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Igor V Kadija

from Raleigh, NC
Age ~84
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Also known as:
Igor Radija, Joel Jeannotte
Phone and address:
7617 Astoria Pl, Raleigh, NC 27612
(919) 803-4418
Related to:
Macrae Wimer, 30Franklin Wimer, 61Karl Wimer, 57Frances Justice, 54Joyce Wimer, 88Michael R Smith, 54
Connected to:
Denise M Kadilak, 61Jacquelyn C Kadilak, 72Shelly R Kadilak, 51John J Kadilis, 85Gretchen F Kadillak, 65Antoneta Kadilli, 51Ahmad Kadim, 51Gladys S Kadima, 71Joan S Kadin, 81Richard H Kadin, 69

Igor Kadija Phones & Addresses

  • 7617 Astoria Pl, Raleigh, NC 27612 (919) 803-4418
  • 136 Chestnut St, Midland Park, NJ 07432 (201) 670-8397
  • 118 Sherwood Rd, Ridgewood, NJ 07450 (201) 670-8397
  • 120 Sherwood Rd, Ridgewood, NJ 07450
  • Cheshire, CT
  • West Allis, WI
  • Miami, FL
  • Atlanta, GA

Resumes

Resumes

Igor Kadija Photo 1

Igor Kadija

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Location:
7617 Astoria Pl, Raleigh, NC 27612
Industry:
Nanotechnology
Work:
Electrochemical Systems, Inc.
President
Skills:
Entrepreneurship
R&D
Semiconductors
Product Development
Start Ups
Coatings
Chemistry
Sensors
Manufacturing
Physics
Materials
Patents
Process Engineering
Process Simulation
Design of Experiments
Electronics
Thin Films
Igor Kadija Photo 2

President And Chief Executive Officer

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Location:
Raleigh, NC
Industry:
Research
Work:
Ecsi Fibrotools
President and Chief Executive Officer
Electrochemical Systems
Owner

Business Records

Name / Title
Company / Classification
Phones & Addresses
Igor Kadija
Founder
Electrochemical Systems, Inc
Mfg of Equipment for Interconnects · Whol Electronic Parts/Equipment
7617 Astoria Pl, Raleigh, NC 27612

Publications

Us Patents

Conformable Nickel Coating And Process For Coating An Article With A Conformable Nickel Coating

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US Patent:
6399220, Jun 4, 2002
Filed:
Mar 22, 2000
Appl. No.:
09/533001
Inventors:
Joseph Anthony Abys - Warren NJ
Chonglun Fan - Bridgewater NJ
Igor Veljko Kadija - Ridgewood NJ
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
B32B 1501
US Classification:
428675, 428679, 428929, 428935, 257677
Abstract:
The present invention is directed to a lead frame in which the metal lead frame substrate is copper, copper alloy, or iron alloy. The lead frame substrate is coated with a conformable nickel coating that is crack-resistant when the lead frame is bent to an angle of at least about 82 degrees with a bend radius of about 100 m to about 300 m. Bending the lead frame in this manner causes surface deformations in the lead frame substrate. Cracks do not appear through the thickness of the conformable nickel coating of the present invention when the depth of the deformations that result from this bending do not exceed about 5 m.

Ultra-Miniature Electrical Contacts And Method Of Manufacture

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US Patent:
6484395, Nov 26, 2002
Filed:
Jul 18, 2000
Appl. No.:
09/618842
Inventors:
Robert B. Marcus - New Providence NJ
Igor V. Kadija - Ridgewood NJ
Robert Reuven Aharonov - Rockaway NJ
Assignee:
Murray Hill Devices - Murray Hill NJ
International Classification:
H05K 300
US Classification:
29842, 29844, 29846
Abstract:
Ultra-miniature electrical contacts are provided with the strength and resilience necessary to give stable low resistance connection, to minute areas of a device, such as a thousand or so closely spaced surface pads of an integrated circuit. Each contact is initially formed on a substrate as a thin, narrow elongated flat body comprised of selectively deposited layers of metal. Depending on the final configuration desired for the contact, the metal of one metal layer has a coefficient of thermal expansion such as chromium (Cr), and the metal of another layer has a coefficient of thermal expansion such as copper (Cu). Each contact is permanently formed (by differential expansion of the metal layers when heated) into a three-dimensional structure and is then made ârobustâ by a covering of a specialized stiffening metal plating which adds substantial strength to the contact. This also makes the contact âspringyâ and enables the contact to be deformed substantially without permanent deformation or âsetâ. Such ultra-miniature contacts are made using photolithography and techniques for deposition of metals and other materials onto a substrate, as commonly used in the semiconductor industry.

Electrodeposition Of Palladium Films

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US Patent:
49117998, Mar 27, 1990
Filed:
Aug 29, 1989
Appl. No.:
7/400199
Inventors:
Joseph A. Abys - Warren NJ
Vijay Chinchankar - Belleville NJ
Virginia T. Eckert - Summit NJ
Igor V. Kadija - Ridgewood NJ
Edward J. Kudrak - Clifton NJ
Joseph J. Maisano - Denville NJ
Heinrich K. Straschil - Summit NJ
Assignee:
AT&T Bell Laboratories - Murray Hill NJ
International Classification:
C25D 352
C25D 356
US Classification:
204 446
Abstract:
A process for electroplating palladium containing deposits from baths comprising a combination of a surfactant and a brightener combination. The surfactant is an alkyl, ammonium-type salt containing 4 to 35 carbon atoms. The brightener is 0-benzaldehydesulfonic acid, 1-naphthalene sulfonic acid, 2-naphthalenesulfonic acid, benzenesulfinic acid, oxy-4,4-bis (benzene) sulfinic acid, p-toluene sulfinic acid, 3-trifluoromethyl benzene sulfinic acid, allyl phenyl sulfone, 0-benzoic sulfamide, benzylsulfonyl propionamide, phenylsulfonyl acetamide, 3-(phenylsulfonyl) propionamide, benzene sulfonamide, bis (phenylsulfonyl) methane, guanidine carbonate, sulfaguanidine or nicotinic acid. This combination provides deposits having superior adhesion and ductility.

