Search

Junjye Jack Yeh

from Livermore, CA
Age ~61
Get Report
Also known as:
Junjye Jye Yeh, Junjye Te Yeh, Junjye Kuo Yuyu Yeh, Junjye J Yeh, Jun Jye Yeh, Jack J Yeh, Jun J Yeh, Junjye Weh, Jjack Yeh, Jack Yeh Junjye
Phone and address:
2511 Bess Ave, Livermore, CA 94550
(925) 768-6004
Related to:
Hui Yeh Suhui, 59Erica Yeh, 34Cynthia Yeh, 33Erica Yeh, 32Yu Kuo Yuyu, 57Albert Yeh, 29
Connected to:
Agatha L Yeh, 73Anny C Yeh, 43Au C Yeh, 65Barry Yeh, 37Chester Yeh, 58Chung P Yeh, 47Dorothy W Yeh, 89Eugene Yeh, 45Faye Y Yeh, 63Greta Yeh, 65

Junjye Yeh Phones & Addresses

  • 2511 Bess Ave, Livermore, CA 94550 (925) 768-6004
  • Piscataway, NJ
  • Silver Spring, MD
  • Pleasanton, CA
  • 2511 Bess Ave, Livermore, CA 94550 (925) 454-1428

Work

Position: Homemaker

Education

Degree: Graduate or professional degree

Publications

Us Patents

Method Of Making A Product With Improved Material Properties By Moderate Heat Treatment Of A Metal Incorporating A Dilute Additive

View page
US Patent:
20010009724, Jul 26, 2001
Filed:
Jan 29, 2001
Appl. No.:
09/771163
Inventors:
Jimmy Chen - Pleasanton CA, US
Benjamin Eldridge - Danville CA, US
Thomas Dozier - Livermore CA, US
Junjye Yeh - Livermore CA, US
Gayle Herman - Danville CA, US
International Classification:
B32B015/02
C25D001/08
C25D005/50
C25D007/12
C25D003/02
C25D003/10
C25D003/12
C25D003/20
C25D003/38
C25D003/48
US Classification:
428/607000, 428/933000, 428/929000, 439/886000, 200/266000, 200/267000, 205/150000, 205/075000, 205/274000, 205/271000, 205/270000, 205/264000, 205/265000, 205/291000, 205/296000, 205/290000, 205/283000, 205/266000, 205/267000, 205/269000, 205/261000, 205/236000, 205/255000, 205/260000, 205/257000, 205/238000, 205/224000
Abstract:
Deposition of metal in a preferred shape, including coatings on parts, or stand-alone materials, and subsequent heat treatment to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25 C. This technique involves depositing a material in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment. This moderate heat treatment differs from other commonly employed “stress relief” heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. Coating and heat treating a spring-shaped substrate provides a resilient, conductive contact useful for electronic applications.

System For Testing An Integrated Circuit Of A Device And Its Method Of Use

View page
US Patent:
20100244866, Sep 30, 2010
Filed:
Mar 25, 2009
Appl. No.:
12/411233
Inventors:
Scott E. Lindsey - Brentwood CA, US
Junjye Yeh - Livermore CA, US
Jovan Jovanovic - Santa Clara CA, US
Seang P. Malathong - Newark CA, US
Assignee:
Aehr Test Systems - Fremont CA
International Classification:
G01R 31/28
H01R 24/00
G01R 31/02
US Classification:
324754, 324555, 439626
Abstract:
A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.

Method Of Making A Product With Improved Material Properties By Moderate Heat-Treatment Of A Metal Incorporating A Dilute Additive

View page
US Patent:
61501867, Nov 21, 2000
Filed:
Dec 22, 1998
Appl. No.:
9/217589
Inventors:
Jimmy Kuo-Wei Chen - Pleasanton CA
Benjamin N. Eldridge - Danville CA
Thomas H. Dozier - Livermore CA
Junjye J. Yeh - Livermore CA
Gayle J. Herman - Danville CA
Assignee:
FormFactor, Inc. - Livermore CA
International Classification:
H01L 2166
US Classification:
438 14
Abstract:
Deposition of metal in a preferred shape, including coatings on parts, or stand-alone materials, and subsequent heat treatment to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25. degree. C. This technique involves depositing a material in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment. This moderate heat treatment differs from other commonly employed "stress relief" heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. Coating a shape and heat treating provides a shaped deposit with improved material properties. Coating a shape with a portion connected to a base and a portion detached therefrom can provide a resilient, conductive contact useful for electronic applications.

Pressure Relief Valve

View page
US Patent:
20210364549, Nov 25, 2021
Filed:
Aug 2, 2021
Appl. No.:
17/391998
Inventors:
- Fremont CA, US
Junjye Yeh - Livermore CA, US
Jovan Jovanovic - Santa Clara CA, US
Seang P. Malathong - Newark CA, US
Assignee:
AEHR TEST SYSTEMS - Fremont CA
International Classification:
G01R 1/04
G01R 31/28
G01R 1/067
G01R 31/26
G01R 1/073
Abstract:
A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.

Pressure Relief Valve

View page
US Patent:
20190339303, Nov 7, 2019
Filed:
Jul 15, 2019
Appl. No.:
16/511816
Inventors:
- Fremont CA, US
Junjye Yeh - Livermore CA, US
Jovan Jovanovic - Santa Clara CA, US
Seang P. Malathong - Newark CA, US
Assignee:
Aehr Test Systems - Fremont CA
International Classification:
G01R 1/04
G01R 31/28
G01R 31/26
G01R 1/067
G01R 1/073
Abstract:
A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.

Limiting Translation For Consistent Substrate-To-Substrate Contact

View page
US Patent:
20180113150, Apr 26, 2018
Filed:
Dec 12, 2017
Appl. No.:
15/839707
Inventors:
- Fremont CA, US
Junjye Yeh - Livermore CA, US
Jovan Jovanovic - Santa Clara CA, US
Seang P. Malathong - Newark CA, US
Assignee:
Aehr Test Systems - Fremont CA
International Classification:
G01R 1/04
G01R 1/073
Abstract:
A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.

Controlling Alignment During A Thermal Cycle

View page
US Patent:
20150109011, Apr 23, 2015
Filed:
Dec 26, 2014
Appl. No.:
14/583545
Inventors:
- Fremont CA, US
Junjye Yeh - Livermore CA, US
Jovan Jovanovic - Santa Clara CA, US
Seang P. Malathong - Newark CA, US
Assignee:
AEHR TEST SYSTEMS - Fremont CA
International Classification:
G01R 31/28
G01R 1/04
G01R 1/067
G01R 31/26
US Classification:
32475019
Abstract:
A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.
Control profile
Junjye Jack Yeh from Livermore, CA, age ~61 Get Report