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Jaspreet S Dhau

from Tampa, FL
Age ~49
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Also known as:
Jaspreet Singh Dhau, Jespreet S Dhau
Related to:
Kanchan Dhau, 47Adelina EliasAmalia EliasMaria C EliasAlicia E Sanchez, 46Alicia Elias, 46Josefina Elias SanchezEsperanza EliasJosephina Elias, 35Amalia Elias, 41Aurelio Elias, 67
Connected to:
Poonam P Dhavale, 50Shilpa A Dhavale, 51Sachin M Dhawale, 42Ajat Dhawan, 35Amrit K Dhawan, 53Ashvin Dhawan, 40Hemant Dhawan, 45Kuldip Dhawan, 45Manoj Dhawan, 33Monica Dhawan, 56

Jaspreet Dhau Phones & Addresses

  • Tampa, FL
  • Menlo Park, CA

Resumes

Resumes

Jaspreet Dhau Photo 1

Assistant Professor

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Location:
Tampa, FL
Industry:
Higher Education
Work:
Florida Polytechnic University
Assistant Professor
University of South Florida
Visting Scientist
Sri International Sep 2005 - Sep 2008
Research Chemist
Sikh National College Qadian Gurdaspur India Jul 2002 - Aug 2003
Assistant Professor Stage I
Department of Chemistry Punjabi University Patiala India Jul 2002 - Aug 2003
Assistant Professor Stage Iii
Education:
Panjab University,Chandigarh 1999 - 2003
Doctorates, Doctor of Philosophy, Philosophy, Chemistry Himachal Pradesh University 1993 - 1998
Masters, Bachelors, Chemistry
Skills:
Organochalcogen Chemistry
Thermal Energy Storage
Corrosion
Materials Science
Metal Deposition
Electroplating
Chemistry
Manufacturing
Coatings
Jaspreet Dhau Photo 2

Director Of R And D

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Location:
Nashville, TN
Work:
Molekule India Pvt. Ltd
Director of R and D
Education:
Panjab University,Chandigarh 1999 - 2003
Doctorates, Doctor of Philosophy

Publications

Us Patents

Reduced Porosity Copper Deposition

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US Patent:
7989029, Aug 2, 2011
Filed:
Jun 20, 2008
Appl. No.:
12/143737
Inventors:
Jaspreet Singh Dhau - Menlo Park CA, US
Sunity K. Sharma - Fremont CA, US
Assignee:
SRI International - Menlo Park CA
International Classification:
B05D 3/12
B05D 5/12
US Classification:
427337, 257E29006, 257325, 427 58, 427 981, 427 984, 427 995, 427229, 427304, 427305, 427306, 427314, 4274301, 427457, 427556, 427560, 427581, 428209, 4284111
Abstract:
A method for reducing porosity of metal layers on a substrate may comprise depositing a precursor onto at least a portion of the substrate, and adding metal layers over the precursor comprising at least one cycle, wherein each cycle comprises: depositing a metal layer over the precursor, and exposing the metal layer to a breath-out solution.

Flexible Circuit Chemistry

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US Patent:
8110254, Feb 7, 2012
Filed:
Sep 12, 2007
Appl. No.:
11/854271
Inventors:
Sunity Sharma - Fremont CA, US
Jaspreet Singh Dhau - Menlo Park CA, US
Assignee:
SRI International - Menlo Park CA
International Classification:
H05K 3/00
H05K 3/02
G03F 7/16
G03F 7/00
US Classification:
427555, 427532, 427551, 427552, 427553, 427554, 427299, 427301, 427209, 427 984, 427304, 427 58, 427 961, 4271261, 4271265, 427180, 428901, 428356, 428209
Abstract:
The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.

Flexible Circuits

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US Patent:
8124226, Feb 28, 2012
Filed:
Apr 1, 2011
Appl. No.:
13/078831
Inventors:
Sunity Sharma - Fremont CA, US
Jaspreet Singh Dhau - Menlo Park CA, US
Assignee:
SRI International - Menlo Park CA
International Classification:
B32B 9/00
US Classification:
428356, 428209, 428901, 174259, 427305
Abstract:
The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.

Molecular Coating On Metal Surfaces

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US Patent:
8252381, Aug 28, 2012
Filed:
Apr 6, 2007
Appl. No.:
11/784507
Inventors:
Sunity K. Sharma - Fremont CA, US
Ravi Shankar - New Delhi, IN
Jaspreet S. Dhau - Menlo Park CA, US
Naishadh K. Saraiya - San Jose CA, US
Assignee:
CSL, Inc. - Santa Clara CA
International Classification:
C23C 22/48
US Classification:
427384, 4273881, 148248, 148252, 148274
Abstract:
A coated metal surface is disclosed, with a chemically-bonded film of long-chain organic groups. Such coating may be hydrophobic, and therefore repel the presence of water. This allows the surface to resist corrosion and surface oxidation, without diminishing the desired metallic characteristics of the surface. Further disclosed are methods for applying and coating on various substrates. Such coating may be advantageously applied to protect metals from corrosive environments such as air, water, chemicals, and bodily fluids.

Conductive Pattern Formation

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US Patent:
8628818, Jan 14, 2014
Filed:
Jun 19, 2008
Appl. No.:
12/142577
Inventors:
Sunity K. Sharma - Fremont CA, US
Francesco Fornasiero - Berkeley CA, US
Jaspreet Singh Dhau - Menlo Park CA, US
Assignee:
SRI International - Menlo Park CA
International Classification:
H05K 3/10
H05K 3/38
H05K 3/02
US Classification:
427 973, 427 58, 427 961, 427 971, 427 984, 427123, 427125, 427256, 427258, 427259, 427261, 427270, 427271, 427272, 427282, 29846, 29829, 29825, 29592
Abstract:
A system and method for forming conductive lines on a substrate comprising depositing a precursor onto at least a portion of the substrate, depositing a thin layer of conductive material over the precursor, forming a negative-patterned mask over a portion of the thin layer of conductive material to form an exposed pattern, forming conductive lines in the exposed pattern, removing the patterned mask thereby uncovering an exposed portion of the conductive layer that substantially corresponds to the negative pattern portion, and removing the exposed portion of the conductive layer so as to uncover substrate that substantially corresponds to the exposed portion.

Flexible Circuit Chemistry

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US Patent:
20120100286, Apr 26, 2012
Filed:
Dec 30, 2011
Appl. No.:
13/341828
Inventors:
Sunity Sharma - Fremont CA, US
Jaspreet Singh Dhau - Menlo Park CA, US
Assignee:
SRI INTERNATIONAL - Menlo Park CA
International Classification:
B05D 5/12
US Classification:
427125
Abstract:
The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.

Flexible Circuit Chemistry

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US Patent:
20130230667, Sep 5, 2013
Filed:
Apr 18, 2013
Appl. No.:
13/865855
Inventors:
Jaspreet Singh Dhau - Menlo Park CA, US
Assignee:
SRI International - Menlo Park CA
International Classification:
H05K 3/12
US Classification:
427552, 427 984, 427555, 427557, 427558, 427553
Abstract:
The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.

Flexible Circuits

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US Patent:
7981508, Jul 19, 2011
Filed:
Sep 12, 2007
Appl. No.:
11/854274
Inventors:
Sunity Sharma - Fremont CA, US
Jaspreet Singh Dhau - Menlo Park CA, US
Assignee:
SRI International - Menlo Park CA
International Classification:
B32B 9/00
US Classification:
428356, 428209, 428901, 174259, 427305
Abstract:
The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.
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Jaspreet S Dhau from Tampa, FL, age ~49 Get Report