Inventors:
Deviprasad Malladi - Campbell CA
Shahid Ansari - Milpitas CA
Hanxi Chen - San Jose CA
Bidyut Sen - Milpitas CA
Steven Boyle - Santa Clara CA
Assignee:
Sun Microsystems, Inc. - Palo Alto CA
International Classification:
G01R 3126
Abstract:
A method and system providing for electrical testing of an integrated semiconductor substrate having at least two signal processing layers. The substrate may be provided with a protective layer of plastic, silicon, silicon oxide, silicon nitride or the like. A selected region of one substrate layer to be tested electrically is exposed by etching or otherwise forming a controllably small aperture any overlying substrate layer(s) away to expos at least one selected circuit trace in the selected region and applying a selected electrical signal to the trace. Optionally, a second aperture, spaced apart from the first aperture, can be formed to expose a second selected circuit trace so that propagation of a signal in one or more substrate circuits can be tested. The aperture cross-sectional shapes may be linear or curvilinear polygons or other suitable shapes.