Resumes
Resumes
Jeffrey Denatale Phones & Addresses
-
662 Whispering Oaks Pl, Newbury Park, CA 91320 (805) 312-4345
-
Thousand Oaks, CA
-
Davis, CA
-
662 Whispering Oaks Pl, Newbury Park, CA 91320
Work
Position:
Service Occupations
Education
Degree:
Associate degree or higher
Publications
Us Patents
Liquid-Medium Immersed Mems Devices
View pageUS Patent:
6771081, Aug 3, 2004
Filed:
Aug 22, 2002
Appl. No.:
10/227141
Inventors:
Philip A. Stupar - Oxnard CA
Jeffrey F. DeNatale - Thousand Oaks CA
Jeffrey F. DeNatale - Thousand Oaks CA
Assignee:
Rockwell Scientific Licensing, LLC - Thousand Oaks CA
International Classification:
G01R 2726
US Classification:
324663, 324457
Abstract:
Micro-electromechanical (MEM) devices having their fixed and movable members immersed in a liquid medium. Movement is effected by applying a stimulus which creates a force that causes the movable member to move with respect to the fixed member. The movable and fixed members are immersed in a liquid medium having desired characteristics. The liquid is preferably selected to have a viscosity which critically damps the motion of the movable member. The liquid may also be chosen to provide a dielectric constant greater than one, which, where applicable, increases the electrostatic force created for a given drive voltage, and the devices capacitance sensing range, over what they would be in air. The liquid medium might also be used to improve the devices thermal dissipation characteristics, or to provide improved isolation between structures.
Modules Integrating Mems Devices With Pre-Processed Electronic Circuitry, And Methods For Fabricating Such Modules
View pageUS Patent:
6979872, Dec 27, 2005
Filed:
May 13, 2003
Appl. No.:
10/438512
Inventors:
Jeffrey F. DeNatale - Thousand Oaks CA, US
Robert J. Anderson - Thousand Oaks CA, US
Robert J. Anderson - Thousand Oaks CA, US
Assignee:
Rockwell Scientific Licensing, LLC - Thousand Oaks CA
International Classification:
H01L029/84
US Classification:
257415
Abstract:
A MEMS module is provided comprising at least one MEMS device adhesively bonded to a substrate or wafer, such as a CMOS die, carrying pre-processed electronic circuitry. The at least one MEMS device, which may comprise a sensor or an actuator, may thus be integrated with related control, readout/signal conditioning, and/or signal processing circuitry. An example of a method pursuant to the invention comprises the adhesive bonding of a pre-processed electronics substrate or wafer to a layered structure preferably in the form of a silicon-on-insulator (SOI) substrate. The SOI is then bulk micromachined to selectively remove portions thereof to define the MEMS device. Prior to release of the MEMS device, the device and the associated electronic circuitry are electrically interconnected, for example, by wire bonds or metallized vias.
Low Loss Rf Phase Shifter With Flip-Chip Mounted Mems Interconnection
View pageUS Patent:
7068220, Jun 27, 2006
Filed:
Sep 29, 2003
Appl. No.:
10/675606
Inventors:
Jeffrey F. DeNatale - Thousand Oaks CA, US
Jonathan B. Hacker - Thousand Oaks CA, US
Robert E. Mihailovich - Newbury Park CA, US
William R. Norvell - Richardson TX, US
Jonathan B. Hacker - Thousand Oaks CA, US
Robert E. Mihailovich - Newbury Park CA, US
William R. Norvell - Richardson TX, US
Assignee:
Rockwell Scientific Licensing, LLC - Thousand Oaks CA
International Classification:
H01P 1/18
H01Q 3/32
H01Q 3/32
US Classification:
342375, 333156, 333161, 333105
Abstract:
A hybrid circuit phase shifter assembly of RF MEMS switch modules and passive phase delay shifter circuits uses a low loss, preferably flip-chip, interconnection technology. The hybrid circuit assembly approach separates the fabrication of the MEMS switch modules from the fabrication of the passive phase delay circuits thereby avoiding process incompatibilities and low yields and providing substantial production cost savings. In another aspect of the invention, the integration on a common substrate of a MEMS-based hybrid circuit phase shifter assembly behind each of a plurality of radiating elements provides a compact, low cost electronic scanning antenna array.
Process For Fabricating High Aspect Ratio Embossing Tool And Microstructures
View pageUS Patent:
7108819, Sep 19, 2006
Filed:
May 16, 2003
Appl. No.:
10/439503
Inventors:
Alan B Harker - Thousand Oaks CA, US
Jeffrey F DeNatale - Thousand Oaks CA, US
Dennis R Strauss - Ventura CA, US
Jeffrey F DeNatale - Thousand Oaks CA, US
Dennis R Strauss - Ventura CA, US
Assignee:
The Boeing Company - Chicago IL
International Classification:
B29C 33/38
US Classification:
264219, 205 70, 216 2, 216 11, 216 53, 216 57, 264293
Abstract:
A tool for embossing high aspect ratio microstructures is provided, wherein the microstructures provide decreased surface reflection and increased transmission through an optical component even at high incident angles. The tool is fabricated by a process that comprises anisotropic etching of columnar pits in a silicon substrate using inductively coupled plasma, followed by isotropic reactive ion etching of the columnar pits to create relatively pointed obelisks. The silicon substrate is then preferably rinsed to remove remaining photoresist prior to vapor depositing a conductive layer thereon. Finally, a metal is electroformed over the conductive layer to form the embossing tool. The embossing tool is then pressed against an optical coating, for example a polymer sheet, to create microstructures having aspect ratios from 1 to 5.
