US Patent:
20040112478, Jun 17, 2004
Inventors:
Thomas Bieler - Lansing MI, US
K. N. Subramanian - Brighton MI, US
Sunglak Choi - Lansing MI, US
International Classification:
C22F001/00
Abstract:
Methods are disclosed for producing in-situ composite solders having a particulate intermetallic phase homogeneously distributed throughout the solder matrix. An eutectic solder is mixed with the components of the intermetallic phase, melted and rapidly cooled to form the desired solder. In-situ composite solder alloys formed by the disclosed method provide greater solder joint strength and fatigue resistance.