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Kenyu N Tojima

from Sunnyvale, CA
Age ~49
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Also known as:
Kenyu T Tojima, Ken Tojima, Tojima Kenyu
Related to:
Terumi Tojima, 76Michio Tojima, 78Ken TojimaJoshiko Tojima
Connected to:
Anthony E Tojino, 45Aurora Tojo, 98Masayuki Tojo, 66Glenn M Tojoy, 38Yuko Toju, 53Oguz Tok, 45Ozkan Tok, 71Wesley P Tok, 33Audrey N Tokach, 44Eric D Tokajer, 62

Kenyu Tojima Phones & Addresses

  • Sunnyvale, CA
  • Saratoga, CA
  • Mountain View, CA
  • Santa Clara, CA
  • San Jose, CA
  • San Francisco, CA
  • Denver, CO

Publications

Us Patents

Three Dimensional Passive Multi-Component Structures

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US Patent:
20130201615, Aug 8, 2013
Filed:
Aug 22, 2012
Appl. No.:
13/592037
Inventors:
Shawn X. ARNOLD - San Jose CA, US
Douglas P. KIDD - San Jose CA, US
Sean A. MAYO - San Francisco CA, US
Scott P. MULLINS - Morgan Hill CA, US
Dennis R. PYPER - San Jose CA, US
Jeffrey M. THOMA - Mountain View CA, US
Kenyu TOJIMA - Santa Clara CA, US
Assignee:
APPLE INC. - Cupertino CA
International Classification:
H05K 1/18
G06F 1/16
H05K 7/06
US Classification:
36167902, 361761, 174260
Abstract:
Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.

Three Dimensional Passive Multi-Component Structures

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US Patent:
20130201616, Aug 8, 2013
Filed:
Aug 27, 2012
Appl. No.:
13/595976
Inventors:
Shawn X. ARNOLD - San Jose CA, US
Douglas P. Kidd - San Jose CA, US
Sean A. Mayo - San Francisco CA, US
Scott P. Mullins - Morgan Hill CA, US
Dennis R. Pyper - San Jose CA, US
Jeffrey M. Thoma - Mountain View CA, US
Kenyu Tojima - Santa Clara CA, US
Assignee:
Apple Inc. - Cupertino CA
International Classification:
H05K 7/06
H05K 3/30
G06F 1/16
US Classification:
36167902, 361767, 29832
Abstract:
Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can insulate the components from one another and also couple signals between the components on the first and second layers. In one embodiment, the components in the first and second layers are passive components.
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Kenyu N Tojima from Sunnyvale, CA, age ~49 Get Report