Inventors:
David F. Bell - Woodstock NY
Bruno R. Pagnani - Raleigh NC
James R. Warnot - Rhinebeck NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 720
Abstract:
A board containing plural superconducting power planes, one for each required potential level, is used to distribute power to one or more semiconductor logic chips which, together with the board, are immersed in liquid nitrogen. Each chip is coupled thermally to a heat exchanger and is coupled electrically to the board through leads that minimize heat transfer from the chip to the board.