Process And Apparatus For Producing Surface Treated Metal Foil

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US Patent:
44902182, Dec 25, 1984
Filed:
Nov 7, 1983
Appl. No.:
6/549102
Inventors:
Igor V. Kadija - Cheshire CT
James E. Oxley - New Haven CT
Assignee:
Olin Corporation - New Haven CT
International Classification:
C25D 104
C25D 1700
US Classification:
204 13
Abstract:
A process and apparatus for producing surface treated metal foil is described. The process comprises plating a relatively smooth metal foil onto a cathodic surface and thereafter forming a dendritic layer on the foil and firmly bonding it thereto while the foil is still on the cathodic surface. In one embodiment, the apparatus comprises an electrolytic cell containing an electrolyte, a rotating drum cathode at least partially immersed in the electrolyte, at least two primary anodes and a plurality of treatment anodes embedded in one of the primary anodes.

One-Step Plasma Treatment Of Copper Foils To Increase Their Laminate Adhesion

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US Patent:
45268061, Jul 2, 1985
Filed:
Nov 22, 1983
Appl. No.:
6/554465
Inventors:
Reza Haque - Hamden CT
Edward F. Smith - Madison CT
Igor V. Kadija - Cheshire CT
Assignee:
Olin Corporation - New Haven CT
International Classification:
B05D 306
US Classification:
427 41
Abstract:
A one-step plasma treatment for improving the laminate adhesion of metallic and non-metallic substrates is described. The treatment comprises forming a plasma of a polar containing organic species and at least one of nitrogen and hydrogen and exposing a substrate material to the plasma for a period of time sufficient to deposit a polymeric film on at least one surface. In a preferred embodiment, a plasma of an azole, nitrogen and/or hydrogen is utilized. The process has particular utility in forming adherent polymeric films on one or more surfaces of copper and copper alloy foils to be used in printed circuit applications.

Electrochemical Cell And Process For Manufacturing Temperature Sensitive Solutions

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US Patent:
44824408, Nov 13, 1984
Filed:
Oct 6, 1983
Appl. No.:
6/539606
Inventors:
Igor V. Kadija - Cheshire CT
Assignee:
Olin Corporation - New Haven CT
International Classification:
C25C 100
C25C 112
C25C 700
US Classification:
204105R
Abstract:
An electrochemical cell for regenerating temperature sensitive solutions is described. In a preferred construction, the cell comprises a central electrode chamber and two counterelectrode chambers. To maintain the temperature of the electrolyte within a desired temperature range, the electrode in the electrode chamber is formed from at least one hollow tube through which a heat exchange medium flows. In a preferred construction, the electrode comprises a plurality of hollow tubes and a plurality of current collectors bonded to the tubes to form a grid-like structure.

Electrochemical Synthesis Of Palladium Hydroxide Compounds

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US Patent:
51356228, Aug 4, 1992
Filed:
Dec 2, 1991
Appl. No.:
7/801140
Inventors:
Joseph A. Abys - Warren NJ
Igor V. Kadija - Ridgewood NJ
Joseph J. Maisano - Denville NJ
Assignee:
AT&T Bell Laboratories - Murray Hill NJ
International Classification:
C25B 100
US Classification:
204 96
Abstract:
This invention embodies a process for synthesizing electrodialythically palladium ammine hydroxide for use in palladium plating baths. The electrodialysis takes place in a cell with a catholyte, a product and an anolyte compartments which are divided by a fluorinated anion permselective membranes. Catholyte solution readily supplies OH ions, raw starting solution contains palladium ammine ions and anions capable of migrating into the anolyte compartment, and anolyte solution readily absorbs the anions from the raw solution. Electrodes, placed in the outer compartments, are placed no more than 5 cm apart. The process is conducted with current densities of 500 ASF or less, with 200 ASF being preferable, with current efficiencies of 50 to 90 percent, with 60-80 percent being preferable, and at bath temperatures of from above freezing to 40. degree. C. , with 25. degree. -40. degree. C. being preferable. The electrodialysis results in a stable palladium diammine hydroxide solution containing a small fraction of starting palladium diammine compound, such as palladium diammine chloride, making the final solution readily useable either as a replenishing or a plating solution.

Method And Apparatus For Manufacturing Interconnects With Fine Lines And Spacing

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US Patent:
50247352, Jun 18, 1991
Filed:
Feb 15, 1989
Appl. No.:
7/311212
Inventors:
Igor V. Kadija - Ridgewood NJ
International Classification:
C25D 502
C25F 314
US Classification:
204 15
Abstract:
Metallic or non-metallic wires or bristles are attached to a hollow, cylindrical core. The wires or fibers are quite fine in diameter. Space is provided in the core in the shape of perforations for the transfer of electrolyte, which is fed from the hollow inner portion of the cylinder, along the fibers, to the copper substrate on an imaged substrate. Electrical or non-electrical sources are employed. The wires may be electrically connected through the metal cylinder to the positive pole (anode) of the DC power source. The non-conductive fibers make direct contact with the metal to be etched. In the electrical device within the hollow cylinder but separated from the cylinder is positioned a perforated or mesh copper, which is connected electrically to the negative pole (cathode) of the DC power supply. A cell is now made between the copper laminate and the perforated copper inside the cylinder. Copper from the laminate (anode) is removed and deposited on the perforated copper (cathode).
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Igor V Kadija from Raleigh, NC, age ~84 Get Report