Resumes
Resumes
Kyle Woolrich Phones & Addresses
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1405 E Walnut Ave, El Segundo, CA 90245
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Redondo Beach, CA
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Los Angeles, CA
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San Luis Obispo, CA
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3223 Calle De Estella, Albuquerque, NM 87104 (505) 243-7225
Publications
Us Patents
Multi-Embedded Radio Frequency Board And Mobile Device Including The Same
View pageUS Patent:
20200214131, Jul 2, 2020
Filed:
Jan 2, 2019
Appl. No.:
16/237897
Inventors:
- Chicago IL, US
Kyle A. WOOLRICH - El Segundo CA, US
Jay Stuart SPENCE - Hermosa Beach CA, US
Kyle A. WOOLRICH - El Segundo CA, US
Jay Stuart SPENCE - Hermosa Beach CA, US
International Classification:
H05K 1/14
H05K 1/02
H05K 1/11
H01Q 1/28
H01Q 15/02
H05K 1/02
H05K 1/11
H01Q 1/28
H01Q 15/02
Abstract:
A multi-embedded radio frequency board includes a plurality of printed circuit boards stacked one on the others, at least one of the printed circuit boards of the plurality of printed circuit boards being configured so as to have a different processing function than another processing function of another printed circuit board of the plurality of printed circuit boards, and an interconnection join layer disposed between adjacent printed circuit boards of the plurality of printed circuit boards so as to physically and electrically couple the adjacent printed circuit boards to each other so as to form an integrated printed circuit board module having a predetermined radio frequency communication characteristic.
Systems And Methods For Thermal Control Of Integrated Circuits
View pageUS Patent:
20170162473, Jun 8, 2017
Filed:
Dec 8, 2015
Appl. No.:
14/963181
Inventors:
Kyle A. Woolrich - El Segundo CA, US
Jonathan M. Allison - Redondo Beach CA, US
Thomas Rust, III - Manhattan Beach CA, US
Robert E. Silhavy - Torrance CA, US
Jonathan M. Allison - Redondo Beach CA, US
Thomas Rust, III - Manhattan Beach CA, US
Robert E. Silhavy - Torrance CA, US
Assignee:
THE BOEING COMPANY - Chicago IL
International Classification:
H01L 23/46
H01L 21/50
H01L 27/02
H01L 21/50
H01L 27/02
Abstract:
A system includes a carrier defining a plurality of channels. The system includes an integrated circuit (IC) die having a first side and having a second side opposite the first side. The second side of the IC die is coupled to the carrier. The system includes a die attach layer between the carrier and the second side of the IC die. The die attach layer defines one or more openings that enable a fluid to flow from the carrier to the second side of the IC die.