US Patent:
20030119963, Jun 26, 2003
Inventors:
Satoru Nippa - Niihama-shi, JP
Hiroyoshi Nakajima - State College PA, US
Kenji Atarashi - Sodegaura-shi, JP
International Classification:
C08K003/10
Abstract:
A resin composition, wherein the composition contains a thermoplastic resin and an aluminum-containing inorganic compound; the thermoplastic resin and the aluminum-containing inorganic compound form a parent phase and a dispersed phase, respectively; and the following inequality (1) is satisfied, in which a wall-to-wall distance of the dispersed phases and a content of the aluminum-containing inorganic compound based on the weight of the resin composition are taken as d (m) and (% by weight), respectively; is produced by melt-blending a thermoplastic resin with an aluminum-containing inorganic compound powder having a BET specific surface area of from 30 to 500 m/g, a maximum particle diameter of not more than 20 m, and a pore volume of pores having a radius of from 50 to 1000 nm measured by a mercury porosimetry of not less than 0.3 cm/g.