Kavitha Bharadwaj

20180323519, Nov 8, 2018

Jul 17, 2018

16/037093

- Berwyn PA, US
Vijay DAGA - Sunnyvale CA, US
Kavitha BHARADWAJ - Fremont CA, US
Ting GAO - Palo Alto CA, US

H01R 4/72
H01R 4/18
H01R 13/52

A system for sealing an electrical terminal which includes a device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal. The device includes a shrinkable tubing which is placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal. A sealant/adhesive is placed within the heat shrink tubing and has a first portion proximate to the edge of heat shrink tubing. The sealant/adhesive has a strip of high viscosity sealant/adhesive proximate a strip of low viscosity sealant/adhesive. Upon the application of heat to the device after installation of the device over the electrical terminal, the shrinkable tubing starts to recover, the first portion of the sealant/adhesive flows and seals free ends of the plurality of electrical wires to seal the free ends of the electrical wires.

20180226731, Aug 9, 2018

Apr 21, 2017

15/493342

- Berwyn PA, US
Vijay DAGA - Sunnyvale CA, US
Kavitha BHARADWAJ - Fremont CA, US
Ting GAO - Palo Alto CA, US

H01R 4/72

A system and device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal, wherein a shrinkable tubing is placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal. A band of the high viscosity sealant/adhesive is placed within the heat shrink tubing adjacent to the edge of heat shrink tubing. A band of the low viscosity sealant/adhesive is placed within the heat shrink tubing. Upon the application of heat to the device, the shrinkable tubing starts to recover, the high viscosity sealant/adhesive seals the edge of the shrinkable tubing and the low-viscosity sealant/adhesive flows across and through the plurality of electrical wires to create a seal. The high viscosity sealant/adhesive prevents flow of the low-viscosity sealant/adhesive from contaminating the electrical terminal.

20180226742, Aug 9, 2018

Feb 7, 2017

15/426552

- Berwyn PA, US
Vijay DAGA - Sunnyvale CA, US
Kavitha Bharadwaj - Fremont CA, US
Ting GAO - Palo Alto CA, US

H01R 13/52

A system and device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal, wherein the device further includes a first piece of heat shrink tubing having a predetermined length, wherein the first piece of heat shrink tubing has been placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal; a second piece of heat shrink tubing having a predetermined length, wherein the second piece of heat shrink tubing has a smaller diameter than the first piece of heat shrink tubing, and wherein the second piece of heat shrink tubing is placed partially inside the end of the first piece of heat shrink tubing that extends over the wire attachment portion of the electrical terminal; and a band of adhesive placed within the first piece of heat shrink tubing adjacent to the second piece of heat shrink tubing.

20180097344, Apr 5, 2018

Sep 30, 2016

15/282670

- Berwyn PA, US
Jaydip Das - Cupertino CA, US
Kavitha Bharadwaj - Fremont CA, US
Ting Gao - Palo Alto CA, US
Quentin F. Polosky - Santa Clara CA, US
Henry Paul S. Cervantes - Santa Clara CA, US

H02G 3/04
B29C 35/02
B29C 35/08
H01B 13/00
B29C 63/06
B29C 63/00

A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.

20170145170, May 25, 2017

Feb 6, 2017

15/425664

- Berwyn PA, US
Ting Gao - Palo Alto CA, US
Mark F. Wartenberg - Redwood City CA, US
Kavitha Bharadwaj - Fremont CA, US
Richard B. Lloyd - Sunnyvale CA, US
Rodney Ivan Martens - Mechanicsburg PA, US

TE Connectivity Corporation - Berwyn CA

C08J 3/20
H01B 13/00
H05K 9/00
H01R 13/50
B29B 7/90
H01Q 1/36
B29B 7/82
B29C 47/00
B29C 67/24
C08K 3/08
C08K 9/04
C08K 3/36
H01B 1/22
B29B 7/48

A composite formulation and composite product are disclosed. The composite formulation includes a polymer matrix having metal particles, the metal particles including dendritic particles and tin-containing particles. The metal particles are blended within the polymer matrix at a temperature greater than the melt temperature of the polymer matrix. The tin containing particles are at a concentration in the composite formulation of, by volume, between 10% and 36%, and the dendritic particles are at a concentration in the composite formulation of, by volume, between 16% and 40%. The temperature at which the metal particles are blended generates metal-metal diffusion of the metal particles, producing intermetallic phases, the temperature being at least the intermetallic annealing temperature of the metal particles.

20170004946, Jan 5, 2017

Jun 30, 2015

14/788530

- Berwyn PA, US
Ann O. Banich - Menlo Park CA, US
Jaydip Das - Cupertino CA, US
Chun-Kwan Tsang - Morgan Hill CA, US
Kavitha Bharadwaj - Fremont CA, US
Ting Gao - Palo Alto CA, US
Jianhua Chen - Sunnyvale CA, US
James Toth - San Carlos CA, US

Tyco Electronics Corporation - Berwyn PA

H01H 85/055

Conductive composite compositions and circuit protection devices including a conductive composite composition are disclosed. The conductive composite composition includes a polymer material, a plurality of conductive particles, and a high melting point additive. The high melting point additive comprises at least 1% of the conductive composite, by volume of the total composition. The circuit protection device includes a body portion comprising a conductive composite composition, the conductive composite composition comprising a polymer material, a plurality of conductive particles, and at least 1%, by volume, of a high melting point additive loaded in the polymer material, and leads extending from the body portion, the leads arranged and disposed to electrically couple the circuit protection device to an electrical system. Also provided is a method of forming a conductive composite.

20160042845, Feb 11, 2016

Jul 10, 2015

14/796644

- Berwyn PA, US
Ting Gao - Palo Alto CA, US
Nicola Pugliano - Redwood City CA, US
Mark F. Wartenberg - Redwood City CA, US
Diane G. Bigler - Redwood City CA, US
Mario G. Sepulveda - Newark CA, US
Kavitha Bharadwaj - Fremont CA, US
Richard B. Lloyd - Sunnyvale CA, US

Tyco Electronics Corporation - Berwyn PA

H01C 7/02
H01C 17/00
H01C 1/14

An electrical device having first and second electrodes and a layer of a conductive composite electrically in contact with the first and second electrodes. The conductive composite is a mixture of a semi-crystalline polymer and a conductive filler, the conductive filler including a plurality of particles containing an inner material including a first metal; and an outer material surrounding the inner material, the outer material including a second metal; and an intermetallic compound formed between the inner material and the outer material. The intermetallic compound has features from the inner material and the outer material. The device can be a circuit protection device. Also provided is a method of making a conductive composite by dry mixing the components.

20160012931, Jan 14, 2016

Jul 11, 2014

14/329684

- Berwyn PA, US
- Bensheim, DE
Kavitha Bharadwaj - Fremont CA, US
Nicola Pugliano - Redwood City CA, US
Dominique Freckmann - San Francisco CA, US
Helge Schmidt - Speyer, DE

Tyco Electronics Corporation - Berwyn CA
Tyco Electronics AMP GmbH - Bensheim

H01B 1/02
H01B 1/22

A conductive particle is disclosed. The conductive particle includes an inner material including a first metal and an outer material surrounding the inner material. The outer material includes a second metal. An intermetallic compound is formed between the inner material and the outer material, the intermetallic compound having features from the inner material and the outer material. The conductive particle has a maximum dimension of less than 200 micrometers and the outer material has an outer material thickness of between 0.2 micrometers and 10 micrometers. The conductive particle is substantially devoid of silver.