Igor Markovsky

20120043023, Feb 23, 2012

Mar 14, 2011

13/047052

Kartik Ramaswamy - San Jose CA, US
Igor Markovsky - San Jose CA, US
Zhigang Chen - Campbell CA, US
James D. Carducci - Sunnyvale CA, US
Kenneth S. Collins - San Jose CA, US
Shahid Rauf - Pleasanton CA, US
Nipun Misra - San Jose CA, US
Leonid Dorf - San Jose CA, US
Zheng John Ye - Santa Clara CA, US

Applied Materials, Inc. - Santa Clara CA

H01L 21/306

15634544

The disclosure pertains to a capactively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a folded structure and symmetrical power distribution.

20110151590, Jun 23, 2011

Jul 29, 2010

12/846664

James D. Carducci - Sunnyvale CA, US
Srinivas D. Nemani - Sunnyvale CA, US
Hairong Tang - San Jose CA, US
Hui Sun - Xian, CN
Igor Markovsky - San Jose CA, US
Ezra R. Gold - Sunnyvale CA, US
Iwalani S. Kaya - Santa Clara CA, US
Ellie Y. Yieh - San Jose CA, US
Chunlei Zhang - Santa Clara CA, US
Kenneth S. Collins - San Jose CA, US
Michael D. Armacost - San Jose CA, US
Ajit Balakrishna - Sunnyvale CA, US
Thorsten B. Lill - Santa Clara CA, US

Applied Materials, Inc. - Santa Clara CA

H01L 21/00
C23C 16/50
H01L 21/465

438 4, 118726, 118723 R, 15634551, 257E21001

A method, a system and a computer readable medium for integrated in-vacuo repair of low-k dielectric thin films damaged by etch and/or strip processing. A repair chamber is integrated onto a same platform as a plasma etch and/or strip chamber to repair a low-k dielectric thin film without breaking vacuum between the damage event and the repair event. UV radiation may be provided on the integrated etch/repair platform in any combination of before, after, or during the low-k repair treatment to increase efficacy of the repair treatment and/or stability of repair.

20220231523, Jul 21, 2022

Mar 26, 2021

17/213693

- Menlo Park CA, US
Ines Le Bihan - Seattle WA, US
Eric Daniels - San Francisco CA, US
Igor Markovsky - Campbell CA, US
Punit Narendra Govenji - Pleasanton CA, US
Raymond Lee - Palo Alto CA, US
Benjamin Elliott Tunberg Rogoza - Leavenworth WA, US
Jaykishan Dakshesh Choksi - Santa Clara CA, US

H02J 7/00
H02J 7/34
G02B 27/01
G02C 11/00
A45C 11/04
A45C 15/00

A disclosed system may include (1) an artificial-reality display dimensioned to be worn by a user, the artificial-reality display comprising (A) a battery and (B) at least one recipient charging element, and (2) a charging case dimensioned to accommodate the artificial-reality display, the charging case comprising (A) at least one source charging element configured to interface with the recipient charging element of the artificial-reality display to facilitate charging the battery of the artificial-reality display and (B) at least one alignment guide that forces the recipient charging element of the artificial-reality display to energizingly couple with the source charging element of the charging case. Various other apparatuses, systems, and methods are also disclosed.

20210313147, Oct 7, 2021

Jun 21, 2021

17/353668

- Santa Clara CA, US
Igor Markovsky - San Jose CA, US
Zhigang Chen - San Francisco CA, US
James D. Carducci - Sunnyvale CA, US
Kenneth S. Collins - San Jose CA, US
Shahid Rauf - Pleasanton CA, US
Nipun Misra - Emeryville CA, US
Leonid Dorf - San Jose CA, US
Zheng John Ye - Santa Clara CA, US

H01J 37/32

The disclosure pertains to a capacitively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a symmetrical power distribution.

20210286493, Sep 16, 2021

Mar 4, 2019

17/250678

- Mountain View CA, US
Diego Rivas - Mountain View CA, US
Igor Markovsky - Sunnyvale CA, US
Debanjan Mukherjee - San Jose CA, US

G06F 3/041
G06F 3/01

According to one aspect, a trackpad includes: a substrate; a stiffener plate; a circuit board between the substrate and the stiffener plate, the circuit board comprising position detecting circuitry configured to detect a position of an object adjacent the substrate, the circuit board including an inductive element; a grounding element that electrically connects the stiffener plate and the circuit board to each other; and force sensing circuitry configured to detect force applied to the substrate, the force detected using the inductive element.

20200301153, Sep 24, 2020

Mar 20, 2019

16/359853

- Redmond WA, US
Michael NIKKHOO - Saratoga CA, US
Michael Neil BEERMAN - Mill Valley CA, US
Marianne E. LAFORD - Palo Alto CA, US
Igor MARKOVSKY - San Jose CA, US
Simon HODGSON - Morgan Hill CA, US

G02B 27/01
G05B 19/404
B29C 70/20

A Near-Eye-Display (NED) device having a housing shell that is integrated with molded boss clusters for precision mounting of hardware components. The techniques disclosed herein include forming a housing shell directly over one or more pre-molded boss clusters that have been inserted into cavities of a housing shell mold core. For example, with the pre-molded boss clusters already inserted into the cavities, a selected housing shell material such as a thermosetting epoxy resin impregnated carbon fiber reinforced (CFRP) fabric may be thermal compression molded over the housing shell mold core. Individual ones of the pre-molded boss clusters include one or more “three-dimensional (3D)” bosses for mounting various hardware components of the NED device. The bosses may protrude from an inner surface of the housing shell and may provide interior mounting features without affecting the appearance of the outer surface of the housing shell.

20200057477, Feb 20, 2020

Aug 14, 2018

16/103265

- Mountain View CA, US
Kenneth Ryan Loo - San Jose CA, US
Igor Markovsky - Sunnyvale CA, US

G06F 1/20
H05K 7/20
G06F 1/16

Techniques of managing heat within an electronic device include providing a vapor chamber as an external surface of an electronic device. For example, when the electronic device includes a thin notebook computer (e.g., an “ultrabook”), the vapor chamber may be, in its entirety or at least a part of, the d-case (i.e., the bottom cover or exterior surface of the laptop, opposite the keyboard and/or trackpad when the notebook computer is open). Such a vapor chamber may be very thin (as thin as 0.3 mm), while being about 50% more stiff and 50× more thermally conductive as aluminum, which may be used as the d-case in conventional notebook computers.

20190377189, Dec 12, 2019

Jun 11, 2018

16/005297

- Redmond WA, US
Igor MARKOVSKY - San Jose CA, US
Michael NIKKHOO - Saratoga CA, US
Joseph Daniel TAYLOR - San Francisco CA, US
Michael Neil BEERMAN - Mill Valley CA, US
Marianne Elizabeth LAFORD - Palo Alto CA, US

G02B 27/01
H04R 1/02

A housing, including mounting features for directly mounted components, is formed by curing carbon fiber reinforced polymer (CFRP) and a molding compound (MC) such as a sheet molding compound (SMC) or a bulk molding compound (BMC). SMC or BMC may be used depending on the implementation. This forms a housing with mounting features in a thermoset manner, in which the weight of a product such as a head mounted display (which incorporates the housing comprising the mounting features) is reduced, and any orientation issues or problems are significantly reduced.