1:N Mem Switch Module
View pageUS Patent:
7157993, Jan 2, 2007
Filed:
Sep 30, 2003
Appl. No.:
10/676875
Inventors:
Jeffrey F. DeNatale - Thousand Oaks CA, US
Robert E. Mihailovich - Newbury Park CA, US
Jonathan B. Hacker - Thousand Oaks CA, US
Robert E. Mihailovich - Newbury Park CA, US
Jonathan B. Hacker - Thousand Oaks CA, US
Assignee:
Rockwell Scientific Licensing, LLC - Thousand Oaks CA
International Classification:
H01H 51/22
US Classification:
335 78, 200181
Abstract:
A 1:N MEM switch module comprises N MEM switches fabricated on a common substrate, each of which has input and output contacts and a movable contact which bridges the input and output contacts when the switch is actuated. The input contacts are connected to a common input node, and the output contacts are connected to respective output lines. Each output line has an associated inductance and effective capacitance, and is arranged such that its inductance is matched to its effective capacitance. The switches are preferably arranged symmetrically about the terminus point of the signal input line. A phase shifter employs at least two switch modules connected together with N transmission lines having different lengths, operated such that an input signal is routed via one of the transmission lines to effect a desired phase-shift.
Microelectromechanical System (Mems) Viscosity Sensor For Fluid Health Monitoring
View pageUS Patent:
7287415, Oct 30, 2007
Filed:
Sep 30, 2004
Appl. No.:
10/956229
Inventors:
Philip A. Stupar - Oxnard CA, US
Jeffrey F. DeNatale - Thousand Oaks CA, US
Jeffrey F. DeNatale - Thousand Oaks CA, US
Assignee:
Teledyne Licensing, LLC - Thousand Oaks CA
International Classification:
G01N 11/00
US Classification:
73 5401
Abstract:
Embodiments of the present invention are directed to a MEM viscosity sensor that is configured to be operated submerged in a liquid. The MEMS viscosity sensor comprises a MEMS variable capacitor comprising a plurality of capacitor plates capable of being submerged in a liquid. An actuator places a driving force on the variable capacitor which causes relative movement between the plates, where the movement creates a shear force between each moving plate and the liquid, which damps the movement of the plate and increases the capacitor's response time to the applied force in accordance with the liquid's viscosity. To determine the actual viscosity of the liquid, a sensor is coupled to the variable capacitor for sensing the response time of the plates as an indicator of the liquid's viscosity.
High Temperature Microelectromechanical (Mem) Devices And Fabrication Method
View pageUS Patent:
7303935, Dec 4, 2007
Filed:
Sep 8, 2005
Appl. No.:
11/222721
Inventors:
Jeffrey F. DeNatale - Thousand Oaks CA, US
Philip A. Stupar - Oxnard CA, US
Philip A. Stupar - Oxnard CA, US
Assignee:
Teledyne Licensing, LLC - Thousand Oaks CA
International Classification:
H01L 21/00
US Classification:
438 48, 438 50, 216 2
Abstract:
A microelectromechanical (MEM) device per the present invention comprises a semiconductor wafer—typically an SOI wafer, a substrate, and a high temperature bond which bonds the wafer to the substrate to form a composite structure. Portions of the composite structure are patterned and etched to define stationary and movable MEM elements, with the movable elements being mechanically coupled to the stationary elements. The high temperature bond is preferably a mechanical bond, with the wafer and substrate having respective bonding pads which are aligned and mechanically connected to form a thermocompression bond to effect the bonding. A metallization layer is typically deposited on the composite structure and patterned to provide electrical interconnections for the device. The metallization layer preferably comprises a conductive refractory material such as platinum to withstand high temperature environments.
Microelectromechanical (Mem) Fluid Health Sensing Device And Fabrication Method
View pageUS Patent:
7328604, Feb 12, 2008
Filed:
Sep 22, 2005
Appl. No.:
11/234015
Inventors:
Jeffrey F. DeNatale - Thousand Oaks CA, US
Philip A. Stupar - Oxnard CA, US
Martin W. Kendig - Thousand Oaks CA, US
Philip A. Stupar - Oxnard CA, US
Martin W. Kendig - Thousand Oaks CA, US
Assignee:
Teledyne Licensing, LLC - Thousand Oaks CA
International Classification:
G01N 11/00
US Classification:
73 5402, 73 5401, 73 5301
Abstract:
A microelectromechanical (MEM) fluid health sensing device comprises a viscosity sensor which provides an output that varies with the viscosity of a fluid in which it is immersed, and at least one other sensor which provides an output that varies with another predetermined parameter of the fluid. The viscosity sensor is preferably a MEM device fabricated by means of a “deep etch” process. The sensors are preferably integrated together on a common substrate, though they might also be fabricated separately and packaged together to form a hybrid device. A data processing means may be included which receives the sensor outputs and provides one or more outputs indicative of the health of the fluid. Sensor types which may be part of the present device include, for example, a temperature sensor, a MEM electrochemical sensor, a MEM accelerometer, a MEM contact switch lubricity sensor, and/or an inductive metallic wear sensor.