Inventors:
Ronald K. Minemier - Tempe AZ
Jon M. Dhuse - Chandler AZ
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 2715
H01L 3112
H01L 3300
Abstract:
A compound die may be formed of two dies each having face and back sides, said dies being connected with said dies in face to face alignment. A radiation communication system may be used to assist in aligning the dies and in providing communications between the two dies. In this way, a composite structure may be produced which has advanced capabilities, a small footprint, and low impedance.