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James H Kaskade

from Woodside, CA
Age ~58
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Also known as:
James Jack Hjerpe, James J Hjerpe, Jim H Kaskade, Jim J Hjerpe, Jim S
Phone and address:
231 Hillside Dr, Redwood City, CA 94062
(415) 938-7891
Related to:
Rosemarie ScicutellaAntje Hjerpe, 81James A Hjerpe, 80Rosalia Lim, 75
Connected to:
Letisha L Kaskaske, 45Ken J Kaske, 42Tom M Kaske, 78Melissa Kaskel, 38Amy L Kaskeski, 41Joan J Kaskeski, 78Richard P Kaskeski, 78Alexandria Kaskewicz, 38Daniela J Kaskey, 47Gunnar W Kaski, 43

James Kaskade Phones & Addresses

  • 231 Hillside Dr, Redwood City, CA 94062 (415) 938-7891
  • Woodside, CA
  • Solana Beach, CA
  • Carlsbad, CA
  • Pacifica, CA
  • Encinitas, CA
  • San Mateo, CA
  • 231 Hillside Dr, Woodside, CA 94062

Work

Company: Sios technology, inc. Jan 2010 Position: Gm, chief of cloud

Education

Degree: Masters School / High School: University of San Diego 1989 to 1993 Specialities: Business Administration

Skills

Building and leading venture-backed tech... • Managing new business development process • Initiating & managing strategic partners... • Leading technology licensing • Spearheading technology & company acquis... • Performing in-depth market & competitive... • Producing ROI business justifications • Raising venture capital • Leading M&A transactions

Awards

Patent: All digital phase locked loop, P...

Interests

surfing, swimming, hiking, running, biki...

Industries

Executive Office

Resumes

Resumes

James Kaskade Photo 1

James Kaskade

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Position:
GM, Chief Of Cloud at SIOS Technology, Inc., Mentor at Founder Institute, Entrepreneur In Residence (EIR) at Express Ventures, Co-Founder at GreenEdge
Location:
San Francisco Bay Area
Industry:
Executive Office
Work:
SIOS Technology, Inc. since Jan 2010
GM, Chief Of Cloud
Founder Institute since Jan 2009
Mentor
Express Ventures since Oct 2008
Entrepreneur In Residence (EIR)
GreenEdge since Nov 2007
Co-Founder
Stealth Cloud Computing Startup Jan 2009 - Jun 2009
Acting CEO
Education:
University of San Diego 1989 - 1993
Masters, Business AdministrationEmphasis in new product development, marketing, and corporate finance. University of California, Santa Barbara 1984 - 1988
Bachelors, Electrical & Computer ScienceEmphasis in computer hardware and software architectures, and IC (FPGA/ASIC) design.
Skills:
Building and leading venture-backed technology startup
Managing new business development process
Initiating & managing strategic partnerships
Leading technology licensing
Spearheading technology & company acquisitions
Performing in-depth market & competitive research
Producing ROI business justifications
Raising venture capital
Leading M&A transactions
Interests:
surfing, swimming, hiking, running, biking, skiing, camping, having fun with my wife (Annie) and kids (Trevor and Devon).
Honor & Awards:
Patent: All digital phase locked loop, Patent: Apparatus for providing power to a microprocessor with integrated thermal and EMI management, Patent: Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management, Patent: SYSTEM AND METHODS FOR CREATING, COLLECTING, AND USING METADATA, Patent: SYSTEM AND METHODS FOR ONLINE COLLABORATIVE VIDEO CREATION, Patent: AUTOMATIC AGGREGATION OF CONTENT FOR USE IN AN ONLINE VIDEO EDITING SYSTEM, Patent: SYSTEM AND METHODS FOR STORING, EDITING, AND SHARING DIGITAL VIDEO, Patent: SYSTEM AND METHODS FOR DISTRIBUTED EDIT PROCESSING IN AN ONLINE VIDEO EDITING SYSTEM

Business Records

Name / Title
Company / Classification
Phones & Addresses
James H. Kaskade
President
EYESPOT CORPORATION
725 S Coast Hwy 101, Encinitas, CA 92024

Publications

Us Patents

Method And Apparatus For Providing Power To A Microprocessor With Integrated Thermal And Emi Management

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US Patent:
20020196614, Dec 26, 2002
Filed:
Jul 23, 2002
Appl. No.:
10/201384
Inventors:
Joseph DiBene - Oceanside CA, US
David Hartke - Lake Havasu City AZ, US
James Kaskade - Solana Beach CA, US
Carl Hoge - San Diego CA, US
Assignee:
INCEP Technologies, Inc. - San Diego CA
International Classification:
H05K001/14
H05K007/20
H01R012/04
US Classification:
361/803000, 361/804000, 361/769000, 361/770000, 439/074000, 439/066000, 361/719000, 361/720000, 439/108000
Abstract:
A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

System And Methods For Online Collaborative Video Creation

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US Patent:
20090196570, Aug 6, 2009
Filed:
Jan 5, 2007
Appl. No.:
12/159736
Inventors:
David A. Dudas - Encinitas CA, US
James H. Kaskade - Encinitas CA, US
Kenneth W. O'Flaherty - Encinitas CA, US
Assignee:
EYESOPT CORPORATION - Encinitas CA
International Classification:
H04N 5/93
G06F 15/16
US Classification:
386 52, 709206
Abstract:
A system and related methods comprise an Internet-hosted application service for online storage, editing and sharing of digital video content, whereby a group of users collaborate to jointly create a video production. Three methods are outlined for use with an online editor: sequential (round-robin editing), largely parallel (editor-in-charge editing), and fully parallel (Delphi editing). The Internet-hosted application service can be used on a dedicated website or its functionality can be served to different websites seeking to provide users with enhanced video editing capabilities.

Apparatus For Providing Power To A Microprocessor With Integrated Thermal And Emi Management

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US Patent:
6452113, Sep 17, 2002
Filed:
Feb 16, 2001
Appl. No.:
09/785892
Inventors:
David H. Hartke - Durango CO
James Hjerpe Kaskade - Solana Beach CA
Carl E. Hoge - San Diego CA
Assignee:
INCEP Technologies, Inc. - San Diego CA
International Classification:
H05K 116
US Classification:
174260, 361785, 174261
Abstract:
A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.
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James H Kaskade from Woodside, CA, age ~58 Get Report