Inventors:
Scott R. Summerfelt - Cupertino CA
Theodore S. Moise - Los Altos CA
Guoqiang Xing - Plano TX
Luigi Colombo - Dallas TX
Tomoyuki Sakoda - San Jose CA
Stephen R. Gilbert - San Francisco CA
Alvin L. S. Loke - Singapore, SG
Shawming Ma - Sunnyvale CA
Rahim Kavari - Campbell CA
Jun Amano - Hillsborough CA
Assignee:
Agilent Technologies Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 218242
US Classification:
438240, 438 3, 438250, 438393
Abstract:
An embodiment of the instant invention is a method of fabricating a ferroelectric capacitor which is situated over a structure, the method comprising the steps of: forming a bottom electrode on the structure ( of FIG. ), the bottom electrode having a top surface and sides; forming a capacitor dielectric ( of FIG. ) comprised of a ferroelectric material on the bottom electrode, the capacitor dielectric having a top surface and sides; forming a top electrode ( and of FIG. ) on the capacitor dielectric, the top electrode having a top surface and sides, the ferroelectric capacitor is comprised of the bottom electrode, the capacitor dielectric, and the top electrode; forming a barrier layer ( and of FIG. ) on the side of the bottom electrode, the side of the capacitor dielectric, and the side of the top electrode; forming a dielectric layer on the barrier layer and the structure, the dielectric having a top surface and a bottom surface; and performing a thermal step for a duration at a temperature between 400 and 900 C. in an ambient comprised of a gas selected from the group consisting of: argon, nitrogen, and a combination thereof, the step of performing a thermal step being performed after the step of forming the barrier layer.