A scanning magnet is in back of each target and is moved, via a programmed controller, to only be above portions of the workpiece so that no sputtered material is wasted. For depositing a material onto small workpieces, a cooling backside gas volume is created between the pallet and the underside of sticky tape supporting the workpieces.

Physical Vapor Deposition System Using Backside Gas Cooling Of Workpieces

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US Patent:
20170114448, Apr 27, 2017
Filed:
Oct 26, 2015
Appl. No.:
14/923357
Inventors:
- San Jose CA, US
Harish Varma Penmethsa - Sunnyvale CA, US
Harshal T. Vasa - Santa Clara CA, US
Srikanth Dasaradhi - San Jose CA, US
Lee LaBlanc - Sunnyvale CA, US
International Classification:
C23C 14/35
H01J 37/32
H01J 37/34
C23C 14/50
C23C 14/54
Abstract:
A circular PVD chamber has a plurality of sputtering targets mounted on a top wall of the chamber. A pallet in the chamber is coupled to a motor for rotating the pallet about its center axis. The pallet has a diameter less than the diameter of the circular chamber. The pallet is also shiftable in an XY direction to move the center of the pallet beneath any of the targets so all areas of a workpiece supported by the pallet can be positioned directly below any one of the targets. A scanning magnet is in back of each target and is moved, via a programmed controller, to only be above portions of the workpiece so that no sputtered material is wasted. For depositing a material onto small workpieces, a cooling backside gas volume is created between the pallet and the underside of sticky tape supporting the workpieces.

Physical Vapor Deposition System Using Rotating Pallet With X And Y Positioning

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US Patent:
20170114449, Apr 27, 2017
Filed:
Oct 26, 2015
Appl. No.:
14/923348
Inventors:
- San Jose CA, US
Srikanth Dasaradhi - San Jose CA, US
Lee LaBlanc - Sunnyvale CA, US
Suresh Palanisamy - Coimbatore, IN
Venkata Dora Chowdary Kakarla - San Jose CA, US
International Classification:
C23C 14/50
H01J 37/32
H01J 37/34
C23C 14/35
C23C 14/54
Abstract:
A circular PVD chamber has a plurality of sputtering targets mounted on a top wall of the chamber. A pallet in the chamber is coupled to a motor for rotating the pallet about its center axis. The pallet has a diameter less than the diameter of the circular chamber. The pallet is also shiftable in an XY direction to move the center of the pallet beneath any of the targets so all areas of a workpiece supported by the pallet can be positioned directly below any one of the targets. A scanning magnet is in back of each target and is moved, via a programmed controller, to only be above portions of the workpiece so that no sputtered material is wasted. For depositing a material onto small workpieces, a cooling backside gas volume is created between the pallet and the underside of sticky tape supporting the workpieces.
Control profile
Lee E Lablanc from Sunnyvale, CA, age ~62 Get Report