Ichiro Kodaka

7044697, May 16, 2006

Mar 10, 2004

10/798197

Ichiro Kodaka - Berkeley CA, US
Takuya Nagamine - Tokyo, JP
Toshihiro Kobayashi - Tokyo, JP

MIPOX International Corporation - Hayward CA

B23D 13/00

409304, 409308, 407113

A cutting tool for simultaneously carrying out a facing operation and a grooving operation on a target surface has a facing part and a grooving part that protrudes from and may be integrally formed with the facing part. The facing part has a facing surface for carrying out the facing operation and the grooving part has a grooving surface and is for cutting a groove of a specified depth and width on the target surface simultaneously as the cutting tool is moved in a specified forward direction parallel to the target surface. The dimensions of the facing and grooving parts, the roughness of their surfaces, the angles of their cutting edges and the sloping angles of the facing and grooving surfaces with respect to the forward direction are each required to be within a specified range. Where the grooving part protrudes from the facing part, the corners at which the facing surface joins the side surfaces of the grooving part are formed such that each corner has a beveled surface portion.

7160413, Jan 9, 2007

Jan 9, 2004

10/754381

Ichiro Kodaka - Berkeley CA, US
Charles Sischile - Alameda CA, US
Alvin Timbang - Union City CA, US
Margarita Castillo - Union City CA, US
Claughton Miller - San Carlos CA, US

Mipox International Corporation - Hayward CA

B24D 11/00

156289, 451533, 451538

A device and method for laminating CMP pads includes supporting the CMP pad with a board having material compositions similar to the CMP pad. By thus supporting the CMP pad during lamination, there is less likelihood of damage to the CMP pad and better adhesion from lamination. In particular, the CMP pad materials are laminated while in contact with a first board that may have a recess to accept the CMP pad. The pad has dimensions that are equal to or greater than the pad material. In an alternative embodiment, a board is provided on the opposite side of the CMP pad for lamination.

7238097, Jul 3, 2007

Dec 10, 2004

11/010199

Hisatomo Ohno - Tokyo, JP
Toshihiro Izumi - Tokyo, JP
Mitsuru Saito - Tokyo, JP
Takuya Nagamine - Tokyo, JP
Claughton Miller - Hayward CA, US
Ichiro Kodaka - Hayward CA, US

NIHON Microcoating Co., Ltd. - Tokyo

B24D 11/00

451527, 451530, 451533

A transparent pad having a polishing surface with an average surface roughness of 5 μm or less is used as a polishing pad. An indentation is formed on the back surface of the transparent pad such that its rate of light transmission is locally changed. The transparent pad has a rate of light transmission equal to or greater than 10% or preferably 30% for light of at least one wavelength in the range of 350 nm–900 nm.

20070023560, Feb 1, 2007

Jul 26, 2005

11/190669

Ichiro Kodaka - Berkeley CA, US
Vuong Bang - Milpitas CA, US
Alvin Timbang - Union City CA, US

B65H 35/02
B08B 7/00

242525000, 242530000, 015102000, 134009000

Buff tapes for smoothing the surface of a magnetic disk substrate are produced by using a slitting device to receive a mother tape having a backing film with a polishing layer formed on its surface and slitting it longitudinally. A guide roller is provided for guiding these buff tapes from the slitting device to take-up rollers for individually winding up the buff tapes and a compression roller serves to compress the buff tapes onto this guide roller with a wiping tape in between to contact the buff tapes from the side of the backing film. The wiping tape is advanced while contacting the buff tapes at a specified depending on the feed speed of the mother tape and the compressive pressure between the guide roller and the compression roller such that 50% to 80% of loose particles of 0.3 μm-5 μm in size can be removed.