Search

James V Noval

from Beaverton, OR
Age ~78
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Also known as:
James U Noval, Jim V Noval
Related to:
Raluca Ghiban, 39Penny BoydTracy L Craig, 52Amanda Boyd, 45
Connected to:
Beatriz R Noval, 89Javier P Noval, 70Jenny R Noval, 40Jessica D Noval, 42John Noval, 40Josephine P Noval, 68Monica Noval, 41Nino Noval, 58William N Noval, 42Rachel C Novalany, 59

James Noval Phones & Addresses

  • Beaverton, OR
  • 1490 124Th Ave, Portland, OR 97229
  • 16520 NW Mission Oaks Dr, Beaverton, OR 97006

Publications

Us Patents

Multilayer Printed Circuit Board And Manufacturing Method Thereof

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US Patent:
61802158, Jan 30, 2001
Filed:
Jul 14, 1999
Appl. No.:
9/353310
Inventors:
John T. Sprietsma - Hillsboro OR
James V. Noval - Beaverton OR
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
B32B 300
H05K 111
US Classification:
428209
Abstract:
Disclosed is a multilayer (e. g. , 4-layer) printed circuit board and method of manufacture thereof. The multilayer printed circuit board has at least one inner substrate (inner core) that includes a phenolic resin (e. g. , a phenolic resin-laminated paper). Outer insulating layers of the multilayer printed circuit board can have a low dielectric constant (e. g. , 3. 8-4. 4) and a high T. sub. g (e. g. , 180. degree. -200. degree. C. ). The multilayer printed circuit board can be provided by steps including forming electrical circuit patterns from a copper foil on the inner substrate, to form a printed circuit board, forming a stack of at least one printed circuit board and outer copper foil layers, with insulating layers of, e. g. , a semi-cured resin (e. g. , prepreg layers) interposed between adjacent conductive metal layers, and then laminating the stack.

Processor Card Assembly Including A Heat Sink Attachment Plate And An Emi/Esd Shielding Cage

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US Patent:
58385428, Nov 17, 1998
Filed:
Sep 30, 1996
Appl. No.:
8/723027
Inventors:
Darul J. Nelson - Beaverton OR
James V. Noval - Portland OR
Ricardo E. Suarez - Beaverton OR
Mostafa A. Aghazadeh - Chandler AZ
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 720
H05K 900
US Classification:
361704
Abstract:
The processor card assembly of the present invention includes a processor card, a metallic plate and a back cover. The processor card includes a circuit board having a processor mounted thereto. The circuit board includes a first and a second plurality of fastening features. The metallic plate has a third and a fourth plurality of fastening features. The third plurality of fastening features cooperate with the first plurality of fastening features for physically attaching and thermally coupling the processor to the metallic plate, to serve as a base for further thermally coupling the processor to a heat sink. The back cover has a fifth plurality of fastening features that cooperate with the second plurality of fastening features of the circuit board and the fourth plurality of fastening features of the metallic plate to allow the metallic plate and the back cover to physically and electro-magnetically form a Faraday cage enclosing the processor card to shield off electro-magnetic interference emissions and electrostatic discharge from the processor.
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James V Noval from Beaverton, OR, age ~78 Get Report