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James E More

from North Saint Paul, MN
Age ~43

James More Phones & Addresses

  • 3599 Garden Ave, Saint Paul, MN 55128 (651) 773-9092
  • 7117 Victoria St, Saint Paul, MN 55125 (651) 739-9340
  • North Saint Paul, MN
  • Oakdale, MN
  • New York, NY
  • 3599 Garden Blvd N, Saint Paul, MN 55128 (651) 343-1619

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Resumes

Resumes

James More Photo 1

Ceo At My Owen Inc

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Position:
ceo at my owen INc
Location:
United States
Industry:
Import and Export
Work:
my owen INc
ceo
James More Photo 2

James More

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Location:
United States

Business Records

Name / Title
Company / Classification
Phones & Addresses
James J. More
DUBLIN IRRIGATION, LC

Publications

Us Patents

Deformable Die For Use With Sealant Pads

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US Patent:
50357662, Jul 30, 1991
Filed:
Sep 22, 1989
Appl. No.:
7/410957
Inventors:
James R. More - Woodbury MN
Arnold T. Olsen - Austin TX
John S. Young - Austin TX
Assignee:
Minnesota Mining and Manufacturing Company - St. Paul MN
International Classification:
B30B 100
US Classification:
156581
Abstract:
Die plates for forming moisture seals about the junctions of wire harnesses afford improved wire separation and contact between the sealant material in a sealant pad and the wires if the opposed die plates have an elastomeric surface, and the opposed surface of at least one plate is radiused causing the sealant material to separate the wires and flow between and around each wire.

Electrical Environmental Sealant And Method

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US Patent:
48635359, Sep 5, 1989
Filed:
Dec 9, 1987
Appl. No.:
7/130541
Inventors:
James R. More - Woodbury MN
Assignee:
Minnesota Mining and Manufacturing Company - St. Paul MN
International Classification:
H01B 1310
US Classification:
156 49
Abstract:
A method and arrangement are provided to generate an environmental seal around a connection such as an electrical junction. The arrangement comprises a pad arrangement having a substrate and a sealant pad associated therewith. The sealant pad comprises a highly viscous sealant which, under pressure, can be forced into areas between adjacent wires, to provide effective moisture seals. According to preferred methods of the present invention a substrate having sealant thereon is folded around a junction to be sealed, such that the substrate retains the sealant against the electrical junction. In a step of the preferred method, pressure is applied to the enclosed sealant pad, generating hydraulic forces contained in such a manner as to the direct sealant between adjacent wires, spreading same apart. In preferred applications, preferred direction of sealant is facilitated by a preferred pressure die arrangement.
James E More from North Saint Paul, MN, age ~43 Get Report